CHAPTER 4 IMPERFECTIONS IN SOLIDS ISSUES TO ADDRESS

CHAPTER 4: IMPERFECTIONS IN SOLIDS ISSUES TO ADDRESS. . . • What types of defects arise in solids? • Can the number and type of defects be varied and controlled? • How do defects affect material properties? sterling silver (7. 5% copper) much harder and stronger than silver silicon transistors rely on controlled “doping” • Are defects undesirable? NO Chapter 4 - 1

TYPES OF IMPERFECTIONS • Vacancy atoms • Interstitial atoms • Substitutional atoms Point defects • Dislocations Line defects • Grain Boundaries Area defects Chapter 4 - 2

• Vacancies: POINT DEFECTS -vacant atomic sites in a structure. • Self-Interstitials: -"extra" atoms positioned between atomic sites. Much lower concentration than vacancies. Chapter 4 - 3

EQUIL. CONCENTRATION: POINT DEFECTS • Equilibrium concentration varies with temperature! No. of defects Activation energy æ -Q ö ND = D ÷÷ exp çç è k. T ø N No. of atomic sites Temperature Boltzmann's constant (1. 38 x 10 -23 J/atom K) (8. 62 x 10 -5 e. V/at om K) Each lattice site is a potential vacancy site Chapter 4 - 4

MEASURING ACTIVATION ENERGY • We can get Q from an experiment. • Measure this. . . • Replot it. . . Chapter 4 - 5

ESTIMATING VACANCY CONC. • Find the equil. # of vacancies in 1 m of 3 Cu at 1000 C. • Given: • Answer: Fraction means 1 in 10000 sites is a vacancy! Chapter 4 - 6

THEORETICAL DENSITY, r Example: Copper Data from Table inside front cover of Callister (see next slide): • crystal structure = FCC: 4 atoms/unit cell • atomic weight = 63. 55 g/mol (1 amu = 1 g/mol) -7 • atomic radius R = 0. 128 nm (1 nm = 10 cm) Chapter 4 - 14

OBSERVING EQUIL. VACANCY CONC. • Low energy electron microscope view of a (110) surface of Ni. Al. • Increasing T causes surface island of atoms to grow. • Why? The equil. vacancy conc. increases via atom motion from the crystal to the surface, where they join the island. Reprinted with permission from Nature (K. F. Mc. Carty, J. A. Nobel, and N. C. Bartelt, "Vacancies in Solids and the Stability of Surface Morphology", Nature, Vol. 412, pp. 622 -625 (2001). Image is 5. 75 mm by 5. 75 mm. ) Copyright (2001) Macmillan Publishers, Ltd. Chapter 4 - 7

Impurities in Solids • Completely pure metal (or other substance) – Impossible!! • Pay – really pay – for 99. 9999% - NIST standards • still 1022 to 1023 impurities per m 3 • Alloy – deliberately add “impurity” to engineer properties. Copper (7. 5%) in silver Chapter 4 -

Terminology - Alloys • Solvent – component in highest concentration – also called – host • Solute – component present in minor concentration Chapter 4 -

POINT DEFECTS IN ALLOYS Two outcomes if impurity (B) added to host (A): • Solid solution of B in A (random and uniform dist. of defects) OR Substitutional alloy (e. g. , Cu in Ni) Interstitial alloy (e. g. , C in Fe) • Solid solution of B in A plus particles of a new phase (usually for a larger amount of B) Second phase particle --different composition --often different structure. Chapter 4 - 8

Remember metals- often crystallize in close packed structures – high packing density. More interstitial or substitutional ? ? Usually < 10% Chapter 4 -

ALLOYING A SURFACE • Low energy electron microscope view of a (111) surface of Cu. • Sn islands move along the surface and "alloy" the Cu with Sn atoms, to make "bronze". • The islands continually move into "unalloyed" regions and leave tiny bronze particles in their wake. • Eventually, the islands disappear. Reprinted with permission from: A. K. Schmid, N. C. Bartelt, and R. Q. Hwang, "Alloying at Surfaces by the Migration of Reactive Two-Dimensional Islands", Science, Vol. 290, No. 5496, pp. 1561 -64 (2000). Field of view is 1. 5 mm and the temperature is 290 K. Chapter 4 - 9

Factors that Govern Solid Solution • • Atomic size - < 15% difference Crystal structure – same Electronegativity - ? ? Valences – more likely to dissolve another metal of higher valence Chapter 4 -

Copper and Nickel Element Radii Cu 0. 128 nm Ni 0. 125 Unit cell FCC Electronegativity 1. 9 1. 8 Oxidation (Valence) +1 (+2) +2 Expect to form solid solution? Ni – 3 d 8 4 s 2 (28) Cu - 3 d 10 4 s 1 (29) Chapter 4 -

Carbon in Iron Element Radii C 0. 017 nm Fe 0. 124 Unit cell Hex BCC Electronegativity 2. 5 1. 6 Valence +4 +2 (+3) Solid solution ? Interstitial or substitional? C - 2 s 2 2 p 2 Fe – 3 d 6 4 s 2 Chapter 4 -

Defects in Ceramics Still have interstitials and vacancies Chapter 4 -

Substitutional ions Chapter 4 -

IMPURITIES • Impurities must also satisfy charge balance • Ex: Na. Cl • Substitutional cation impurity • Substitutional anion impurity Chapter 4 - 11

DEFECTS IN CERAMIC STRUCTURES • Frenkel Defect --a cation is out of place. • Shottky Defect --a paired set of cation and anion vacancies. Adapted from Fig. 13. 20, Callister 5 e. (Fig. 13. 20 is from W. G. Moffatt, G. W. Pearsall, and J. Wulff, The Structure and Properties of Materials, Vol. 1, Structure, John Wiley and Sons, Inc. , p. 78. ) See Fig. 12. 21, Callister 6 e. • Equilibrium concentration of defects Chapter 4 - 8

COMPOSITION Definition: Amount of impurity (B) and host (A) in the system. Two descriptions: • Weight % • Atom % • Conversion between wt % and at% in an A-B alloy: • Basis for conversion: Chapter 4 - 10

Dislocations: LINE DEFECTS • 1 -dimensional defect around which some atoms are misaligned • are line defects, • cause slip between crystal plane when they move, • produce permanent (plastic) deformation. Schematic of a Zinc (HCP): • before deformation • after tensile elongation slip steps Chapter 4 - 11

INCREMENTAL SLIP • Dislocations slip planes incrementally. . . • The dislocation line (the moving red dot). . . separates slipped material on the left from unslipped material on the right. Simulation of dislocation motion from left to right as a crystal is sheared. (Courtesy P. M. Anderson) Chapter 4 - 12

BOND BREAKING AND REMAKING • Dislocation motion requires the successive bumping of a half plane of atoms (from left to right here). • Bonds across the slipping planes are broken and remade in succession. Atomic view of edge dislocation motion from left to right as a crystal is sheared. (Courtesy P. M. Anderson) Chapter 4 - 13

Edge dislocation – extra ½ plane of atoms Burgers vector: magnitude and direction of lattice distortion. Dislocation line: for edge dislocation above, it is to Chapter the page. 4 -

Burgers Vector Chapter 4 -

Motion – Edge dislocation Applied shear Chapter 4 -

Screw dislocation Bergers vector b Screw – thought of as a result of applied shear – shifted upper Region of crystal 1 atomic distance Chapter 4 -

Motion Screw Dislocation Apply shear Chapter 4 -

Mixed Dislocation Chapter 4 -

DISLOCATIONS & CRYSTAL STRUCTURE • Structure: close-packed planes & directions are preferred. view onto two close-packed planes. • Comparison among crystal structures: FCC: many close-packed planes/directions; HCP: only one plane, 3 directions; BCC: none Mg (HCP) • Results of tensile testing. tensile direction Al (FCC) Chapter 4 - 14

AREA DEFECTS: GRAIN BOUNDARIES Grain boundaries: • • are boundaries between crystals. are produced by the solidification process, for example. have a change in crystal orientation across them. impede dislocation motion. Metal Ingot ~ 8 cm grain boundaries Adapted from Fig. 4. 10, Callister 6 e. (Fig. 4. 10 is from Metals Handbook, Vol. 9, 9 th edition, Metallography and Microstructures, Am. Society for Metals, Metals Park, OH, 1985. ) Chapter 4 - 15 Adapted from Fig. 4. 7, Callister 6 e.

Area Defects Tilt Boundary – array of edge defects Twin Boundary Twist Boundary –array of screw defects Stacking Defect - break in sequence ABDABC Pores Cracks Chapter 4 Other phases

OPTICAL MICROSCOPY (1) • Useful up to 2000 X magnification. • Polishing removes surface features (e. g. , scratches) • Etching changes reflectance, depending on crystal orientation. close-packed planes Adapted from Fig. 4. 11(b) and (c), Callister 6 e. (Fig. 4. 11(c) is courtesy of J. E. Burke, General Electric Co. micrograph of Brass (Cu and Zn) 0. 75 mm Chapter 4 - 16

OPTICAL MICROSCOPY (2) Grain boundaries. . . • are imperfections, • are more susceptible to etching, • may be revealed as dark lines, • change direction in a polycrystal. Adapted from Fig. 4. 12(a) and (b), Callister 6 e. (Fig. 4. 12(b) is courtesy of L. C. Smith and C. Brady, the National Bureau of Standards, Washington, DC [now the National Institute of Standards and Technology, Gaithersburg, MD]. ) Chapter 4 - 17

Imperfeicoes nos Solidos • Importancia das Imperfeicoes nos Solidos • Classificacao dos Solidos - Pontuais - Linha – Discordancias - Interfaciais - Volume Chapter 4 -

SUMMARY • Point, Line, and Area defects arise in solids. • The number and type of defects can be varied and controlled (e. g. , T controls vacancy conc. ) • Defects affect material properties (e. g. , grain boundaries control crystal slip). • Defects may be desirable or undesirable (e. g. , dislocations may be good or bad, depending on whether plastic deformation is desirable or not. ) Chapter 4 - 18