Company Profile Leader of Microcontroller Technology A Fabless
Company Profile Leader of Microcontroller Technology A Fabless Semiconductor Company 18 October, 2012
Contents Overview Production & & QA QA Product Technology » » » » Product Tree • General Purpose MCU • Application Specific » Core Competency » Technology Tree • NVM key Advantage • EMS Countermeasure • Low Power Confidential ABOV @ a Glance Business Domain Annual Sales Growth Sales Portfolio Organization ABOV Network Process Technology Capacity Reliability RMA FMA MCU » Next Product Tree • Next Product Consumption • Protection Function » ABOV Own IP Category » MDS Tool Tree • MDS Tool
ABOV @ a Glance § History • Founded in 2006 as an MCU company after spinning-off from “ • Listed on the KOSDAQ in 2009 • Merged No. 1 Remocon MCU player “Etachips” in 2011 ” § Business area • GP MCUs, AS MCUs, Peripheral ICs § Patents • 69 patents issued (including 17 patents issued from America) § Did you know…? • • Confidential ABOV is No. 1 MCU supplier in Korea ABOV has shipped more than 2 billion pieces to date ABOV has over 20 years of experience in MCU business ABOV was awarded for “Hidden Champion” from Small & Medium Business Administration in 2012 3
Business Domain § Product § Application GP MCU § Memory type • Full flash MCU • Flash MCU • OTP MCU AS MCU § Core type • 32 bit • 8 bit • 4 bit White good Kitchen appliance Remocon § REMO series • Remocon § MIMO series • Touch key, Sensor § VISO series Personal electronics • 3 D glasses , BLU, Voice Small home appliance MCU § ECO series • Battery charger § Custom product • Digital appliance controller • Inverter motor MCU Peripheral IC § § Confidential A/V system Healthcare Building management Segment LED driver IC Segment LCD driver IC Segment VFD driver IC Reset IC 4
Annual Sales Growth Compound annual growth rate : + 21. 0 % (mil US$) 65. 0 2011 Etachips M&A 44. 0 2010 2009 Confidential Global Economy Recession 27. 5 2008 34. 3 2007 30. 3 5
Sales Portfolio 100% Others 300 Customers 80% China 60% HAAN Beauty Dong. Yang E&P Joyoung Haier etc. TTI Cuckoo Midea Daewoo 40% Peripheral IC OTP Flash RF Tech Korea LG Full flash 20% Samsung Sales by region Confidential Sales by customer Sales by memory type 6
Organization CEO Number of employees : 145 R&D (50%) LT SBU AS SBU Operation Admin. Design Domestic / Overseas sales Admin. FAE China sales Marketing Production MDS IP / Layout QA For general purpose For application specific Confidential 7
ABOV Network We have 4 Sales Offices and 4 R&D Entities. ABOV Silicon Inside Finechips Etachips Seoul Ochang Cheongju Osaka Shanghai R&D Entity Test House Sales Office Sales Agency Shenzhen Hongkong Confidential Taiwan 8
Process Technology Memory type Mask OTP 0. 5μm ● ● 0. 35μm ● ● 0. 18μm ● 0. 13μm Confidential Flash Product Full flash ● ● GP MCU AS MCU Peripheral IC ● ● ● ● ● 9
RMA § RMA (Return material analysis) § FIS (Failure information sheet) § Immediately, QA engineers will be allocated RMA input RMA board (Team approach) § Multi function team approach (QA, design, FAE, MDS, production, sales) Initial FA Preliminary report § Basic analysis : trace history, F/T No Detail FA § Trace root cause (within 5 working days) Yes C/A Customer approved Prevent recurrence Confidential Final report § Verification of corrective actions § 8 D report to customer (within 10 working days) § Process change (PCN) / spec revision 10
FMA § FMA (Failure material analysis) § FIS (Failure information sheet) FMA input External Visual inspection Yes § By optical microscope No Yes Electrical characterization No Destructive / Non-destructive analysis Circuit analysis Electrical characterization C/A Final report § By PGM+, Gang 8, or ADVAN Circuit analysis Destructive analysis Non-destructive analysis • Parameter analyzer • Curve tracer • Logic analyzer • De-cap analyzer • EMMI (Emission microscopy) • SEM • Cross section analyzer • Chemical analyzer • FIB (Focus ion beam) • Low and high microscope • SAT (Scanning acoustic tomography) • X-ray § Verification of corrective actions § FA report to the requestor Customer approved Confidential 11
Product Tree General purpose MCU Application specific MCU Peripheral IC Full Flash MCU REMO series Segment LED driver IC § COMBI MCU § General purpose LCD MCU § IR Blaster § Remocon MCU Segment LCD driver IC MIMO series Segment VFD driver IC Flash MCU OTP MCU § § Touch key MCU Ambient light sensor IR proximity sensor IR motion sensor Reset IC VISO series § 3 D glasses IC § LED BLU MCU § Voice MCU ECO series § Battery charger MCU § Smart battery MCU Custom product § Digital appliance controller § Inverter motor MCU Confidential 12
General Purpose MCU § Full flash MCU “Self programming supporting” ROM size 256 KB HMC 31 F 60256 128 KB 64 KB MC 96 F 2464 MC 95 FG 8128 MC 96 FC 664 A MC 96 FC 864 A MC 96 F 7664 MC 96 F 7864 MC 95 FG 0128 MC 96 F 2664 MC 96 F 4548 48 KB 32 KB MC 96 F 6332 MC 96 F 6432 MC 96 F 6632 MC 96 F 6832 MC 96 F 7416 A MC 96 F 7616 A MC 96 F 7816 44/48 64 80 16 KB MC 96 F 8216 MC 96 F 8316 8 KB MC 96 F 7616 A MC 95 FG 208 MC 95 FG 308 16/20 28/32 4 KB MC 95 FG 6128 HMC 31 F 6 A 256 MC 96 FG 104 8/10 100 128 Pin count COMBI MCU (Code Flash + Data E 2 PROM) General purpose MCU General purpose LCD MCU Confidential 13
General Purpose MCU § Flash MCU ROM size 48 KB 32 KB MC 81 F 4332 MC 81 F 4432 16 KB MC 81 F 4216 MC 81 F 4316 MC 81 F 4416 8 KB MC 80 F 1608 MC 80 F 1708 MC 80 F 7708 A 28/32 44/48 MC 81 F 8616 MC 81 F 8816 64 80 MC 96 F 7616 A MC 81 F 4204 4 KB MC 81 F 4104 MC 80 F 1604 8/10 16/20 100 128 Pin count 12 bit ADC MCU 8/10 bit ADC MCU LCD MCU Confidential 14
General Purpose MCU § OTP MCU ROM size 64 KB 32 KB 16 KB ADAM 81 P 1316 ADAM 81 P 1324 8 KB ADAM 82 P 1216 ADAM 82 P 1224 ADAM 42 P 2116 ADAM 42 P 1120 ADAM 81 P 1332 MC 96 F 6408 MC 96 F 6608 44/48 64 ADAM 43 P 1008 4 KB ADAM 42 P 1108 ADAM 46 P 2016 MC 96 F 7616 A 2 KB ADAM 46 P 2008 MC 96 P 0202 8/10 14/16 20/24 28/32 100 128 Pin count 4 bit MCU 8 bit MCU Confidential 15
Application Specific MCU Type § IR blaster • Built in carrier generator • IR-LED transistor, oscillator § Remocon MCU • Single/multi/LCD remocon MCU MIMO series § Sensor MCU • • VISO series § 3 D glasses IC (IR / BT Type) § LED BLU MCU § Voice MCU ECO series § Battery charger MCU, Smart battery MCU (2013 Y) Custom product § Digital appliance controller (CM 3) § Inverter motor MCU (CM 3) REMO series AS MCU Peripheral IC Confidential Remark § § Touch key MCU Ambient light sensor IR proximity sensor IR motion sensor (2013 Y) Segment LED driver IC Segment LCD driver IC Segment VFD driver IC Reset IC 16
Application Specific MCU REMO Series IR blaster § Built-in IR carrier generator, LED driver Tr. , pull-up resistor § 1. 8 V Operation for AP Interface § Boot coding with I 2 C Interface Remocon MCU § § § Single / Multi / LCD Remocon Multi-time programmable OTP / Flash One-battery(1. 5 V) operation Step-key function High accuracy internal OSC(± 2%@all spec ranges) Built-in LED driver Tr. MIMO Series Ambient light sensor / IR proximity sensor Touch key MCU § § § Confidential 8 ch capacitive touch key sensing Auto / Manual calibration Adjustable 256 steps sensitivity Single / Multi–key mode Robust in noise environment - CS, FES, EMS, EFT, ESD, etc. § § § Detectable intensity : 0. 00056 ~ 237, 500 lux 16 / 20 bit ADC I 2 C interface Interrupt function / Selectable slave address Sensitivity variation by light source : <± 15% 17
Application Specific MCU VISO Series 3 D glasses IC § § LED BLU MCU 15 V power Tr. switch Sync. detector LCD controller, charge pump Battery charging function with CCCV § § ECO Series Confidential § § Custom Product Battery charger MCU § Built-in CCCV (CC 3%, CV 0. 5%) § 16/20 pin, 4 KB Sync. detector Floating point timer High speed S&H ADC with tracer 32/64 pin MCP, 8 KB Voice MCU Peripheral IC Inverter motor MCU § § 32 bit Cortex-M 3 CPU Support inverter motor control 72 DMIPS @ 80 MHz operation Built-in 1 us S/H 12 bit ADC 3 ea Built-in DSP for voice processing Voice Decoder : ADPCM, SPEEX Digital DAC with digital amplifier External SPI NOR flash, 20 pin, No Flash Driver / Reset IC § § Segment LED driver IC Segment LCD driver IC Segment VFD driver IC Reset IC 18
Next Product Tree 2011 Y 2012 Y 2013 Y 2014 Y M 8051 Core 32 bit CM 3 32 bit CM 0 OCD Debugger OCD-II (Real time monitoring) OCD-III (Real time tracing) Ambient light sensor IR proximity sensor IR motion sensor Touch key MCU Touch screen MCU 3 D glasses IC (IR type) Product 3 D glasses IC (BT type) Battery charger MCU Smart battery MCU LED BLU MCU (Edge type) LED BLU MCU (Edge & Direct type) MP Confidential Avail. 19
Next Product § Light sensor line-up Ambient light sensor 2011 Y 2012 Y MC 8103 2013 Y MC 8121 • 1 ch • VDD Min. = 2. 4 V • 2 ch / Calc. outside • VDD Min. = 2. 4 V / 1. 8 V I 2 C MC 8221 • 2 ch / Calc. inside • VDD Min. = 1. 6 V MC 8201 Proximity sensor • VDD Min. = 2. 4 V / 1. 8 V I 2 C MC 8421 • 2 ch / Calc. inside • VDD Min. = 1. 6 V IR motion sensor MP Confidential Develop Plan 20
Next개발 Product 신규 제품 소개 - ② 3 D Glasses § 3 D Glasses IC line-up Re-chargeable battery type HV(24 V) USB port Noncarrier IR Std. (13 V) USB port Coin battery type 10 V LCD out 16 V LCD out Current status F 5216 (32 QFN) MP F 5416 (40 QFN) MP F 6216 (24 QFN) MP F 5304 (28 QFN) E/S 1 Q, 2013 F 7216 H (20 QFN) E/S 2 Q, 2013 F 7232 H (24 QFN) E/S 2 Q, 2013 F 5304 Real-D F 5216 Expander Carrier Bluetooth Product (PKG) F 6216 F 7232 H F 7216 RF Zig. Bee F 5416 Non-standard Items F 5304 F 5216 F 5416 F 6216 F 7216 H F 7232 H R 2(4) 2 5 5(7) L 0 0 1 1 C 8(9) 8 2 2(3) Operating time (@CR 2025 150 m. Ah) 150 h 170 h 200 h Form factor 4 x 4 mm 5 x 5 mm 4 x 4 mm 3 x 3 mm 4 x 4 mm IR/BT BT Charger/Coin Coin Charger/Coin BOM (@charger mode) Confidential 21
Core Competency 01 Design § Smallest chip size design capability • World smallest chip design DNA • In house cost-effective NVM IP design • ABOV’s own analog IP design, not using bulky IPs offered from foundry § Majority of the MCU resource in Korea under ABOV umbrella § Fast development TAT • Platform-based design infrastructure • 2∼ 3 months for DB out § Dedicated, on-demand design capability • FW encryption • HW protection function • 32 bit 8 bit + tm DSP Confidential 22
Core Competency 02 Customer support § Easiness of existing SW conversion • M 8051 compatible CPU core § 24 hours FAE support § In house MDS tool engineering • Supporting programming tool setup used in customer’s production line 03 Quality § In house test engineering • In house wafer test • Final test setup by ABOV engineers • Hot test for memory reliability § RMA within 5 working days § More than 20 years experience, more than 2 billions shipment Confidential 23
Technology Tree NVM key advantage • • High density NVM cell Robust memory retention, endurance Low access current On-chip charge-pump circuit technology On-chip flash controller with 0 -wait access Memory-related dedicated hardware integrated Easy and powerful access method via on-chip debugger EMS countermeasure • • EFT power noise ESD noise Reset / GPIO noise Oscillator noise Safety function • • SFR (Special function register) protection Clock protection ROM protection RAM protection Low-power consumption Confidential • Smart and adaptive operation modes (Run, idle, sleep, stop mode) 24
NVM Key Advantage § Ultra-low power & small size on-chip NVM technologies are implemented and optimized for customized system applications. a : High density NVM cell OCDI/II On-Chip SRAM CPU (M 8051©) On-Chip peripherals • OTP, Flash, Full flash for code/data memory b, c : Robust memory retention, endurance Bus I/F • Retention : 10 years Read path Descrambler Programming path Encryption (Soft/Hard Lock) d Scrambler On-Chip Flash controller b BIST a VPP c Cells for data memory Cap g Charge pump High density NVM cells for code memory Cell design technology Digital design technology Analog circuit design technology Value-added systematic technology Confidential (ISO 60730) Sense amplifier Row/Col. I/F f H/W CRC e VRef. gen • Code 10, 000 times, data 100, 000 times d, e, f : Low access current • Customized low-power on-chip sense amplifier • Flash data scrambling/descrambling engine for low-access current g : On-chip charge pump circuit technology • No need of external pump circuitry • Flash programming is supported in run-time 25
NVM Key Advantage § Fast design, good performance, application-specific memory-related hardware supported with NVM h : On-chip flash controller OCDI/II CPU (M 8051©) On-Chip SRAM On-Chip peripherals • No need of external flash controlling circuitry k • Backward compatibility supported (flash access) • Minimized software overhead Bus I/F Read path H/W CRC Encryption (Soft/Hard Lock) i On-Chip Flash controller h Scrambler Programming path Descrambler (ISO 60730) j BIST Sense amplifier Row/Col. I/F VPP Charge pump High density NVM cells for code memory Cells for data memory Cap VRef. gen i, j : Memory-related dedicated hardware integrated • Soft lock & hard lock with encryption engine • On-chip hardware CRC engine for safety ISO 60730 k : Easy & powerful access method via on-chip debugger • On-chip memory data hooking/erase/overwrite • Monitoring in run-time via minimal two-wire I/F Cell design technology Digital design technology Analog circuit design technology Value-added systematic technology Confidential 26
EMS Countermeasure § ESD noise § EFT power noise • Implementation in PAD Cell » On-chip ESD diode » On-chip Clamp diode • Full-custom layout for power noise reduction » Power separation (core, I/O) » On-chip bypass capacitance » VDD, GND line parallel layout Device VDDI/O VDD Port VDD GND Port GND Clamp diode (+) ESD strike Core PAD I /O PORT VDD Core VDD GND Core GND I/O, Core (-) ESD strike ESD protection diode VDD GPIO XIN MCU XOUT RESETB Confidential 27
EMS Countermeasure § Oscillator/Power noise § Reset/GPIO/Power noise • Adjusting oscillation swing level for noise margin • Using two-stage LPF (RC), NF (buffer + RC) • 1 stage - Schmitt buffer • 2 stage - RC type NF (ns-order) • 3 stage - Counter type NF (us-order) XIN RESETB /GPIO ㎱ (RC type) NF A us (Counter type) Counter A’ AMP System RESET XOUT Clock Low-pass filter (RC) LPF Noise filter (Buffer + RC) NF Bias level control Ring-OSC VDD GND VDD Oscillation swing level suppressed with bias voltage GPIO XIN MCU Xtal XOUT RESETB Confidential CLOAD • LPF : Low-pass filter • NF : Noise filter 28
Low Power Consumption § Smart and adaptive operating mode • Adaptive operation mode optimized for target application characteristics • 4 individual operating mode for energysensitive application » All operate at run mode » Only CPU stops at idle mode » CPU and peripherals stop at sleep mode (Selected analog is working) » All stop at stop mode RUN CPU Clocks Peripherals Analog SLEEP IDLE CPU Clocks Peripherals Limited analog CPU Clocks Peripherals Analog Low-power sleep mode (Very limited operation) STOP Low-power operation mode (CPU not operational) CPU Clocks Peripherals Analog Ultra low-power stop mode (Static leakage only) Confidential 29
Low Power Consumption § Hardware architecture § Sensor Interface • Interface operation using pseudo stop mode for low energy interface • Conditional wake-up to reduce the current sensing operation • MCU hardware architecture for low energy sensor interface • Analog interfaces (comparator, op-amp, ADC) are operated by a dedicated state-machine (tracer) with conditional CPU wake-up Sensor analog signal Conventional sensor interface Comparator (Multi-level) Clock Event (w/ Priority) CPU ADC Conditional wake-up Sensor Periodically wake up Op. Amp Clock speed control Proposed sensor interface Wake-up only on the events Conditional wake-up Deep stop Confidential OSC ADC Detected event Traced Pseudo stop Tracer Deep stop RUN Deep stop 30
Safety Function § SFR (Special function register) protection • Backup special SFR data values into XRAM buffer • Monitor SFR value and detect the broken data § Clock protection • Monitor the main clock frequency • Detect the clock fails • Switch into the backup clock Clock monitor (WDT) SFR(*) collection D r data store SFR monitoring software CP SFR snapshot dump (XRAM) Main source Load & check * Special function register Confidential Monitor Switch Q Reset System clock Backup clock 31
Safety Function § RAM protection § ROM protection • Check ROM Data fault, on CPU no-access time • Identify the ROM fail with CRC data • Interrupt the system (Interrupt service routine or system reset) • Check RAM Data fault, on CPU no-access time • Identify the RAM fail with CRC data • Interrupt the system (Interrupt service routine or system reset) CPU MMU scanning ROM (Flash) Code data hooking (CPU no-access time, background mode) RAM (SRAM) ROM scanning & CRC hardware CRC Confidential CPU MMU Code data hooking (CPU no-access time, background mode) RAM scanning & CRC hardware CRC 32
ABOV Own IP Category (1) Oscillator (2) Reference POR Main OSC Sub OSC SYSCON (3) Converter BGR VDC/BOD ADC / DAC / Op-Amp / Comparator DC-DC / CCCV SPSRAM/ DPSRAM Timer Special function RAM I/F SFR I/F INT OSC Bus M 8051 RING OSC OCD / Register PLL (4) Driver ROM I/F SFR I/F EEPROM /Flash GPIO I 2 C /UART /SPI (5) Memory Oscillator Memory Reference PAD Driver Digital Converter Confidential 33
MDS Tool Tree Core type G 800 Provider ABOV Type Build environment Debugging environment S/W Keil H/W S/W ARM 7 Cortex-M 3 ARM ABOV S/W H/W S/W Compiler ● ● Assembler ● ● Downloader (Programmer) ● Simulator ● EVA debugger ● OCD I /II JTAG Confidential Tool M 8051 ● ● ● ● H/W ● ● ● ● ● 34
MDS Tool Emulator / Debugger / Simulator G 400 G 810 Compiler Dr. Choice USB SIO ISP SRC debugger Choice Sigma 2 HMS 800 C-compiler UART ISP PGMplus. LC SRC simulator Standalone Gang 8 Magic assembler Standalone PGMplus ASM linker PGMplus USB Keil (ARM) OCD M 8051 Writer OCD-II On chip debugger SDCC Confidential
MDS Tool Emulator / Debugger / Simulator Writer Compiler ARM 7 ADAM 2 x ADAM 4 x ADAM 8 x Confidential Standalone gang 8 Keil Ulink debugger ADAM 21000 ADAM 4 simulator Single writer ADAM 21 assembler ADAM 4 ICE ADAM 4 debugger Gang 8 programmer ADAM 4 x assembler/linker ADAM 8 ICE ADAM 8 debugger Keil (ARM) ADAM 8 x compiler/assembler
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