CCv P 2014 03 CoCreation Value Planning URL

CCv. P 2014年 03月 共創企画 Co-Creation Value Planning URL: http: //www. reflowablecamera. com/ 代表　　中條　博則 E-mail: h 1 i 9 r 5 o 4@yahoo. co. jp 1 / 88

CCv. P 1. Smartphone/Tablet PC/ Camera Moduleの市場動向 2. Camera Moduleのリフロー化 3. リフローCamera Module用Lens耐熱化技術 まとめ 3 / 88

CCv. P 携帯電話用Camera Module市場規模推移 Source：Techno System Research 2013. 12 Camera Rear Smartphone 1, 500 Front リーマン・ショック の影響による 落ち込み i. Phone/Skype　 ◇ i. Phone, Android/ Fring Video Chat Application 普及により搭載率急増 ◇ 100 Volume (Mset) 1, 000 50 500 CY: 20** Smartphone Inner Rate (%) Mobile Phone Rear Camera Built-in Rate (%) 2, 000 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 4 / 88

CCv. P Tablet PC用Camera Module市場規模推移 Source：Techno System Research 2013. 12 Tablet PC Camera Rear Camera Built-in Rate (%) Front Camera Built-in Rate (%) 500 Front More than Note PC 400 More than Desk top PC 300 100 Volume (Mset) 200 i. Pad発売開始 ’ 10/03~ 50 100 CY: 20** 10 11 12 13 14 15 16 17 18 5 / 88

CCv. P Mobile Phone Vender別生産数量推移 Source : IDC Press Release 2010 to 2013 500 Others Production quantity (MSet) 400 Huawei Black. Berry 300 Apple ZTE 200 LG 100 Samsung NOKIA 2 Q 3 Q 4 Q 1 Q CY 2009 2 Q 3 Q 2010 4 Q 1 Q 2 Q 3 Q 2011 4 Q 1 Q 2 Q 3 Q 2012 4 Q 1 Q 2 Q 3 Q 4 Q 2013 Vender 6 / 88

CCv. P All Mobile Phone Vender Share推移 50 45 NOKIA 40 Others 30 25 Samsung 20 15 Apple ZTE LG 10 Black. Berry 5 CY 2009 2010 2011 2012 2013 4 Q 3 Q 2 Q 1 Q 4 Q 3 Q Q 2 Huawei Source : IDC Press Release 2010 to 2014 Share (%) 35 12/ 88

CCv. P Smartphone Vender別出荷数量推移 Source : IDC Press Release 2010 to 2014 300 Others Lenovo 250 Production quantity (MSet) LG 200 Sony Huawei 150 ZTE Samsung 100 HTC Apple 50 Black. Berry NOKIA 2 Q 3 Q 4 Q 1 Q 2 Q CY 2009 2010 2011 3 Q 4 Q 1 Q 2 Q 2012 3 Q 4 Q 2013 Vender 8 / 88

CCv. P Smartphone Vender Share推移 50 45 Nokia Feature phone market 侵食 QRD LTE 2 G 3 G/4 G Media. Tek NOKIA 40 Others 35 Samsung 25 Black. Berry Source : IDC Press Release 2010 to 2014 Share (%) 30 20 15 10 LG Huawei Sony Apple 5 CY 2009 2010 2011 2012 4 Q 3 Q 2 Q 1 Q 4 Q 3 Q 2 Q 1 Lenovo Q 4 Q 3 Q 2 Q 1 ZTE Q 4 Q 3 Q 2 Q 1 Q 4 Q 3 Q Q 2 HTC 2013 9 / 88

CCv. P 携帯電話メーカー 搭載Camera Share & 画素構成比率 (CY 2013) Rear Camera Image Format (pattern) : None : ≦ 3 M : 5 M : 8 M Front Camera (pattern) : 12 M< : CIF ~ 5 M 100 90 Others Rear Camera Share　(%) 80 Cool. Pad 70 60 Lenovo TCL Sony Huawei ZTE LG 50 Apple 40 NOKIA 30 20 Samsung 10 0 Share (%) 20 100 80 60 40 20 40 60 80 100 Source：Techno System Research Report 2013. 12 10 / 88

CCv. P Qualcomm Reference Design (QRD) の概要 2013 M: China Maker 14ヶ国で発売 ◆ ◆ ◆ 標準機構設計図 標準電気回路設計図 ガーバーデータ 構成表 推奨部品メーカー ◆ ◆ Baseband用F/W Device Driver S/W Android OS用F/W Application S/W 他 製造ツール類 S/W開発ツール類 PC用シミュレーション 　 ツール類　など ◆ ◆ ◆ GAF: Global Certification Forum CDG: CDMA Development Group CTS: Compatibility Test Suite [ Android 互換性] 　 などの認証取得、フィールドテスト ◆ ◆ ◆ 11 / 88

CCv. P QRD対応Chip Set Road map QRD for Tablet PC 7” & 10” 2013. 2 H~ Modem x : 2 2 G 3 G/4 G x : 6 2 G/3 G 8 x 25 Q: 3 G/4 G 8 x 30: 3 G/4 G/LTE Display FWVGA HD FHD/ 8 x 30 Camera 12 MP 8 MP 25 Q: 8 MP/ 30: 20 MP 13 / 88

CCv. P QRD認証主要部品メーカー for front Camera Reflowable 15 / 88

CCv. P Baseband Processor for Smartphone Share (Volume) Maker Share (%) Volume (Mpcs) 2012 2013 増減率 (%) 2012 2014 Qualcomm 254. 7 396. 0 + 55. 5 34. 9 38. 4 Mediatek 88. 0 176. 0 + 100. 0 12. 1 17. 1 Apple 135. 8 153. 5 + 13. 0 18. 6 14. 9 Spreadrum 26. 3 94. 5 + 259. 3 3. 6 9. 2 Samsung 75. 7 90. 0 + 18. 9 10. 4 8. 7 Broadcom 43. 9 49. 3 + 12. 3 6. 0 4. 8 Marvell 30. 9 35. 3 + 14. 2 3. 4 Leadcore 1. 1 14. 6 +1227. 3 0. 2 1. 4 Ericsson 21. 2 9. 6 ▲ 54. 72 2. 9 0. 9 Others 52. 3 12. 0 ▲ 77. 1 7. 2 1. 2 Total 729. 9 1, 030. 8 + 41. 2 100. 0 Source：Techno System Research 2013. 12 16 / 88

CCv. P History of Smartphone 1900 93 94 95 96 2000 97 98 99 00 01 02 03 04 05 06 07 08 09 10 11 12 i. OS <Apple> Apple Newton PDA NOKIA 9210 NOKIA e 71 Windows Phone OS Black. Berry OS <RIM> RIM 850 6230 Res. (pixel) Disp. Size Method Dens. . (ppi) i. Phone 320 x 480 TFT 165 Galaxy 480 x 800 640 x 960 360 x 640 3. 5 in 4. 0 in 3. 5 in AMOLED TFT 233 329 Galaxy S 3 i. Phone 5 3. 5 in 360 x 480 720 x 1280 3. 7 in 3. 2 in 4. 8 in TFT 210 252 188 AMOLED 306 640 x 1136 4. 0 in TFT 326 480 x 800 NOKIA N 8 W-ZERO 3 Model No. Lumia 710 Curve 9380 i. Phone 5 Symbian OS NOKIA 9000 i. Phone 4 N/N 8 i. Phone 4 i. Phone NOKIA Lumia Bold 9000 Strategy Logistics Bold 9790 Curve 9380 HTC Dream Android OS Samsung Galaxy S 2 Galaxy S 3 Poly-Si TFT LCD over VGA Share 2010/ Display Search 10 20 30 40 50 60 70 80 90 Sony Samsung Sharp Others Toshiba 17 / 88

CCv. P Smartphone / Tablet PCの原点 2007. 01 1993~1998 Newton i. Phone 2010 Multimedia Player 「Popeye 」 i. Pad / 88

Telematics の進化 CCv. P 2014~ 1995~ GM i. OS in the Car TOYOTA ODD: On Demand Display SmartphoneによるKey-less entry ★ 指紋認証 ★ 虹彩認証 19 / 88

CCv. P Feature Phoneの形態 Stick type Clamshell type Slide type Special type Designの自由度が高い！ 20 / 88

CCv. P SmartphoneとTablet PCの薄型Type 事例 Example of Thin Smart Phone View Maker Apple / i. Phone Series Samsung / Galaxy Sony Fujitsu Huawei BBK Model No. 3 GS 4/4 S 5 S 3 S 4 Experia Z F 07 D Ascend P 6 Vivo X 3 Thickness 12. 3 mm 9. 3 mm 7. 6 mm 9. 0 mm 7. 9 mm 6. 7 mm 6. 18 mm 5. 75 mm Rear Camera 3 M 5 M/8 M 8 M 8 M 13 M 5 M 8 M 8 M Front Camera X VGA 1. 2 M 2 M 2 M 2. 2 M X 5 M 5 M Example of Thin Tablet PC View Maker Apple Samsung Lenovo SONY Google Amazon Model No. i. Pad 2 i. Pad mini Galaxy Tab 3 Idea. Tab EXTablet Z Nexus 7 -2 Kindle fire 8 Thickness 8. 8 mm 7. 2 mm 7. 4 mm 8. 6 mm 6. 9 mm 8. 7 mm 8. 8 mm Rear Camera HD 5 M 5 M AF 5 M 8. 1 M 5 M 1. 3 M Front Camera VGA 1. 2 M 1. 3 M VGA 2. 2 M 1. 2 M X 22 / 88

CCv. P Three kinds of approaches that achieve Thin & Full Flat Smartphone I: Apple i. Phone 5 S II : Sony Xperia Z Sapphire Glass t: 0. 4 mm ( w. Cavity ) III : Huawei Ascend P 6 The 2 nd thinnest smartphone in the world AGC Dragontrail. TM Corning®　Gorilla®　Cover Glass In Cell Touch Panel OGS Touch Panel Corning® Gorilla® Glass 3 t: 0. 4 mm In Cell Touch Panel DOL: 50 mm ? Sapphire Glass t: 0. 2 mm t : 7. 6 mm t : 7. 9 mm t : 6. 18 mm 8 MP/ 1. 5 mm: 1/3”/5. 6 mm 13 MP/ 1. 12 mm: 1/3. 06”/5. 3 mm 8 MP/ 1. 12 mm: 1/3. 92”/ 4. 7 mm Flip Chip Stacked Image Sensor COB ? Light Image Correction Optical Difference : 1. 2 mm Middle Image Correction ? Xperia Z 1: “BIONZ “ Engine Other Concept Model : Samsung Galaxy S 4 1. 2. 3. Not Full Flat Camera unit is projected Hard Image correction technology (Milbeaut® + Acutelogic IP built in Snapdragon) * Corning® Gorilla® Glass 3, 13 MP/1. 12 mm : 1/3. 06”, Stacked Image Sensor 23 / 88

CCv. P 携帯電話用カメラ 画素数別比率推移 Front Camera Rear Camera : ~ VGA : 1. 3 M : 2 M : 3 M : 5 M : 8 M : 12~14 M : ~ VGA : 16 M≦ : 1. 3 M* : 2 M* : 5 M≦ * 1. 3 M contain HD / 2 M contain FHD Source：Techno System Research Report 2013. 12 100 Rear Camera 80 70 60 50 40 Front Camera Ratio of the number of pixels 　(%) 90 30 20 10 0 CY: 20** 05 06 07 08 09 10 11 12 13 14 15 16 17 18 24 / 88

CCv. P LCD Panel Size / Major Image Formatと解像度の関係 Smartphone 700 Phablet Tablet QSXGA: 2560 x 2048 600 WQXGA : 2560 x 1600 QXGA : 2048 x 1536 500 450 WUXGA : 1920 x 1200 FHD : 1920 x 1080 400 350 4 K: 3840 x 21600 Gravure prt. 300 Resolution (ppi) 275 250 225 200 175 150 125 e-Book WSXGA: 1600 x 1024 Galaxy S 5: QHD: 2560 x 1440 HD 720 p: 1280 x 720 XGA : 1024 x 768 q. HD : 960 x 540 WVGA : 800 x 480 VGA : 640 x 480 100 90 80 70 60 HVGA : 480 x 320 Number of pixels of camera trend Position Rear Camera 3 MP Front Camera ~VGA 50 1. 0 Display Size (inch) 2. 0 5~8 MP 13 MP 16 MP~ ~1. 3 M ~2 M ~5 M ~8 MP 3. 0 4. 0 5. 0 6. 0 7. 0 8. 0 9. 0 10. 0 15. 0 20. 0 25 / 88

CCv. P Appearance Phablet事例 Vender Samsung NOKIA LG Grand Memo Optimus G Pro 2013. Q 2 Sony Galaxy Note II Sales start 2012. Sep 2013. 03 OS Android v 4. 1. 1 Windows 8 Android v 4. 1. 2 Chipset Exynos 4412 Q APQ 8064 T MSM 8974 Display Weight (g) Format (in)/ (ppi) Ascend Mate ZTE Product name Size (mm) Lumia One. Note Huawei K 3 V 2 Experia Z Ultra 2013. 06 151. 1 x 80. 5 x 9. 4 151. 1 x 80 x 8. 2 163. 5 x 85. 7 x 9. 9 159. 9 x 82. 6 x 8. 5 150. 2 x 76. 1 x 9. 4 179. 4 x 92. 2 x 6. 5 183 720 x 1280 175 720 x 1280 AMOLED 5. 5 / 267 198 172 212 720 x 1280 1080 x 1920 6. 1 / 241 5. 7 / 258 5. 5 / 401 6. 4 / 344 720 x 1280 Rear Camera 8 MP 1080 p@30 fps 12 MP 8 MP 1080 p@30 fps 13 MP 1080 p@30 fps 8 MP 1080 p@30 fps Front Camera 1. 9 MP 2 MP 1 MP 720 p@30 fps 1. 3 MP 720 p@30 fps 2. 1 MP 1080 p@30 fps 2 MP 1080 p@30 fps Battery (m. Ah) 3100 4050 3200 3140 3050 Front Camera: Zopo 3 M/5 MP, byond 3 MP, Spice 5 MP Galaxy Mega 5. 8 / Galaxy Mega 6. 3 2013. 04 26 / 88

CCv. P 2000 視力に依存する距離と解像度の関係 7. 0 5. 0 3. 0 2. 0 1. 0 0. 75 0. 25 0. 5 Diopter (D) 屋外大画面Display Smartphone, Tablet PC 視認距離 1000 ドバイ メンダイン競馬場 一般的な競馬場・野球場 700 Resolution : Rs (ppi) x 0. 01 500 400 5 inch FHD Display Retina Display 300 200 Eyesight : Es 100 70 50 40 2. 0 4 K TV 60 inch視認距離 (THX Recommended) 1. 5 1. 2 1. 0 4 K-60 inch Resolution 0. 7 0. 5 30 0. 4 20 Rs = 2. 54 /{L x tan(1/Es)} 10 10 20 30 40 50 70 100 200 m The distance from the eye : L(cm) 300 400 500 700 1000 28 / 88

CCv. P Module 製法の差によるCamera Module高さの差異 Flip Chip実装 CSP (Non-Reflowable) TTL w. IECF HG COB製法 Module 高さ基準面 H IRCF Cover Glass thickness = t H PCB Image Sensor 0. 15 mm typ. (0. 15 mm typ. ) 0. 07 mm typ. Others (PCB) 0. 28 mm(6 L)/ 0. 16 mm(4 L) Cavity PCB: 0. 2 mm * 0. 28 (6 L) + Ball 0. 12 HG 0 ** HG/3 0. 1 mm Module Height Reference : 0 (6 L) - 0. 13 mm min. +0. 13 mm min. Comment Stacked Sensor is also the same. ** : IRCF & Cover Glass Combination 0. 1 0. 0 mm Merit . * : Reflowable type 0 mm ** : IRCF & Cover Glass Combination 0. 1 0. 0 mm □ COB 不要 □ Class 1000 程度のClean RoomでOK □ 湿式洗浄不要 □ 小型化可 30 / 88

CCv. P 画素数・セルサイズ・光学サイズの関係 Image Format CIF VGA HD 1. 3 M 2 M FHD 3 M 5 M 8 M 10 M 13 M 16 M 20 M X 352 640 1280 1600 1920 2048 2560 3264 3648 4128 4608 5216 Y 288 480 720 1024 1200 1080 1536 1920 2488 2736 3096 3456 3920 TTL Pixel (kpixel) 101 307 922 1311 1920 2074 3146 4915 8121 9981 12780 15925 20446 Aspect Ratio 11: 9 4: 3 16: 9 5: 4 4: 3 16: 9 4: 3 Resolution Cell Size (μm) 4: 3 Optical Size ( inch )　1 inch = 16 mm(1/2 inch≦), 18 mm (< 1/2 inch) 1/7 1/4 1/2. 3 1/1. 8 2/3 3. 30 1/11 1/7 1/3. 3 1/2. 7 1/2. 5 1/1. 9 2/3 1/1. 2 1/1. 1 2. 70 1/15 1/8. 3 1/4. 5 1/4 1/3. 3 1/2. 6 1/1. 9 2/3 1/1. 1 2. 20 1/18 1/10 1/5. 5 1/4 1/3. 7 1/3. 2 1/2. 6 1/1. 8 1/1. 6 1/1. 4 1/1. 3 1/1. 1 1. 75 1/13 1/7 1/6. 3 1/5 1/4. 7 1/4 1/3. 2 1/2. 5 1/2. 3 1/1. 8 1/1. 6 1/1. 4 1. 50 1/15 1/8. 2 1/7. 3 1/6 1/5. 4 1/4. 7 1/3. 7 1/2. 9 1/2. 6 1/2. 3 1/2. 1 1/1. 6 1. 40 1/16 1/8. 8 1/7. 8 1/6. 4 1/5. 8 1/5 1/3. 1 1/2. 8 1/2. 5 1/2. 23 1/1. 8 1. 20 1/19 1/10 1/9 1/7. 5 1/6. 8 1/5. 9 1/4. 7 1/3. 3 1/2. 9 1/2. 6 1. 12 1/20 1/11 1/10 1/8 1/7. 3 1/6. 3 1/5 1/3. 9 1/3. 5 1/3. 07 1/2. 8 1/2. 5 1/12 1/11 1/9 1/8. 2 1/7 1/5. 6 1/4. 4 1/3. 9 1/3. 5 1/3. 1 1/2. 8 1/13 1/12 1/10 1/9 1/7. 6 1/6. 1 1/4. 7 1/4. 3 1/3. 8 1/3. 4 1/3. 0 1. 00 0. 92 < 1/20 1/1. 4 1/1. 2 5. 40 1/4 > 1. 0 1/2. 23 32 / 88

CCv. P CCD/FSI/BSI Image Sensorの構造比較 FSI CMOS Sensor CCD Sensor type BSI CMOS Sensor Sensitivity Power Consumption ○ : High Color Filter Metal wiring Photo Diode μ-Lens 　 Structure 支持基板 (Si) FSI: Front Side Illumination BSI: Back Side Illumination △ : Mid ◎ : High X : High ◎ : Low SOC X : Difficult ◎ : Easy Cost X : Expensive ◎ : Cheap △ : Not cheap ≦ 30 deg < 32~33 deg CRA ≦ 30 deg 35 / 88

CCv. P High CRAび対応したmage Sensor技術 CRA Samsung 25 26 27 28 29 30 31 FSI 32 33 34 35 Isocell-BSI Sony New BSI FSI BSI Internal Structure of Samsung’s BSI Image Sensor Conventional BSI Isocell-BSI 36 / 88

CCv. P 22, 000 21, 000 DSC出荷履歴 (CIPA発表資料) / Smartphone 市場規模推移 Rear Camera Main Stream 8 MP 5 MP 20, 000 Shipping Volume (kpcs) / Smartphone (10 k unit) 19, 000 CIPA出荷数量統計 : Compact DSC : SLRC : Non reflex 18, 000 17, 000 Smartphone市場規模 } : Source IDC 16, 000 15, 000 14, 000 13, 000 12, 000 16 MP 11, 000 10, 000 20 MP 9, 000 24 MP 8, 000 7, 000 12 -14 MP 6, 000 5, 000 4, 000 3, 000 2, 000 1 3 5 7 2008 9 11 1 3 5 7 2009 9 11 1 3 5 7 2010 9 11 1 3 5 7 2011 9 11 1 3 5 7 2012 9 11 1 3 5 7 9 11 1 2013 37 / 88

CCv. P Camera Moduleの機能別市場予測 Function --- OIS --- EIS --- AF -- Rear Camera -- Front Camera Source : Techno System Research 2013. 12 AF Ratio (Rear Camera) (%) 100 Fixed Focus 90 80 70 60 50 40 30 20 10 0 Front Camera Ratio (%) CY 20**10 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 20 30 40 Fixed Focus CCM 50 60 70 80 39 / 88

CCv. P Reflow Cameraの優位点& Image Sensorへの要求仕様 既存製法とリフローの 　　　 Camera Moduleサイズの差異 Reflowable Specification Image Sensor Square shape 既存製法 Camera Module Logic part Sensor part リフロー Camera Module Arrange at the center ----- No SMD 　FF ( Fixed Focus type ) : 固定焦点　type Reflow化で 「小型化」、「低背化」　双方クリア Available TSV FSI Image Sensor 40 / 88

CCv. P Image Sensor Maker Share 変化 / 一部メーカー画素構成推移 10 : 12 M ~ Others Sk Hynix ’ 12/2 H 3. Shareが変わらない会社 ’ 13/1 H Sony の中で代表的な会社の半期毎の画素構成変化を調べる Sony ’ 13/2 H ST Micro Toshiba Aptina ’ 13/2 H ’ 11/1 H ’ 11/2 H ’ 12/1 H ’ 12/2 H ’ 13/1 H Omni. Vision ’ 12/2 H ’ 13/1 H ST Micro Toshiba Omni. Vision ’ 11/1 H ST Micro ’ 11/2 H Toshiba ’ 12/1 H Aptina Sony Samsung 20 : 8 M 2013. 2 H Share F Samsung 30 ’ 11/1 H Others 1. Shareが伸びている会社 ’ 11/2 H Sk Hynix ’ 12/1 H 2. Shareが落ちている会社 : 5 M Omni. Vision 40 Aptina : 3 M Samsung 50 Toshiba : 2 M Omni. Vision 60 ST Micro : 1. 3 M Samsung Share　(%) 70 Sony : ~ VGA Omni. Vision 80 Sk Hynix Omni. Vision 90 Others Samsung 100 Pixel Number of Image Sensor Samsung 2011. 1 H Share ’ 13/2 H 0 662 Mpcs 0 10 20 30 40 50 60 70 80 90 100 1231 Mpcs Source：Techno System Research Report 2013. 06 41 / 88

CCv. P Camera Module Maker Share変化 / 一部メーカー画素構成推移 2011. 1 H Share 100 Share　(%) 50 40 30 : 1. 3 M : 2 M : 3 M : 5 M : 8 M : 12 M ~ ’ 11/2 H ’ 12/1 H Others ’ 12/2 H ’ 13/1 H ’ 13/2 H 70 60 : ~ VGA 2013. 2 H Share F ’ 11/1 H 90 80 Pixel Number of Image Sensor O-Film Primax SEMCO Sharp Cammsys Sunny Lite-On LG Innotek Toshiba 20 Foxconn 10 ST Micro 0 662 Mpcs ’ 11/1 H ’ 11/2 H ’ 12/1 H ’ 12/2 H ’ 13/1 H SEC Patron SEMCO Sharp ’ 13/2 H Cammsys Sunny ’ 11/1 H ’ 11/2 H ’ 12/1 H ’ 12/2 H ’ 13/1 H ’ 13/2 H Lite-On LG Innotek Toshiba Foxconn ST Micro 0 10 20 30 40 50 60 70 80 90 100 1231 Mpcs Source：Techno System Research Report 2013. 06 42 / 88

Module Maker ST Micro DIOSTECH Kolen Sekonix Digital Opt. Sunny E-PIN Ether Heptagon Konica. M. ASIA Opt SEMCO Microoptics Anteryon Fuji. Film Kantatsu Largan Genius SETi SEC SK hynix Sony Omni. Vision Aptina Galaxycore ST Micro Toshiba Sensor Maker Mobile Maker Motorola Sony TCL Lenovo Cool. Pad Nokia Samsung Apple ZTE HTC Huawei LG Blackberry CCv. P Camera Module Supply Chain Lens Maker Toshiba Sharp Foxconn Fuji. Film Cammsys SEC SEMCO Patron HNT Lite-ON BYD Truly Sony LG-Innotek Vista. Point Cowell Primax MC NEX Global Opt. Q-Tech Sunny O-Film Hansung Source：Techno System Research Report 2013. 06 43 / 88

CCv. P 1. Smartphone/Tablet PC/ Camera Moduleの市場動向 2. Camera Moduleのリフロー化 3. リフローCamera Module用Lens耐熱化技術 まとめ 44 / 88

CCv. P 主要部品実装方式 リード部品 Axial Lead parts 手挿入ライン Insert Machine <乙女ーション> Flow Solder Radial Lead parts Axial Radial Dipping 部品実装方式 表面実装部品 SMD* * Surface Mount Device Solder Printer Chip Mounter Reflow System SMT : Surface Mount Technology 45 / 88

CCv. P 携帯電話用　非耐熱部品のリフロー化対応Trend Key Parts Reflowable Technology Speaker Anti-Demagnetization Vibrator Anti-Demagnetization Back. Up BATT. Heat Proof Material Microphone MEMS Digital Mic. Camera Module Heat Proof Lens 2004 2005 2006 2007 2008 2009 Star Micronics Minebea Motor Shoei Elec. PAS Cap. Knowles Acoustics Akustica Request Panasonic Gold Cap. Mems Tech YAMAHA Hoshiden Panasonic Hybrid NEC-TOKIN Super Cap. OMRON Star Micronics Injection Epoxy Casting Glass Mold 48 / 88

CCv. P リフローCamera Module の分類 Sensor Reflowable Module 周辺部品有 Bare Chip COB <Wire-Bonding> <従来製法> Clean Room 要 SMT only < CSP搭載 > <従来製法> 本格的Clean Room 不要 周辺部品無 CSP (Chip Scale Package) Embedded Device type PCB CSCM / Chip Scale Camera Module <従来製法> SHELLCASETM S - WLCM / Semi Wafer Level Camera Module <半導体プロセス> TSV 貫通電極 F - WLCM / Full Wafer Level Camera Module <半導体プロセス> 50 / 88

CCv. P CSPベースリフローCamera Moduleの製法 Reflow Lens 一括積層 F-WLCM 個片化 Type-I WLO : Wafer Level Optics Sensor CSP Lens個片化 Hybrid : Heptagon/Anteryon Casting : AJI Type-II Single Base type Injection : Komatsulite Hybrid : SEIKOH GIKEN Lens搭載 Sensor CSP Holder Assy CSP個片化 AJI : Laser Dicing 組立 F- : Full- S-WLCM S- : Semi- CSCM Sensor CSP WLCM: Wafer Level Camera Module CSCM: Chip Size Camera Module 51 / 88

CCv. P イメージセンサ 用 CSP比較表 CSP ASET Tessera SHELLCASE® Series TSV (Through Si Via) 断面構造 Series SHELLCASE® OP OC RT MVP General Cover Glass 有 有 有 CG Adhesive 全面 周辺部 周辺部 透過率劣化 ( % ) ▼ 30%程度 ▽ 4%程度 Substrate Glass Resin None μレンズ対応 X ○ ○ 接続Pad位置 Chip 端面 Chip内任意 総厚 > 900μm < 600μm < 500 μm 53 / 88

CCv. P Product/Process Flow Parts Camera Module Reflowable Camera Module Product/Process Flow Sensor Chip Holder Lens Cover Glass Mount Washing AR dep. Aperture IRCF WLO AR dep. Lens attach Aperture print TSV Process Ap. attach IRCF dep. Lens attach Solder Ball Mount Lens attach Singulation Holder Assy attach Optical Black CSCM Semi WLCM Singulation {Printing or Holder} Optical Black Full WLCM 54 / 88

CCv. P Comparison Conventional Camera Module with Reflowable Camera Module Conventional Camera Module Lens Holder Reflowable Camera Module Lens Barrel Lens Appearance and Structure Aperture Shade Lens Cube ( with IRCF & Aperture ) Lens Holder Lens IRCF Aperture IRCF Bonding wire Substrate SMD Image Sensor (CSP) S-WLCM CSCM Classification Full Assembly type Lens Thermo Plastics Casting Hybrid GMO/Thermoset/MSG® No. of parts 9 2* 3 5 Assembly Technology : Need X , Needless O SMT X O O COB X O O Clean Room X : < Class 100 O : >>Class 1000 △ : < Class 1000 Optical Assy X O X Washing X : PCB Assy, Holder O O Jisso (User) X : Connector or FPC O : SMT * : Shade make by printing 55 / 88

CCv. P 1. Smartphone/Tablet PC/ Camera Moduleの市場動向 2. Camera Moduleのリフロー化 3. リフローCamera Module用Lens耐熱化技術 まとめ 56 / 88

CCv. P Hybrid-Lens & Casting Lens断面構造の差異 Hybrid Lens 断面構造図 1 st Lens Wafer Spacer 2 nd Lens Wafer Spacer Image Sensor Wafer Casting Lens 断面構造図 Bulk Typeで 「コバ」が一体成型できる為、スペーサーが不要となる 1 st Lens Wafer 2 nd Lens Wafer Image Sensor Wafer 65 / 88

CCv. P Wafer Level Lens Disk Master 製造方法 – I (AJI製の場合) 上　面　図 側　面　図 Master Tooling Glass Disk Dispenser UV Light 採用Maker : Casting Lens : KINIK, / Hybrid Lens: Hi-Max, Vis. Era (Omni. Vision) 66 / 88

CCv. P Golden Master Wafer Level Optics 「電鋳」方式による金型製造方法 Father 製造 Father Mother 製造 Mother Stamper 製造 UV硬化樹脂用 透明型 Stamper 上型 Step & Repeat negative Disk Master Father Mother positive negative positive Father Mother Stamper 下型 型の状態 negative 上型 下型 Step & Repeat Disk Master 電鋳技術で転写 Father 電鋳技術で転写 Mother 熱硬化樹脂用 金型 電鋳技術で転写 67 / 88

CCv. P Casting Lens 製造装置 AJI製 製造装置：LMF 6000 AJI製 Master Disk 製造装置：LMF 6000 AJI製 製造装置：MWC 6000 AJI製 WLO 製造装置：MWC 6000 200 mm 電鋳型の事例 Casting 製法 WLOの事例 写真提供：AJI(株) 68 / 88

CCv. P Hybrid Lens Master Disk 製造装置 nm精度を確保するため、コマの加 時間は 4~8 H 4, 000 Cavでは 加 時間は？ 4, 000 x 4 = 16, 000 H ? 個別加 型挿入方式 直接加 方式 採用Maker : Hybrid: Heptagon, Anteryon, Others 69 / 88

CCv. P 各種Reflowable Lensの金型精度比較 Golden Master 加 方法 Casting Lens 精度 nano 加 機 PV ： 10 nm前後 切削・熱加 P ： Not Exist Disk Master 加 方法 精度 Step & Repeat UV 非熱加 PV ：数 10 nm P: ≦ 1μm 電鋳 非熱加 PV ：数 10 nm P: 1μm PV ： 100 nm P: tact 依存＊ PDMS 成型 PV ： 100 nm P: 5~10μm Hybrid WLO Not Exist Direct Cutting 切削・熱加 MSG® Lens Not Exist PV: Peek & Valley Stamper nano 加 機 PV ： 10 nm前後 切削・熱加 P ： Not Exist P: Pitch Feの温度による寸法変化 ＊）Hybrid WLOでは、数千の 　CavをDirect Cuttingするため 　Master Diskの冷却が不十分 　になる。左表から、熱の影響 　範囲が10 mm程度の場合でも 　加 熱が10℃残留していると 　pitchはこれだけで 1. 2μmずれ 　てしまう 70 / 88

CCv. P 様々な種類・製法のレンズの複屈折比較 Monolithic Lens Glass Mold Lens Hybrid Lens COP Lens 測定データ：(株)菱光社 http: //www. ryokosha. co. jp 提供 75 / 88

CCv. P Optical Glasses for Glass Mold Optics & Major Optical Plastic νd 2. 05 95 90 85 80 75 70 65 60 55 50 45 L-glass (FG, RP, Polished Ball) L-glass (Polished Ball) S-glass (RP, Polished Ball) Plastic (Injection Mold) 2. 00 1. 95 1. 90 30 25 20 L-NBH 54 L-LAH 83 L-LAH 53 L-LAL 13 1. 70 L-LAK 81 1. 80 L-TIM 28 1. 70 1. 65 L-BAL 35 L-BAL 42 L-PHL 2 1. 55 OKP 4 1. 50 PMMA 1. 45 1. 40 95 90 85 80 75 70 65 60 55 νd 1. 60 1. 55 Zeonex 480 R S-FSL 5 S-FPL 53 PC MS 200 EL L-PHL 1 L-BSL 7 S-FPL 51 1. 50 nd 1. 75 L-LAM 69 L-LAM 72 L-LAL 12 1. 65 1. 90 1. 85 L-LAM 60 1. 75 1. 60 15 2. 05 1. 95 1. 80 1. 45 35 2. 00 1. 85 nd 40 50 45 40 35 30 25 20 1. 40 15 （株）オハラHPより 76 / 88

CCv. P 各種Lensの月産数と投資額の関係 Lens Injection TP Injection TS GMO. M. D. Hybrid WLO MSG® Lens Cavity (p) Tact time (min) @Equipment Cost (M) @Die Cost (M) 12 0. 5 12 2 4 0. 5 x 15 1 0. 33 x 15 x/4 * 15 30 80 15 150 150 12 12 0. 5 x 20 ** 40 0. 5 x 10 *** 10 7 2, 750 2, 500 * : 8 x 8 cm を想定 ** : 20 Cav/1 Machine を想定 *** : 10 Cav/1 Machine を想定 Casting WLO Casting SLO Injection TS Tooling & Die Cost ( M ) 2, 250 2, 000 1, 750 1, 500 1, 250 1, 000 Casting WLO MSG® Lens 160 Casting SQL 628 Hybrid WLO 190 Injection TP 750 GMO M. D. 500 250 0 Format 1, 000 2, 000 3, 000 4, 000 5, 000 Production Volume by WLO (kp/M) 3 M 2 M 78 / 88

CCv. P 既存製法Camera ModuleとS-WLCMの仕様比較 Conventional Camera Module Lens Holder Lens Barrel S-WLCM Shade (Print) * Lens ( with IRCF ) Lens Appearance and Structure IRCF Bonding wire Image Sensor (CSP) Image Sensor Substrate (PCB) Number of the parts 7 2 (w/o Shade) Limit Dimensions 4. 5 x 4. 5 mm (Assemble NA) Image Sensor Size : about 2. 5 x 2. 5 mm 2. 5 x 2. 5 mm (Ball Pad neck) Assembling method (Handling limit size) Human / JIG (about : 5 x 5 ) SMT ( 0402) Assemble Cost High Low 100 ( Casting Method) 100 25 (AJI’s Casting Method ) Image Sensor Cost 100 About : 120~130 (VGA) Other material Cost Holder+Barrel+IRCF+B/W+PCB 0 Total Cost High Low Relative Lens material cost / VGA Relative Lens Machine cost / VGA 79 / 88

CCv. P Reflowable Camera Module Supply Chain Lens Maker / Method GMO Ether Konica-Minolta Module Maker Mobile Maker CSCM NOKIA Toshiba / VGA LG STMicro / VGA/2 M E-Pin Aptina / VGA Hybrid Heptagon Truly / VGA Omni. Vision / VGA Vis. Era (Omni) Himax / VGA Himax AAC / VGA Huawei S-WLCM Casting ZTE Sunny / VGA MSG® Lens Seiko-Giken KINIK SONY Cool. Pad Lenovo K-touch Kingpak Super. Pix / VGA Others Source：Techno System Research Report 2013. 06 81 / 88

CCv. P 1. Smartphone/Tablet PC/ Camera Moduleの市場動向 2. Camera Moduleのリフロー化 3. リフローCamera Module用Lens耐熱化技術 まとめ 82 / 88

CCv. P Image Sensor/Camera Moduleが使用される主要製品　 Tablet PC Mobile phone Automotive Smart TV PC Game Camera Moduleが使用される 主な製品 Image Sensorが使用される 主な製品 DSLR Compact DSC Security DVC Medical 83 / 88

CCv. P Image Sensor Application別出荷数量推移 Source : Techno System Research 2012. 12 7000 Others Shipment quantity (MUnit) ★　X 1/10 6000 DSLR 5000 Compact DSC Game 4000 Security 3000 Automotive 2000 PC 1000 Tablet PC Mobile CY ★ 2010 ★ 2011 2012 ★ 2013 ★ ★ 2014 ★ 2015 2016 ★ ★ 2017 ★ 2018 Application 84 / 88

CCv. P Image Sensor 主要アプリケーション別数量比率推移 10000 Tablet PC Source : Techno System Research 2013. 12 5000 4000 3000 Relative ratio 2000 基点 1000 Automotive 500 400 Mobile 300 Security 200 DSLR PC 100 50 40 30 CY Compact-DSC 2010 2011 2012 2013 2014 2015 2016 2017 2018 / 88

CCv. P 車載Cameraを利用するApplicationの詳細と関連法 略 号 Application Japanese Function Position View F R S Sensing In F R S IR In F In Related Laws ACC Adaptive Cruise Control 車間距離制御システム ● AEBS Advanced Emergency Braking Sys. 先進緊急ブレーキシステム ● Around view system 駐車・運転視界支援システム AHB Auto High Beam ライト自動切替えシステム BSD Blind Spot Detection 後側方死角検知システム ● ● Drive record ドライブレコードシステム ● ● Forward Collision Warning 前方衝突回避 In-car Drowsiness detection 居眠り防止用システム ISA Intelligent Speed Assist 速度制限標識認識システム ● Euro-NCAP LDW Lane Departure Warning 車線逸脱警報 ● NCAP/Euro-NCAP LKA Lane Keeping Assist 車線維持補助システム ● MOD Moving Object Detection 移動物検知システム NVS Night Vision System ナイトビジョンシステム PCW Pedestrian Collision Warning 歩行者衝突警報 PD Pedestrian Detection 歩行者検出 RCW Rear Collision Warning 後方衝突回避 TSR Traffic Sign Recognition 制限速度認識システム View System 視認補助システム FCW Position F : Front Camera R : Rear Camera S ● ● ● ▲ ● Euro-NCAP/ 大型車規制 ▲ ● High Beam Reg. ▲ ● ● ● NCAP/Euro-NCAP/ 大型車規制 ● ● ● ▲ ● ● Euro-NCAP ● ● ● : Side Camera In : In-car Camera ● ● : 必須 Galbransen law /rear ▲ : 必要な場合有 Source : Techno System Research 2012. 12 86 / 88