CMS Needs for RD 53 A for Modules
- Slides: 6
CMS Needs for RD 53 A for Modules Georg Steinbrück, Hamburg University Coordination Meeting for Bump Bonding at IZM September 27, 2017
R&D programs within the CMS sensor group Thin, small pitch planar pixel sensors HPK submission (n-in-p) INFN – FBK R&D program, together with ATLAS (n-in-p) 3 D silicon INFN – FBK R&D program (3 D batches) CNM Barcelona Pixel Sensors Verfasser/in Webadresse, E-Mail oder sonstige Referenz 2
HPK Submission Sensor order: 35 wafers 6” n+-p FZ PSI 46/PROC 150 µm, no handle wafer (10 pstop) 150 µm + 50 µm Si-Si direct bond (10/10 pstop/pspray) Deep diffused 150 µm + 50µm (5 pstop) Sensors for PSI 46 dig/PROC 600, FE-I 4, ROC 4 sens, FCP 130, RD 53 A (and CHIPIX 65) ROC 4 sens FE-I 4 RD 53 A: 20 sensors per wafer, many variations Pstop: 4 vars. of 100 x 25, 6 vars. of 50 x 50 Pspray: 4 vars. of 100 x 25, 5 vars. of 50 x 50 Pixel Sensors Georg Steinbrück georg. steinbrueck@desy. de 3
HPK Sensors: Status Wafers delivered in Spring 2017 Bump bonding at IZM ongoing for 8 wafers (2 of each material variant) 15 weeks turnaround time Wafer level processing (ubm done for all 8, flip chip for 4 ongoing (ROC 4 sens) ) First modules with ROC 4 sens delivered: First results from DESY testbeam look good! RD 53 A Have 160 sensors for RD 53 A in hand at IZM, ready for flip chip! (also 2 Chipix 65 per wafer) Pixel Sensors Georg Steinbrück georg. steinbrueck@desy. de 4
INFN Two new R&D pixel batches from FBK 3 D pixel 2017 processing ongoing Planar Active Edge Production done, 2 Si-Si wafers at IZM for processing Pixel Sensors Georg Steinbrück georg. steinbrueck@desy. de 5
Request for RD 53 A Chips/ bumb bonding CMS has sensors for RD 53 A from submissions with FBK, HPK and CNM FBK and HPK sensors in hand, plenty of sensors already at IZM with ubm+diced CNM sensors for RD 53 A 240 sensors 2 S, 200 µm, March 2018 160 sensors 1 S (SOI) 150 µm active, July 2018 Request for „express“ batch of 2 untested RD 53 A chip wafers: CMS requests half of the chips (80) to be bump bonded to INFN (19) and HPK (61) sensors CMS requests half of the 7+2 RD 53 A wafers total The wafer level processing of the chip wafers should be done together. Let‘s coordinate the whole process, including flip-chipping to ATLAS/CMS specific sensors Pixel Sensors Georg Steinbrück georg. steinbrueck@desy. de 6
