CINEMA Mechanical Systems David Glaser Mechanical Engineering Space

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CINEMA Mechanical Systems David Glaser Mechanical Engineering Space Sciences Laboratory University of California, Berkeley

CINEMA Mechanical Systems David Glaser Mechanical Engineering Space Sciences Laboratory University of California, Berkeley TRIO-CINEMA 1 UCB, 2/08/2010

Mechanical Systems Agenda AGENDA Exterior Structure (Spacecraft Chassis) Avionics Stack Structure Thermal Design Harnessing

Mechanical Systems Agenda AGENDA Exterior Structure (Spacecraft Chassis) Avionics Stack Structure Thermal Design Harnessing Design Each Section Will Include: Overview Requirements Design <Test Results if any> Outstanding Issues Development Plan TRIO-CINEMA 2 UCB, 2/08/2010

Mechanical Systems - Exterior Structure TRIO-CINEMA 3 UCB, 2/08/2010

Mechanical Systems - Exterior Structure TRIO-CINEMA 3 UCB, 2/08/2010

 External Structure Overview TRIO-CINEMA 4 UCB, 2/08/2010

External Structure Overview TRIO-CINEMA 4 UCB, 2/08/2010

 Structure Requirements Level 2 Structure MEC-01 Cubesat 3 U Cubesat form factor per

Structure Requirements Level 2 Structure MEC-01 Cubesat 3 U Cubesat form factor per Cubesat Specification MEC-03 Strength/Vibration Compatible with Cubesat standard and launch vehicle supporting payload TRIO-CINEMA 5 UCB, 2/08/2010

Exterior Structure Design Top and Sides 5052 -H 32 Al Sheet Metal. 048 inches

Exterior Structure Design Top and Sides 5052 -H 32 Al Sheet Metal. 048 inches thick Ends ¼ inch 6061 T 6 Al 3 U Corners will be hard anodized per Cube. Sat Specification All Dimensions Meet Cube. Sat Specification TRIO-CINEMA 6 Cutouts for Mass Reduction – (May Be Eliminated for Radiation Shielding) UCB, 2/08/2010

Exterior Structure Design Sheet Metal Parts Fastened Together with 4 -40 Flathead Screws and

Exterior Structure Design Sheet Metal Parts Fastened Together with 4 -40 Flathead Screws and PEM nuts will also be used in some places to fasten components to the chassis wall TRIO-CINEMA 7 UCB, 2/08/2010

Exterior Structure Design Cube. Sat On-Off Switch Requirements • Remove-Before-Flight Pin Prevents Accidental Power

Exterior Structure Design Cube. Sat On-Off Switch Requirements • Remove-Before-Flight Pin Prevents Accidental Power Up • Deployment Switch (Honeywell hermetically sealed switch) Closes When P-POD Door Opens TRIO-CINEMA 8 UCB, 2/08/2010

 Exterior Structure Issues 1. Unproven Chassis Design – To our knowledge, no other

Exterior Structure Issues 1. Unproven Chassis Design – To our knowledge, no other Cube. Sats have used this type of chassis and fastening method 2. Possible Interference between PEM nuts and Avionics Stack Boards – TBD when all boards are specified – Screws and holes will be moved if there is interference 3. Should mass reduction cutouts be used or not? TRIO-CINEMA 9 UCB, 2/08/2010

Exterior Structure Development Plans • Final Design Changes – February 2010 • In-House Fabrication

Exterior Structure Development Plans • Final Design Changes – February 2010 • In-House Fabrication By SSL Machine Shop March. April 2010 • Assemble and Test May 2010 • Test Integration with Spacecraft Components (Summer 2010) • Performance Test In Spacecraft Level Vibration Test (Fall 2010) TRIO-CINEMA 10 UCB, 2/08/2010

Mechanical Systems - Exterior Structure Avionics Structure TRIO-CINEMA 11 UCB, 2/08/2010

Mechanical Systems - Exterior Structure Avionics Structure TRIO-CINEMA 11 UCB, 2/08/2010

 Avionics Structure Overview TRIO-CINEMA 12 UCB, 2/08/2010

Avionics Structure Overview TRIO-CINEMA 12 UCB, 2/08/2010

 Structure Requirements Level 2 Structure MEC-05 Avionics Module TRIO-CINEMA Provide structural integrity to

Structure Requirements Level 2 Structure MEC-05 Avionics Module TRIO-CINEMA Provide structural integrity to the avionics board stack Allows passage of all harnessing between boards and to and from components external to the stack 13 UCB, 2/08/2010

Avionics Structure Design • Available Stack Height: 145 mm • PC-104 Standard Connectors is

Avionics Structure Design • Available Stack Height: 145 mm • PC-104 Standard Connectors is 0. 6 inch Space between boards • Each board is. 06 inches thick Board Nominal Component Height HVPS 1. 10 in. (28 mm. )* MAGIC 0. 6 in. (15. 24 mm) Instrument Interface/LVPS 0. 6 in. (15. 24 mm) Helium UHF Radio 0. 6 in. (15. 24 mm) Clyde 3 U Battery 0. 98 in. (25 mm)* Clyde EPS 0. 6 in. (15. 24 mm) Processor 0. 6 in. (15. 24 mm) Thickness of 7 Boards (. 06 in. each) 0. 42 in (10. 7 mm) Total Height 5. 47 in. (140 mm) *Non-standard board height TRIO-CINEMA 14 UCB, 2/08/2010

Avionics Structure Design • Seven PC-104 Boards Connected Via PC-104 Male –Female Standoffs •

Avionics Structure Design • Seven PC-104 Boards Connected Via PC-104 Male –Female Standoffs • Electrical Connections via PC-104 Connector (Except HVPS board) TRIO-CINEMA 15 UCB, 2/08/2010

 Avionics Structure Issues • Possible interference between components on PC-104 boards – need

Avionics Structure Issues • Possible interference between components on PC-104 boards – need to map where higher components are on each board • If height limitation is surpassed, may need to move one or two batteries out of the stack TRIO-CINEMA 16 UCB, 2/08/2010

Avionics Structure Development Plans Development • Evaluation of head and foot-room of board components

Avionics Structure Development Plans Development • Evaluation of head and foot-room of board components February-March 2010 • In-House Fabrication of Parts by SSL Machine Shop, March-April 2010 • Integration with 7 PC-104 Boards (May? 2010) • Integration with CINEMA Chassis and harnessing (Summer 2010) • Performance Test In Spacecraft Level Vibration Test (Fall 2010) TRIO-CINEMA 17 UCB, 2/08/2010

Mechanical Systems - Exterior Structure Harnessing TRIO-CINEMA 18 UCB, 2/08/2010

Mechanical Systems - Exterior Structure Harnessing TRIO-CINEMA 18 UCB, 2/08/2010

 Harnessing Overview Make electrical connections between avionics boards Make electrical connections between avionics

Harnessing Overview Make electrical connections between avionics boards Make electrical connections between avionics stack and all instruments, and other components TRIO-CINEMA 19 UCB, 2/08/2010

 Harnessing Requirements Few harnessing requirements have been defined Level 2 Telecom RF Accommodate

Harnessing Requirements Few harnessing requirements have been defined Level 2 Telecom RF Accommodate coax from transmitter/transceiver to splitters, from TEL-03 Harnessing splitters to patch antennas Level 3 MAGIC Boom & OB Sensor BOM-04 OB MAG Supports an 18 -conductor (36 AWG magnet wire) shielded harness Harness (captured to OB sensor, Connector on MAGIC board end). Able to withstand the forces from being stored in a coil and deployed several times. Level 3 STEIN Preamp/Shaper SFE-08 Interface parallel harness to FPGA board (or serial interface using small FPGA on ADC board - TBD) TRIO-CINEMA 20 UCB, 2/08/2010

Harnessing Design • Design is mostly incomplete • What has been done: • MAGIC

Harnessing Design • Design is mostly incomplete • What has been done: • MAGIC harness (between MAGIC board and sensor) has been designed and ETU built/tested (more info later) • Have begun discussions with John Sample on the HVPS board connector and its routing • Solar Panel to EPS connectors have been defined • Other? TRIO-CINEMA 21 UCB, 2/08/2010

 Harnessing Issues • No known issues yet TRIO-CINEMA 22 UCB, 2/08/2010

Harnessing Issues • No known issues yet TRIO-CINEMA 22 UCB, 2/08/2010

Harnessing Development Plans Development • Requirements should be developed – February 2010 • As

Harnessing Development Plans Development • Requirements should be developed – February 2010 • As the seven boards in the avionics stack become available a harnessing scheme will be worked out – February-April 2010 • Recommend meetings to discuss this begin immediately TRIO-CINEMA 23 UCB, 2/08/2010

Mechanical Systems - Thermal Design TRIO-CINEMA 24 UCB, 2/08/2010

Mechanical Systems - Thermal Design TRIO-CINEMA 24 UCB, 2/08/2010

 Thermal Overview Thermal Design Approach is to create a simple model of the

Thermal Overview Thermal Design Approach is to create a simple model of the heat inputs and outputs through the satellite surface and critical instrument surfaces TRIO-CINEMA 25 UCB, 2/08/2010

 Thermal Requirements Level 2 Structure MEC-04 Thermal TRIO-CINEMA Provide passive thermal design utilizing

Thermal Requirements Level 2 Structure MEC-04 Thermal TRIO-CINEMA Provide passive thermal design utilizing thermal finishes on surfaces not covered by solar array. Transfer heat away from power dissipaters to bus (particularly transmitter, which needs ~100 g heat sync) 26 UCB, 2/08/2010

Thermal Design • We have only just begun to make a thermal model of

Thermal Design • We have only just begun to make a thermal model of the satellite. Early approach: modify spreadsheet made for THEMIS by Dave Pankow • Model of tumbling spacecraft needed, in a addition to spinning at ecliptic-normal • Pankow did analysis of deployed magnetometer • Possible surfaces include black anodize, white paint, MLI • S-Band Transmitter and DC-DC converters both dissipate significant power – will be mounted to chassis wall TRIO-CINEMA 27 UCB, 2/08/2010

 Thermal Analysis Results • Magnetometer Analysis – D. Pankow 30 gm - 2

Thermal Analysis Results • Magnetometer Analysis – D. Pankow 30 gm - 2 cm Black Anodized Sphere Cooling Curve 60 40 Temperature (K) • Combination of white and black surfaces would create best temperature range • Harness may alter mag temperature by a few degrees • Stacer boom will be thermally isolated and have a moderate temperature range 20 0 -20 0 10 20 40 TIME (min) for To = 277 K Black Anodize TRIO-CINEMA 30 28 White Paint UCB, 2/08/2010

 Thermal Analysis Results • Spacecraft level model – no results yet, but note

Thermal Analysis Results • Spacecraft level model – no results yet, but note that upper and lower surfaces of satellite have large areas of aluminum wall exposed – careful choice of surface materials will be needed • S-Band Transmitter and DC-DC converters both dissipate significant power – will be mounted to chassis walls TRIO-CINEMA 29 UCB, 2/08/2010

 Thermal Issues We have no thermal specifications for the patch antenna dielectric material

Thermal Issues We have no thermal specifications for the patch antenna dielectric material (Rogers RT/Duroid 6002). For now we are treating it as a grey painted surface. TRIO-CINEMA 30 UCB, 2/08/2010

Thermal Development Plans Lots of work ahead: • Spacecraft level model in Excel will

Thermal Development Plans Lots of work ahead: • Spacecraft level model in Excel will be completed in early February • • Need to include Earth IR emission Need to include a tumbling mode • A thermal model and design of STEIN is needed to ensure that the detector remains as cool as possible • A thermal model of the torque coils is also warranted, as large temperature fluctuations would alter coil resistance and therefore magnetic dipole of the coils • All thermal models will be reviewed by Chris Smith, SSL thermal engineer • Thermal Desktop (FEA) models will be created if necessary TRIO-CINEMA 31 UCB, 2/08/2010

Mechanical Systems – Magnetometer Mechanical TRIO-CINEMA 32 UCB, 2/08/2010

Mechanical Systems – Magnetometer Mechanical TRIO-CINEMA 32 UCB, 2/08/2010

 Magnetometer Mechanical Overview Stacer boom (flight spare from FAST mission) Stowed Magnetometer TRIO-CINEMA

Magnetometer Mechanical Overview Stacer boom (flight spare from FAST mission) Stowed Magnetometer TRIO-CINEMA 33 UCB, 2/08/2010

 Magnetometer Mechanical Requirements Level 3 MAGIC Boom & OB Sensor BOM-01 Length >1

Magnetometer Mechanical Requirements Level 3 MAGIC Boom & OB Sensor BOM-01 Length >1 m BOM-03 Actuation Actuated by a SMA controlled by the C&DH via a switched bus voltage power service BOM-04 OB MAG Harness Supports an 18 -conductor (36 AWG magnet wire) shielded harness (captured to OB sensor, Connector on MAGIC board end). Able to withstand the forces from being stored in a coil and deployed several times. BOM-05 OB MAG Supports a 25 g OB MAG sensor per the MAGIC ICD Mechanical BOM-06 OB MAG Thermal OB sensor to be thermally isolated from stacer and passively thermally controlled by the surface properties between -120 and +50 C )TBR) BOM-07 MAGIC ~160 g Boom+sensor+harn ess mass BOM-08 Boom Deployment Stow magnetometer and Stacer boom within the space provided; Deploy Magnetometer to 1 m distance with a single, one-shot actuation; TRIO-CINEMA 34 UCB, 2/08/2010

Magnetometer Mechanical Design Harness Design 18 Twisted Conductors 36 AWG Magnet Wire with Flight

Magnetometer Mechanical Design Harness Design 18 Twisted Conductors 36 AWG Magnet Wire with Flight Heritage Aracon Braided Jacket – Silver/Nickel TRIO-CINEMA 35 UCB, 2/08/2010

Magnetometer Mechanical Design Mag Boom Design Ti. Ni • Spans the width of the

Magnetometer Mechanical Design Mag Boom Design Ti. Ni • Spans the width of the CINEMA chassis • Mounted to walls with screws • Mag extends out < 6. 5 mm from outer wall TRIO-CINEMA 36 UCB, 2/08/2010

Magnetometer Mechanical Design Kickoff Spring Potted Sensor in housing TRIO-CINEMA 37 UCB, 2/08/2010

Magnetometer Mechanical Design Kickoff Spring Potted Sensor in housing TRIO-CINEMA 37 UCB, 2/08/2010

Magnetometer Mechanical Test Results 1. ETU Harness has been tested for insulation breakdown after

Magnetometer Mechanical Test Results 1. ETU Harness has been tested for insulation breakdown after extreme bending tests 2. Force Ratio on Pinpuller is 3. 3 minimum. 3. ETU Mag Boom has been assembled with mock sensor mass and deployed 11 times • Students have successfully assembled it 4. Twice the release pin experienced binding and pin/bushing interface was redesigned and lubrication added – four consecutive successful deployments since redesign 5. Deployment forces on harness seem to be minimal 6. ETU Mass: 210 g (50 g more than requirement) TRIO-CINEMA 38 UCB, 2/08/2010

Magnetometer Mechanical Test Results Sample Test Video TRIO-CINEMA 39 UCB, 2/08/2010

Magnetometer Mechanical Test Results Sample Test Video TRIO-CINEMA 39 UCB, 2/08/2010

Magnetometer Mechanical Issues • Binding of release pin • • Will continue to monitor

Magnetometer Mechanical Issues • Binding of release pin • • Will continue to monitor during subsequent tests Need to define reliability requirement • Fragility of harness braided jacket • need to develop better handling procedures and reliability requirement • Boom length appears to be < 1 m (~0. 90 m). MAGIC team has said this is fine as long as they know the exact deployed length • MAGIC team wants to assure that deployment shock will not exceed instrument limitations • Thermal design needs to be finalized – surface materials (mentioned earlier in Thermal presentation) TRIO-CINEMA 40 UCB, 2/08/2010

Magnetometer Mechanical Development Plans Development • Deployment shock test with STM supplied by MAGIC

Magnetometer Mechanical Development Plans Development • Deployment shock test with STM supplied by MAGIC team – spring 2010 • Possible Vibe Test (Piggyback on RBSP test) Feb. March 2010 • Fabrication of Flight Model Parts – April-May 2010 • Integration with CINEMA Chassis (Summer 2010) • Performance Test In Spacecraft Level Vibration and Thermal Vac Tests (Fall 2010) TRIO-CINEMA 41 UCB, 2/08/2010

Mechanical Systems - STEIN Mechanical David Glaser TRIO-CINEMA 42 UCB, 2/08/2010

Mechanical Systems - STEIN Mechanical David Glaser TRIO-CINEMA 42 UCB, 2/08/2010

 STEIN Mechanical Overview TRIO-CINEMA 43 UCB, 2/08/2010

STEIN Mechanical Overview TRIO-CINEMA 43 UCB, 2/08/2010

 STEIN Mechanical Requirements STE-07 STEIN FOV Charged particle FOV 40 degrees by 70

STEIN Mechanical Requirements STE-07 STEIN FOV Charged particle FOV 40 degrees by 70 degrees. Two-pi glint free FOV STE-08 Stray Light Prevent stray light from getting to the detector from any direction, including from the back (sensitive to 1 E-6 suns) STE-09 STEIN Defelectors High voltage surfaces shall be no less than 2 mm away from other surfaces; STE-10 STEIN Scattered Electrons Surfaces near the electron trajectories shall be formed to reduce scattered electrons STE-11 COL-01 STEIN Mass Collimation ~260 g for detector head (excludes electronics, HVPS) Provide better than 1 E-6 sunlight rejection up to 40 degrees (TBR) from bore-sight in spin direction TRIO-CINEMA 44 UCB, 2/08/2010

STEIN Mechanical Design Baffles and housing interior are blackened TRIO-CINEMA 45 UCB, 2/08/2010

STEIN Mechanical Design Baffles and housing interior are blackened TRIO-CINEMA 45 UCB, 2/08/2010

STEIN Mechanical Design STEIN Assembly Attenuator Mechanism is Modular TRIO-CINEMA 46 UCB, 2/08/2010

STEIN Mechanical Design STEIN Assembly Attenuator Mechanism is Modular TRIO-CINEMA 46 UCB, 2/08/2010

STEIN Mechanical Design Electrostatic Deflector 30. 002 -inch thick Be. Cu blades sandwiched between.

STEIN Mechanical Design Electrostatic Deflector 30. 002 -inch thick Be. Cu blades sandwiched between. 025 -inch thick Aluminum clamps Blades are Cu plated and blackened with Ebanol C TRIO-CINEMA 47 UCB, 2/08/2010

STEIN Mechanical Test Results • Mass of ETU Sensor Head: ~250 g (meets requirement)

STEIN Mechanical Test Results • Mass of ETU Sensor Head: ~250 g (meets requirement) • Attenuator is easily mounted to and removed from housing • Deflection plates mount easily into housing • Original deflectors scattered many electrons - redesigned • No HV arcing was observed in vacuum chamber tests with original deflectors • New deflectors have been assembled but not yet tested TRIO-CINEMA 48 UCB, 2/08/2010

STEIN Mechanical Design New Electrostatic Deflector Design 30. 002 -inch thick Be. Cu blades

STEIN Mechanical Design New Electrostatic Deflector Design 30. 002 -inch thick Be. Cu blades sandwiched between. 025 -inch thick Aluminum clamps Blades are Cu plated and blackened with Ebanol C TRIO-CINEMA 49 UCB, 2/08/2010

STEIN Mechanical Design Electrostatic Deflector Old Flat Plate Design New design is wider to

STEIN Mechanical Design Electrostatic Deflector Old Flat Plate Design New design is wider to eliminate edge effects TRIO-CINEMA 50 UCB, 2/08/2010

 STEIN Mechanical Issues 1. New deflection system needs to be tested in vacuum

STEIN Mechanical Issues 1. New deflection system needs to be tested in vacuum chamber 2. Need to test blocking of stray visible light 3. End clamps on electrostatic deflectors flex too much – solution is to add third fastener in the middle and/or make parts from stainless steel 4. Should baffles be fastended with epoxy or screws? 5. Thermal requirements/modeling/design needed 6. Assembly procedure of detector board and signal processing boards has not been defined TRIO-CINEMA 51 UCB, 2/08/2010

STEIN Mechanical Development Plans Development • New deflection system to be tested - Feb.

STEIN Mechanical Development Plans Development • New deflection system to be tested - Feb. 2010 • Add second side of deflection and test - March 2010 • Integrate baffles with epoxy and test light-tightness – April 2010 • Final design changes for flight – March 2010 • Fabricate Flight Parts – May 2010 • Assemble and Test Flight Model – June-July 2010 • Performance Test In Spacecraft Level Vibration Test (Fall 2010) TRIO-CINEMA 52 UCB, 2/08/2010