Cooling Mechatronics Schedule Mechatronics Task Force 26 nov02

Cooling Mechatronics Schedule Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 1

Presentation • • • Development plan Milestones Tasks to be completed Schedule Base line Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 2

Development plan • SM 0 and SM 1 as prototype to go in H 4 beam • SM 2 and SM 3 as pre serial production • Production begins at SM 4 • SM 0 and SM 1 probably need retrofitting Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 3

Milestones • SM 0 has to be ready for H 4 beginning of July 03 – SM 0 cooling has to be available beginning of May • Serial calibration from March 2004 Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 4

Tasks • Preliminary design – Aim: study of the cooling mechanics principle • Choice of the principle of the cooling: – Performed during 26 November Task Force – Agreement about cooling principle • Prototype drawings – Duration: 2 months – Drawings for material to be installed in SM 0 for test beam in 2003 Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 5

Tasks (2) • SM 0 and SM 1 manufacturing – Duration: 3 months – 2 SM in order to be able to mount a second electronic solution when 1 SM is in test beam • Prototype mounting and tests – 1 month for some adjustments – Tests: • Leak tests • Flow equilibrium between modules • Thermal performances Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 6

Tasks (3) • Serial drawings – Ended after prototype mounting and tests – some minor modification can be made during tendering • Market survey – Cooling bars manufacturing is a special technique: it will probably require a market survey – Has to be launched as soon as possible – Typically 6 months duration Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 7

Tasks (4) • Tendering and ordering – Typically 2 months • Pre serial manufacturing – 2 SM: SM 2 and SM 3 – Needs the mould development (2 months at least) – Pre serial production needed at least for mechanical fit checks. – After the mounting, drawings corrections (if needed) then agreement about the serial production Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 8

Schedule Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 9

Base line • Information coming from the electronic group have been used as the base line in the design. This information becomes requirements now to the electronic. Changing any base line data will impact the cooling mechanic schedule • Some information is still needed to finalize the design. Answers are urgent in order to avoid delays. Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 10

Requirements • VFE boards: – Maximum card dimensions (card nose excluded) 114 mm x 78 mm – Card nose width < 80 mm (to MB or to FE) – Maximum component height: 2, 3 mm – Possible to fix the card to housing with 6 M 3 screws (at least 2 very closed to card nose to MB) – 8 Watt dissipation on the card Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 11

Requirements • LVR board – Same dimensions as VFE cards for the PCB – Same possibility to fix it to the housing • Mother board – – Modularity: 1 per trigger tower Maximum size 104 x 110 mm 2 Self sustaining Connector to VFE cards compatible with 0, 3 mm position error and insertion movement of the VFE card – Connector positioning on the card +/- 0, 05 mm Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 12

Requirement • FE board – In an horizontal plane – 3 Watt dissipation (for 1 trigger tower) – Connector to VFE cards compatible with 0, 3 mm position error of the VFE card – Connector positioning on the card +/- 0, 05 mm Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 13

Missing information • Mother board design – Type of connection between mother board and APD connectors – Maximum length of this connection – Thickness of the board: are there passive components to take into account? – Type of connectors, guiding needed or provided by the connector Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 14

Missing information • VFE board – Kind of connector on VFE board – Fixation holes location – Layout of the components • LVR board – Same information as for VFE board – Connection to the bus bar – Connection to the FE board Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 15

Missing information • FE board – Type of connection to VFE board – Maximal dimensions – Possibility to cool it down – Mechanical fixation • Token ring board – Not yet taken into account in the design – No information available Mechatronics Task Force, 26 -nov-02 Olivier Teller, CERN EP-CMA 16