Construction and Test of the First Belle II

Construction and Test of the First Belle II SVD Ladder Implementing the Origami Chip-on-Sensor Design TWEPP 2015, C. Irmler (HEPHY Vienna) TWEPP 2015, Lisbon 29 Sept. 2015

Outline • • 29 Sept. 2015 Introduction Assembly Procedure Precision & Performance Summary TWEPP 2015, C. Irmler (HEPHY Vienna) 2

Outline • • 29 Sept. 2015 Introduction Assembly Procedure Precision & Performance Summary TWEPP 2015, C. Irmler (HEPHY Vienna) 3

Super. KEKB / Belle II • Super. KEKB: e-/e+ collider at KEK, Tsukuba, Japan B factory • 40 -fold increase in peak luminosity to 8 1035 cm-2 s-1 1 1010 BB / year • 50 -fold increase in integrated luminosity until 2023 w. r. t. Belle • Refurbishment of accelerator and detector required Nano-beams with cross-sections of ~10 µm x 60 nm § 10 mm radius beam pipe at interaction region Target of Super. KEKB / Belle II e- 7 Ge. V 2. 6 A Peak luminosity [cm-2 s-1] Integrated luminosity [ab-1] § e+ 4 Ge. V 3. 6 A Calendar year 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 4

Belle II Silicon Vertex Detector Outer CF shell Carbon fiber (CF) cone End flange End rings Ladders Pixel Detector (PXD) Beam pipe (inside SVD individual sub-detector) • • 29 Sept. 2015 Belle II Vertex Detector (VXD) = Silicon Vertex Detector (SVD) + Pixel Detector (PXD) Four layers of double sided silicon strip detectors (made from 6” wafers) Radii of SVD layers: 38 / 80 / 115 / 140 mm 2, 3, 4 or 5 sensors per ladder TWEPP 2015, C. Irmler (HEPHY Vienna) 5

SVD Ladder Design L 6 Ladder FWD module FWD Origami +z L 5 Ladder Origami ce BWD Origami -z L 4 Ladder BWD module L 3 Ladder Cooling pipe FWD module Cooling pipe BWD module 29 Sept. 2015 Cooling pipe TWEPP 2015, C. Irmler (HEPHY Vienna) 6

The Origami Chip-on-Sensor Concept • • • CF reinforced ribs 6” DSSD 1 mm Airex® sheet as isolator 3 -layer flex circuit Thinned APV 25 chips (100µm) Connection to Strips: – Top side: pitch adapter (PA 0) – Bottom side: wrapped pitch adapters (PA 1, PA 2) • n-side Cooling: – CO 2 cooling – Single cooling pipe • p-side • Trade-off between material budget & SNR 0. 60% X 0 (averaged) Tail part of Origami flex not shown in fig. a) 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 7

SVD Ladder Design (Layer 5) CO c 2 lips Origam Origa SFW 1 mm i –z mi ce Airex foam DSS Ds CF ri bs • • • 29 Sept. 2015 SBW 3 rectangular + 1 trapezoidal DSSDs SFW, SBW: forward, backward sub-assemblies (INFN Pisa) Central sensors read out by Origami hybrids TWEPP 2015, C. Irmler (HEPHY Vienna) 8

The Evolution of the Origami Design 2008 2009 • • 2008: Introduction of concept 2009: Feasibility shown with 4” DSSD module 2010: First full-size module with 6” DSSD 2011: Re-design to fit mechanical requirements of Belle II SVD ladders • 2012: Assembly of first 2 -DSSD module 2010 29 Sept. 2015 2012 TWEPP 2015, C. Irmler (HEPHY Vienna) 9

2013 - 2015 • 2013 -2014: – Development of a reliable assembly procedure for full SVD ladders – Production of required jigs – Design production and tuning of ladder components – Gluing and wire bonding studies – Assembly of first mechanical prototype ladders BW sub-assembly mech. prototype, INFN Pisa, Oct. 2014 L 4 mech. prototype, TIFR, Feb. 2015 L 5 mech. prototype, HEPHY Vienna, Nov. 2014 • 2015: – Assembly and test of first electrically functional ladders L 6 mech. prototype Kavli IPMU, Oct. 2014 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 10

Outline • • 29 Sept. 2015 Introduction Assembly Procedure Precision & Performance Summary TWEPP 2015, C. Irmler (HEPHY Vienna) 11

Layer 5 Ladder Assembly • Ladder assembly procedure shown by the example of a layer 5 ladder • ~25 vacuum jigs required • Complex procedure L 5 ladder structure – – – Assembly of mechanical structure (ribs) Precise pitch adapter gluing Sensor alignment Origami flex gluing PA wrapping and gluing Wire bonding (~3000 connections per sensor) – Attaching sub-assemblies to ribs – Electrical testing • ~15 working days for one L 5 ladder 29 Sept. 2015 Selection of L 5 assembly jigs TWEPP 2015, C. Irmler (HEPHY Vienna) 12

Sensor + Pitch Adapter Assembly (SPA 5) Sub Process DSSD pre-alignment Applying glue onto pitch adapter OS 5 PA 1 / PA 2 bending 29 Sept. 2015 Wire bonding TWEPP 2015, C. Irmler (HEPHY Vienna) SPA 5 stored on Gel-Pak® 13

Rib-Assembly (RS 5) Sub Process 1 mm pin 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 14

DSSD Alignment Placing DSSDs onto assembly bench Sub Process Alignment of DSSDs 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 15

Half-Ladder Assembly Sub Process RS 5 on assembly base BW sub-assembly gluing FW sub-assembly gluing Completed half-ladder 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 16

Origami Sub-Assembly – Hybrids Gluing Sub Process 1. 2. 3. 4. Airex gluing Origami ce gluing Origami –z gluing Wire bonding n-side OCE already glued onto sensor, applying glue onto O-Z Attaching O-Z Origami flexes glued onto sensors, n-side bonded 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 17

Origami Sub-Assembly – PA Wrapping Sub Process Glue applied to PA, micro positioner equipped with vacuum nozzles used to bend and glue pitch adapters • • Wire bonding 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) Glued pitch adapter Uniform glue spread required for wire bonding 18

Ladder Assembly Part 2 Sub Process Half-ladder and Origami sub-assembly before final steps Applying glue onto BW sensor and ribs 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) Attaching OS 5 with vertical stages 19

Final L 5 Ladder L 5. 001 in transport box Sub Process CO 2 pipe clip bond wires • So far completed L 5 ladders: – Class C: L 5. 902, L 5. 904 • Precise mechanical prototypes – Class B: L 5. 903, L 5. 001 • Electrically functional, but DSSD with some defects used. 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 20

Outline • • 29 Sept. 2015 Introduction Assembly Procedure Precision & Performance Summary TWEPP 2015, C. Irmler (HEPHY Vienna) 21

Mechanical Survey of Ladders • F-marks at DSSD corners – Used for alignment – Measured on final ladder • • Aimed precision: 100µm Measurement done on CMM Optical measurement Sensor positions: BW, -Z, CE, FW FW CE -Z BW L 5. 903 mounted onto beam test support with cooling pipe attached 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 22

Coordinate System for Ladder Survey BW -Z CE FW 23 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna)

Mechanical Survey Results L 5. 904 delta x vs. x 150 delta y vs. x 150 100 50 0 0 100 200 300 400 500 600 -50 CE -Z BW -100 hg -150 FW x [mm] delta y [µm] delta x [µm] 100 50 0 0 200 300 400 500 600 x [mm] -100 fe 100 -50 BW hg -150 delta z vs. x -Z CE FW fe h 150 g delta z [µm] 100 f 50 0 0 100 200 300 400 500 x [mm] -50 -100 600 BW -150 29 Sept. 2015 -Z hg CE fe FW e Average displacement: • L 5. 904: Precise mech. prototype • Average of 4 measurements • Better than ± 100µm in all directions TWEPP 2015, C. Irmler (HEPHY Vienna) 24

Electrical Performance of L 5. 903 • Electrical tests of L 5. 903 – Space for 90 Sr source (optional) 90 Sr source test in lab – EMC measurements in Zaragoza, Spain see R. Thalmeier – Beam test at CERN SPS • Test setup – Ladder mounted on moveable stage of ladder test box – Test box is used for both source and beam tests 29 Sept. 2015 scintillator bea m L 5. 903 mounted on moveable stage inside of ladder test box TWEPP 2015, C. Irmler (HEPHY Vienna) 25

L 5. 903 Source Test: Noise & SNR p-side BW -Z CE FW 29 Sept. 2015 n-side cw = 1 cw = 2 cw ≥ 3 cw = 1 cw = 2 cw ≥ 3 TWEPP 2015, C. Irmler (HEPHY 26

L 5. 903 Source Test: Conclusion • All noise patterns look as expected – p-side: ~2. 5 ADC – n-side: ~2. 1 ADC • SNR in the expected range – cluster width = 2: p-side = ~15 n-side = ~18 • Operating the full ladder simultaneously works as good as individual parts Ladder structure visible in hit maps 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 27

L 5. 903: Beam Test • 3. -14. 6. 2015 @ CERN SPS • Setup and device under test (DUT) – L 5. 903 mounted into test box – „Pseudo-telescope“ with single sensor modules in front and back beam – CO 2 cooling • Beam: 120 Ge. V/c DUT: L 5. 903 Modules at back side 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 28

pr y r na i m i l e L 5. 903 Beam Test SNR p-side FW p-side CE n-side p-side -Z BW n-side • Mean noise: 2. 7 ADC on p-side and 2. 5 ADC on n-side. • All sensors performed as expected • Analysis ongoing 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 29

L 5. 903 Beam. Test: Conclusion • All noise figures as expected • SNR in the expected range clw=2 Hit maps -Z p-side w/o cooling CO 2 cooling 20°C n-side 14 15 p-side 12 12, 5 • Slightly better SNR with cooling • Analysis of beam test data ongoing n-side • Full L 5. 903 ladder works as good as single sensor modules 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 30

Outline • • 29 Sept. 2015 Introduction Assembly Procedure Precision & Performance Summary TWEPP 2015, C. Irmler (HEPHY Vienna) 31

Summary • Procedure to build Belle II SVD ladders by utilizing the Origami chip-on-sensor concept • Mechanical precision proven by prototype ladders • First electrically working L 5 ladders assembled • Good electrical performance confirmed with both source measurements and beam test 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 32

Have you seen our ladder? Thank You for Your Attention! 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 33

Backup Slides 29 Sept. 2015 TWEPP 2015, C. Irmler (HEPHY Vienna) 34

Assembly Sites • • • L 3 ladders: L 4 ladders: L 5 ladders: L 6 ladders: FWD/BWD modules: 29 Sept. 2015 Univ. of Melbourne TIFR (@ IPMU) HEPHY Vienna Kavli IPMU INFN Pisa TWEPP 2015, C. Irmler (HEPHY Vienna) 35

Origami Hybrid Gluing • • Alignment of Origami flex by reference holes Origami hybrid is picked up with gluing jig Glue is applied onto Origami flex is glued onto sensor by placing the Origami jig onto the assembly bench, guided by precision pins alignment jig 29 Sept. 2015 gluing jig TWEPP 2015, C. Irmler (HEPHY 36

Mechanical Survey Results L 5. 001 delta x vs. x 150 delta y vs. x 100 0 0 100 200 300 400 500 -50 600 x [mm] -100 CE -Z BW hg -150 fe delta z [µm] 0 -100 200 300 400 500 600 x [mm] BW -150 29 Sept. 2015 -Z hg CE fe 100 200 300 FW 400 500 600 x [mm] -50 -Z hg -100 50 0 0 BW 100 -50 0 FW delta z vs. x 150 delta y [µm] delta x [µm] 50 50 CE FW fe Average displacement: • L 5. 001: Latest, electrically functional ladder • Average of 4 measurements • x, y: ± 100µm, z: + ± 100µm • Slightly worse, but same order of precision TWEPP 2015, C. Irmler (HEPHY Vienna) 37

L 5. 903: Beam Test Hit Maps p-side FW p-side CE n-side Data taken without cooling at room temperature. 29 Sept. 2015 p-side -Z BW n-side y r a n i relim p TWEPP 2015, C. Irmler (HEPHY Vienna) 38