Computer System Hardware Motherboard Components Computer Engineering Level
Computer System Hardware Motherboard Components Computer Engineering Level 1 Objective 101. 02 Copyright Explor. Net™
Motherboard Components Objective 101. 02 Form Factors Memory and Bus Slots Course Weight: 4%* *4% of the A+ exam questions come from this section; however, more than 4% of class time may be spent covering this most fundamental objective.
Motherboard Components Objective 101. 02 Explain motherboard components, types and features Essential Question: What are the differences in the various types of PC motherboards?
Motherboard Components Objective 101. 02 Explain motherboard components, types and features. In this objective, we will learn: üHow to classify power supplies types and characteristics.
Motherboard Components Objective 101. 02 Explain motherboard components, types and features. Form Factors • ATX/BTX • Micro ATX • NLX
A photo of a micro. ATX motherboard with an AMD Athlon 2. 10 Ghz processor in a Socket 462 slot. It has a VIA VT 8235 Chipset. It has bad capacitors. micro. ATX
Motherboards Now let’s look at some pictures of motherboards. http: //computer. howstuffworks. com/computerhardware-pictures. htm
Activities Open the following documents § § Worksheet – Motherboard Form Factors Handout – Motherboard Form Factors
Activities Now Open the following documents § Activity 1 – Motherboard Form Factors under Objective 101. 02
Activities Then let’s work on vocabulary. § § Look up the terms Email to me when complete.
Things on the Mother. Board Objective 101. 02
Mother. Board § Interfaces – another word for connects § Everything inside and outside of a computer interfaces with the MB. § The Circuitry makes up the main circuit board including all the chips and lots installed on the board. § Solder – how the permanent individual pieces connect to the MB.
Mother. Board § Motherboard components – the pieces soldered to the MB § Traces – what connects each soldered piece to one another. § Busses – traces work together to make up groups of electronic circuits between components. § Bus architectures – carry data throughout the system (Ex AGP, PCIe, etc)
Mother. Board Components § CPU Sockets § § § Integrated – physically part of the MB CPUs must be matched by shape and voltage Zero Insertion Force (ZIF) sockets § Designed with a lever for ease of installation § Three types § Slot § Pin grid array (PGA) § Land grid array (LGR)
Mother. Board Components Pin grid array (PGA) Slot Land grid array (LGR)
Mother. Board Components Objective 101. 02 Explain motherboard components, types and features. Memory Slots • RIMM • SODIMM • DIMM
DIMM § DIMM - Dual inline memory module – RAM modules. (memory) § SIMM – single inline memory module – no longer produced.
Hard Drive, Optical Drive, and Floppy Drive Controllers
Motherboard Components Objective 101. 02 Explain motherboard components, types and features. PATA • IDE • EIDE SATA, e. SATA
PATA § Parallel Advanced Technology Attachment (PATA) is an IDE (Integrated Drive Electronics) standard for connecting storage devices like hard drives and optical drives to the motherboard. § PATA generally refers to the types of cables and connections that follow this standard.
PATA (continued) § PATA cables are long, flat cables with 40 pin connectors (in a 20 x 2 matrix) on either side of the cable. One end plugs into a port on the motherboard, usually labeled IDE, and the other into the back of a storage device like a hard drive.
PATA (continued) § PATA cables come in 40 -wire or 80 -wire designs. § Most modern storage devices require the use of the more capable 80 -wire PATA cable to meet certain speed requirements. § Both types of PATA cables have 40 -pins § The connectors on an 80 -wire PATA cable will be black, gray and blue while the connectors on a 40 wire cable will only be black.
EIDE § EIDE (Enhanced Integrated Drive Electronics) § A new version of IDE which is 3 -4 times faster than the older version § Sometimes called Fast ATA or Fast IDE § Supports speeds up to 8. 4 gb § Has replaced some SCSI due to lower cost
SATA § Serial Advanced Technology Attachment § reduced cable-bulk and cost § hot swapping § faster data transfer
e. SATA § Up to 6 times faster than USB 2. 0 or 1394 § Robust and userfriendly external connection § High performance, costeffective expansion storage § Up to 2 meter shielded cables and connectors
Motherboard Components Objective 101. 02 Explain motherboard components, types and features. . I/O interfaces • Sound & Video • USB 1. 1 & 2. 0 • Serial & Parallel • IEEE 1394 / Firewire • NIC & Modem • PS/2
Expansion Slots Objective 101. 02 Explain motherboard components, types and features. Bus Slots • • • PCI AGP PCIe AMR CNR PCMCIA
PCI Slots § Peripheral Component Interconnect § 32 -Bit PCI boards can be used in 64 -bit slots. § Standard PCI is 32 bit and operates at 33 MHz
AGP Slot § Accelerated Graphics Port § a high-speed point-topoint channel for attaching a video card § primarily to assist in the acceleration of 3 D computer graphics. § Since 2004, AGP has been slowly phased out in favor of PCI Express
PCIe
PCIe § Speeds up the data flow. § Uses serial technology which links data lines in series. This enables data to travel along different pathways depending on where the signal coming in from.
AMR § Audio/Modem Riser is a specification developed by Intel § Analog I/O audio functions of modem which converts back and forth from analog to digital § The small board is called a riser because it rises above the motherboard rather than laying flatly on it
CNR § Communications and Network Riser § The CNR slot is located on the side of the motherboard, near the last PCI slot.
PCMCIA § Personal Computer Memory Card International Association § Used in laptops
Activities § Now Open the following documents § § Worksheet – Motherboard Components under Objective 101. 02 You will need to use the Motherboard Components handout.
Chipsets § Integrated Circuits (IC) § Northbridge IC Chip Set § controls high speed communication between § § CPU and RAM AGP and PCIe expansion devices
Chipsets § Integrated Circuit § Southbridge IC Chip Set § controls communication § § § Floppy drives, hard drives Optical drives Parallel, serial, keyboard and mouse ports CMOS
Activities Now Open the following documents: § § Worksheet – Chipsets under Objective 101. 02 You will need to use the Chipsets handout
Activities Now open and work on the following activity: § Motherboard ID Exercise #1
Activities Now open and work on the following activity: § Motherboard ID Exercise #2
Motherboard Components Objective 101. 02 Explain motherboard components, types and features. BIOS / CMOS / Firmware • POST • CMOS battery
Activities Now open and work on the following activity: § Backplane ID Exercise
Motherboard Components Objective 101. 02 Explain motherboard components, types and features. Processor Sockets Bus Architecture Contrast RAID (levels 0, 1, 5) Chipsets Riser Card / Daughterboard
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