CERN PCB workshop activities Rui de Oliveira on

CERN PCB workshop activities Rui de Oliveira on behalf of PCB workshop team 29/11/2012 1

outline • • Activity Technologies Resistors MPGD history RD 51 collaboration participation Developments Trainings Gallery 29/11/2012 2

Activities 20 persons Building : 1000 sqr meters Making PCBs since 1960 -PCB -Rigid -Flex-rigid -Microvias -fine line (10 um) -large size (up to 2 m) -Thick film Hybrids -Thin film Hybrids Activities 2013 PCB 30% MPGD 50% C-milling 5% Low-mass 4% embedded 1% -Chemical milling -Cu, Fe, Al, Au, Ag, W, Mb, Ti, Cr, Ni -MPGD -GEM/thin. GEM/THGEM/RETHGEM -MSHP/Cobra -MICROMEGA/ Bulk/ Micro-BULK -RES BULK -Resistive MSGC -R&D on new structures -Low mass circuits -Multilayer flexes with aluminum strips -embedded heat sinks (carbon, graphite, metals, diamon) -Embedded components -passive -Active 1. 7 Mchf/year turnover + 10% in 2013 6 Mchf equipment 3

Technologies • In house – – – – • Close collaboration with industry for: – – – • All processes related to Photolithography technics Chemical and electrochemical plating CNC dilling and milling for small pattern Chemical etching of metals and dielectrics Vacuum + high pressure gluing Screen printing (metal , dielectrics and resistors) Clean rooms ( class 100 , 1000 and 10000) Vacuum deposition ( Metal resistors dielectrics) Laser drilling and milling Plasma etching (RIE) Large PCBs mass production Large screen printing mass production In study – New generation Ink jet printers (metal resistors dielectrics) 29/11/2012 4

Resistors -A Resistor is define by: -Value Ohms -Precision % -TCR ppm/Deg C -max power W or W/m 2 -breakdown voltage V -Resistivity in Ohm*m -Sheet resistance or surface resistivity in Ohm/sqr -TCR: Temperature coefficient of the resistor -Cermet: is a composite material composed of ceramic (cer) and metallic (met) materials. 13/04/2011 Rui De Oliveira 5

Resistors for static dissipative application available at CERN • • • Screen printed polymers Filled cavity polymers Screen printed Ru. O resistors DLC vacuum deposited resistors Resistive Kapton • All of them can be paterned 29/11/2012 6

Resistors why carbon? • @ 300 K in (Ω·m) – Silver – Ruthenium – Germanium – Ni/Cr – Carbone 13/04/2011 16· 10 -9 (Ω·m) 71 10 -9 (Ω·m) 460· 10 -9 (Ω·m) 1000· 10 -9 (Ω·m) 35 000· 10 -9 (Ω·m) Rui De Oliveira 7

MPGD history ‘ 96: GEM 50 x 50 mm with a gain of 10. ‘ 97: GEM 100 x 100 mm with gain of 1000. ‘ 98: GEM 400 x 400 mm; 1 D and 2 D readouts; micro-groove and micro-well detectors. ‘ 00: 3 D GEM readout; 1 D readout for Micromegas in COMPASS. ‘ 01: PIXEL GEM readout; 2 D Micromegas readout. ‘ 03: PIXEL Micromegas readout. ‘ 04: Bulk Micromegas detector 100 mm x 100 mm. Micro BULK detectors ‘ 06: Half cylindrical GEM detector. ’ 08: first large GEM 1. 2 m x 0. 4 m. First spherical GEM ‘ 09: first large BULK Micromegas 1. 5 m x 0. 5 m ‘ 11: First resistive Bulk Micromegas 100 mm x 100 mm ‘ 12: First 30 cm x 30 cm NS 2 GEM detector ‘ 12: First 1 m 2 Resistive Micromegas ‘ 12: First 2 m 2 Resistive Micromegas ‘ 12: First NS 2 GEM detector 1. 2 m x 0. 5 m ‘ 12: Full cylindrical GEM detector ‘ 14: GEM 2 m x 0. 5 m ? ? Micromegas 3. 4 m x 2. 2 m ? ? 8

Participation in RD 51 • WG 1 : R&D on new structures, we have introduce: – Bulk Micromega ( with Saclay collaboration) – Resistive protections (with Atlas Collaboration) – Large GEM (with CERN GDD/CMS/INFN Frascati/TUM Munich …) – GEM embedded stretching system NS 2 • WG 6 : Industrialisation, our contribution: – Companies visits (more than 10) – TT transfer with selected companies – Institutes trainings 29/11/2012 9

Passed developments • Large size GEM • Blind GEM / Micro well • Chemical micro-vias • Bulk Micromegas • Resistive protections in Micromegas detectors • Capacitive couplings to reduce electronic channel count • Piggy Back Micromegas • Micro BULK Micromegas • PG and TPG thermal management devices • Full Aluminium circuits • Embedded active devices in flex 29/11/2012 10

Trainings and TT • GEM production training and TT: – – – Techtra 2 weeks at CERN + full technology transfer Xiaomei Li (CIAE Beijing) 1 week at CERN Tech-etch full technology transfer Mecaronics full technology transfer Close to 10 licenced companies • Micromegas production training and TT: – CEA Saclay (BULK and resistive protection) many iterations @CERN – CEA Saclay : BULK facility review @ Saclay – CIREA and ELTOS (BULK and resistive) 2 Days @ CERN + 2 days @ ELTOS + full TT – INFN Frascati (Large Micromegas detector) 2 months @CERN • THGEM production – VECC Kol. Kata (polyurethane protection) 1 day @CERN – Weissmann institute Israel (test and Cleaning) 2 days @CERN 29/11/2012 11

GEM Single mask examples • GEM 1. 1 m x 500 mm • CMS GEM detector GE 1/1 03/10/12 • KLOE – Cylindrical 3 GEM Detector • GEM 800 mm x 500 mm • Read-out 2 D : 800 mmx 500 mm Rui De Oliveira 12

CMS GE 1/1 NS 2 detector 03/10/12 Rui De Oliveira 13

Bulk Micromegas examples BULK Technology DUPONT PC 1025 coverlay BOPP Meshes SERITEC stretching Largest size produced: 2 m x 1 m ILC DHCAL 03/10/12 Rui De Oliveira T 2 K 14

ATLAS NSW detector opened detector closed

Thank you 29/11/2012 16

Thin film 13/04/2011 Rui De Oliveira 17

Thin film WEB SITE: http: //www. ohmega. com 13/04/2011 Rui De Oliveira 18

Thick film Some supplier can build 100 Mohms/sqr pastes 13/04/2011 Rui De Oliveira 19

Polymer resistive pastes 1 Mohms/Sqr seems to be the limit for these polymers 13/04/2011 Rui De Oliveira 20

Polymer Resistive foils 13/04/2011 Rui De Oliveira 21

Other products 13/04/2011 Rui De Oliveira 22