Constructional requirements from ITkStrips Andy Blue on behalf
Constructional requirements from ITk-Strips Andy Blue, on behalf of ITK strips community
Contents • • Breakdown of components for Strips Upgrade Max numbers of parts in the Build What do we want to record? Suggestions o Visual Inspection Photos o Integration with RFi. D & Barcodes • Naming Conventions • Summary Meeting on ITk production databases 2
Strip Tracker Components • Attempted to contact as many as possible to get outline/ideas for the strip community’s plans for production numbers & database preferences o Based on LOI layout • 5 layers, stubs, etc. o However LOI is “worst case” scenario in terms of no of parts • All other cases would see reduction in part numbers o List is also incomplete • Other necessary components for the build • GBT’s, Fibre optics, DCDC/SP boards, HV switches etc. o And does not detail 1 MHz Readout designs • New hybrids, multiplexing chips…. Meeting on ITk production databases 3
Strip Tracker ‘Parts’ Very simplistic outline for just now Stave/ Petal Cores Tapes Eos Staves/Petal s Sensors ABC ASICs HCCs Modules Hybrids Will work this way Panels Meeting on ITk production databases 4
Strip Tracker Components From LOI CERN-LHCC-2012 -022 ; LHCC-I-023 Meeting on ITk production databases 5
Strip Tracker Components HCC Multiplexing ASIC Sensor Hybrid LV Powering Board (Liverpool, RAL & BNL) ABC ASIC Barrel Module: Composed of 2 Hybrids and 1 sensor Each Hybrid has • 10 x ABC 130 readout chips • 1 x HCC multiplexing chip • 1 x LV Powering board Meeting on ITk production databases 6
Strip Tracker Components R 5 module H 0 S 0 R 4 module H 0 S 0 R 3 module H 2 S 0 R 2 module S 1 H 1 S 1 H 3 S 1 R 0 module H 1 H 0 H 1 R 1 module H 0 H 1 Petal: Composed of 5 different modules with 13 Hybrid variants 7 -12 x ABC 130 readout chips /Hybrid • ~1 x HCC multiplexing chi/Hybrid • ~1 x LV Powering board Meeting on ITk production databases 7
Assumptions • Item ‘Pass’ Yields (%) Stave / Petal Mounting 100% + 1% Spare Module Production 95 Hybrid Production 95 ABC ASIC Probing 90 HCC ASIC Probing 90 Sensors 95 I will now go through the estimated numbers for each component in the build Meeting on ITk production databases 8
Numbers: Barrel Short Strip Staves Long Strip Staves Stubs Total (After yield) Totals No Staves 216 256 128 600 606 Modules /Stave(Stub) 26 26 4 No Modules 5616 6656 512 12784 13557 Hybrids/Module 2 1 1 No. Hybrids 11232 6656 512 18400 20489 No. ABC ASICs 112320 66560 5120 18400 0 225377 No. HCCs 11232 5616 512 18400 20489 No. DCDC/SP Boards 5616 6656 512 12784 13357 Meeting on ITk production databases 9
Numbers: Endcap # Modules Total After Yield Total R 5 Modules 1792 1810 R 4 Modules 1792 1810 R 3 Modules 1792 1810 R 2 Modules 896 905 R 1 Modules 896 905 R 0 Modules 896 905 Total 8064 8552 Endcap # Disks 14 # Petals/Disk 32 # Petals 448 # Modules/Both sides of Petal 18 # Modules 8064 R 5 R 4 R 3 R 2 R 1 R 0 10
Numbers: Endcap R 1 to R 4 Hybrids 105 % Hybrids ABC ASICs/Hybrid #ABC ASICs For 100% #ABC ASICs for 105% R 5 H 0 896 941 9 8145 8553 R 5 H 1 896 941 9 8145 8553 R 4 H 0 896 941 8 7240 7602 R 4 H 1 896 941 8 7240 7602 R 3 H 0 896 941 7 6335 6652 R 3 H 1 896 941 7 6335 6652 R 3 H 2 896 941 7 6335 6652 R 3 H 3 896 941 7 6335 6652 R 2 H 0 896 941 12 10860 11403 R 1 H 0 896 941 11 9955 10453 R 1 H 1 896 941 11 9955 10453 R 0 H 0 896 941 8 7240 7602 R 0 H 1 896 941 9 8145 8553 Total 11648 12233 113 102265 107382 11
And Finally Endcap Totals After Yield Totals Barrel Totals After Yield Totals Modules 8064 8552 Modules 12784 13557 Hybrids 11648 12223 Hybrids 18400 20489 ABC ASICs 107832 112752 ABC ASICs 184000 225377 HCCs 11648 12223 HCCs 18400 20489 • Will use these numbers as the basis for the following build numbers • Of course these numbers will change once the yield estimates become more fixed Meeting on ITk production databases 12
What do we want to record? –Stave/Petal Core Item Data Type • Lot number from manufacturer • Density • Lot number • Pressure test results • Flow tests/impedance Foam Block Pipe Epoxy Lot number Facings Bus Tape Comments • • excel or text file, photos in jpeg Resistance measurements in excel Honeycomb Meeting on ITk production databases • • Lot number Pre-preg number • • Survey results Electrical tests Lot number from manufacturer 13
What do we want to record? –Stave/Petal Tests Item Data Type Comments QC results • • • excel file, plots excel file • • • Component weights Flatness/thickness Bending Statistics Thermal Performance Delamination Tests Petal/Stave electrical test • . dat , eps • • • 3 point Gain Threshold Noise Occupancy Meeting on ITk production databases 14
What do we want to record? - Modules Item Data Type Hybrids . dat , eps ABC ASICs Wafer map, . dat, . eps Sensors . dat • • • I-V C-V bow for some Modules . dat , eps • • 3 Point Gain Threshold Noise Occupancy # dead, masked channels survey HCC Wafer map, . dat, . eps Bustape ? ? Meeting on ITk production databases Comments • 3 Point Gain • Threshold • Noise Occupancy • # dead, masked channels Wafer tests Data from tape testing 15
What do we want to record? • Currently. eps/. ps files produced from hybrids and module scans are ~1. 2 Mb • Strobe delay + Threshold scan + Noise Occupancy scan ~= 4 Mb/object o ~54 k Objects* = ~ 216 GB *this is just hybrids and modules and doesn’t include dat/txt files Meeting on ITk production databases 16
What do we want to record? • We would like to trace "service" material o o Glues Jigs Test frames Test setups • From EC database experience “We were able to trace the number of components available, where we could expect shortage of them, etc. ” “This saved us in a couple of occasions. It also helped to monitor the learning slope of the production and to detect weak points in the chain…” Meeting on ITk production databases 17
Visual Inspection - Photos • Has been a request to have the ability to add photos o Trace defects/visual inspection stage through Sensor -> Hybrid -> Module -> Stave/Petal assembly • ~ 54 k objects (hybrids + modules) x 3 photos = 150 k photos o This an issue? Meeting on ITk production databases 18
RFi. D - Barcodes • Strips community have began to integrate RFi. Ds onto hybrids. • The current design for the ABC 130 Barrel Hybrids use LXMS 31 ACNA-010 o EPC memory (Electronic Product Code): 240 bit unique device ID o User memory: 512 bits o TID: 64 bits, unique address assigned by the IC manufacturer • Scanning of RFi. Ds could also allow tracing of components throughout the build project • Beginning to think about linking RFi. D IDs of hybrids to any future database naming conventions Meeting on ITk production databases 19
Naming Conventions • Still at early stages for Barrel o More developed for Endcap due to greater number of Hybrids/Modules (next slide) • So far only gone as far as convention for actual objects o Not where it was made/location etc. Meeting on ITk production databases 20
Naming Conventions For EC, numbering scheme to be implemented, e. g. R 0 H 1 S 0 (Ring 0, Hybrid 1, Sensor 0). R 5 module H 0 S 0 R 4 module H 0 S 0 R 3 module H 2 S 0 R 2 module H 1 S 1 Meeting on ITk production databases H 3 S 1 R 0 module H 1 H 0 S 1 R 1 module H 0 H 1 21
Summary • Hopefully we have been able to gather information that will help for o Components o Max part numbers o Input to database • Developing all the time • We have (at present ) have no input regarding “type of database” o Feedback seems to be the previous SCT database was very good Meeting on ITk production databases 22
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