CVD APCVD Atmospheric Dressure CVD LPCVD Low Pressure

CVD 공정의 유형들 APCVD (Atmospheric Dressure CVD) LPCVD (Low Pressure CVD) UHVCVD (Ultra-high vaccum CVD) 초고진공화 학기상증착 DLICVD (Direct liquid injection CVD) AACVD (Aerosol-assisted CVD) MPCVD (Microwave Plasma CVD) PECVD (Plasma Enhanced CVD) ALCVD (Atomic Layer CVD)

CHIP Package 종류와 두께

LEAD 삽입형 IC Package (1) 명칭 : DIP LEAD PITCH : 2. 54 mm 100 mil 명칭 : SH-DIP LEAD PITCH : 1. 778 mm 70 mil

LEAD 삽입형 IC Package (2) 명칭 : ZIP LEAD PITCH : 2. 54 mm 100 mil 명칭 : PGA LEAD PITCH : 2. 54 mm 100 mil

표면실장형 IC Package (1) 명칭 : SOP LEAD PITCH : 1. 27 mm, 1. 00 mm 0. 80 mm, 0. 65 mm 0. 5 mm 명칭 : QFP LEAD PITCH : 1. 00 mm, 0. 8 mm 0. 65 mm, 0. 5 mm 0. 4 mm

표면실장형 IC Package (2) 명칭 : SOJ LEAD PITCH : 1. 27 mm 50 mil 명칭 : PLCC LEAD PITCH : 1. 27 mm 50 mil

표면실장형 IC Package (3) 명칭 : LCC LEAD PITCH : 1. 27 mm 50 mil 명칭 : BGA LEAD PITCH : 1. 27 mm 50 mil

BGA SPEC

SOJ SPEC 1

SOJ SPEC 2

Evolution of Chip Packages

Wafer thinning and sawing

Die Thickness Roadmap

Die Thickness Trends

fc. BGA Package Configurations

MCP Packaging Technology Trend