Budapest University of Technology Economy Department of Electron

Budapest University of Technology & Economy Department of Electron Devices http: //www. eet. bme. hu

The Department of Electron Devices • The only university department in Hungary dealing with all aspects of microelectronics. • Highly acknowledged European research center

The Department of Electron Devices Expertise in • device physics, • microelectronics CAD tools – esp. thermal simulation & circuit simulation, • IC & MEMS design, • gas sensors, • thermal issues, • multimedia, internet applications

Education (continued) Special subjects: – Microelectronics CAD (basic concepts in digital VLSI design, CAD systems, basics of layout level & analog design) – ASIC & FPGA Laboratory (design of an MSI circuit) – High level synthesis (VHDL, hardware synthesis methods) – VLSI Laboratory (introduction to Cadence Opus, design of a standard cell in Opus)

Education (continued) Special subjects: – Monolyth technology (+ processing practice in the semiconductor laboratory) – Integrated microsystems – Testing laboratory (for ICs, semiconductor materials, MEMS packages and structures, ) – Course laboratories (topics are selected from all above issues)

Research • European projects: BARMINT, THERMINIC, HIPERLOGIC, TALENT, DETERMIN, PROFIT, REASON, PATENT • • • thermal measurements (IR, LC, transient) thermal simulation thermal testing electro-thermal simulation compact dynamic thermal modeling MEMS design, simulation and characterisation

Research facilities Laboratories: • Thermal laboratories • VLSI CAD Laboratory • Semiconductor laboratory • FPGA Laboratory

Research facilities CAD Laboratory Facilities (hardware) – – – SUN Enterprise Ultra server, WNT server, 10 SUN workstations 100/10 Mbps LAN, 4 network printers 20 Linux workstations Tektronix LV 500 IC tester

Facilities • Installed software tools: – Cadence Opus • AMS 0. 8 • ST 0. 25 • Mietec 2. 4 • CMP MEMS Engineering Kit – Atmel-ES 2 SOLO 1400 (for education only) – HSpice, Spectre – THERMAN & SUNRED tools of Mic. Re. D

Facilities Using Cadence Opus in the SUN Laboratory

Facilities Tektronix LV 500 IC tester

Facilities - Thermal laboratory LC based thermal imaging system Aga 782 IR camera with PC interface

Facilities - Thermal laboratory Commercialized version of the transient tester The department’s thermal transient tester

Facilities - semiconductor laboratory Scanning electron-microscope with PC interface

Facilities - semiconductor laboratory Diffusion furnace Sputtering and evaporation are also available

Facilities - semiconductor laboratory Spreading resistance meter

Facilities - semiconductor laboratory …. without contacts on the surface

Some research results Design of CMOS temperature sensors Frequency output version Generic designs, almost process independent behavior

Some research results Design of thermal test dies Tester-on-the-die: dissipator + sensor + boundary scan - first realization 5 x 5 dissipator / sensor cells Following this experiences, a more sophisticated chip has been designed together with the Mic. Re. D company. . .

Some research results Design of thermal test dies Our recent design: 81 individually programmable dissipator / temperature cells with boundary scan interface: improved implementation of the two older designs, 6 x 6 mm 2, 8 W

Some former research results Electro-thermal simulation Experimental system implemented in Cadence Opus on top of the ECPD 07 design kit of Atmel-ES 2

Some former research results Liquid crystal thermal imaging of ICs

Some research results Sophisticated postprocessing of IR images Thermal transient recording using the IR camera

Some recent research results Thermal transient testing of IC packages Identification of properties of the chip-to-ambient heatconduction path based on thermal transient measurements The so called structure functions provide the required information

Detecting die attach and soldering failures The differential structure function of the reference device 1: the transistor case Rth of the soldering 2: the copper island of the mounting plate 3: the total mounting plate Rth of the plastic coating 4: the cold plate

Detecting die attach and soldering failures Comparison of the differential structure functions of C 02 and C 08 3 3 Rth between 2 and 3 increased The soldering error can be noticed even visually

Some recent research results Thermal transient testing of IC packages • Identification of properties of the chip-to-ambient heatconduction path based on thermal transient measurements • Identification of the partial thermal resistances in the heat flow path enabling detection of die attach and soldering failures • Calculation of effective thermal conductivity and emissivity values from the measured results, etc

Some recent research results Compact thermal model generation The generated BCI (Boundary condition independent) compact model A package

Some recent research results BCI Compact thermal model generation The transient results (FS=field solver, CM=compact model)

Some recent research results Investigation of surface potentials on different materials Vibrating capacitor with transparent reference electrode

Some recent research results Gas sensing: the adsorption induced shifts in work function differences at 460 -360 K (Pd-Ag-Au-Pt-V-Pt-Sn. O 2) (Kelvin method) 30 mm 460 K 25 mm C 360 K Pd Ag Au Pt 1% H 2 -air mixture NH 4 OH vapour (NH 3) V Pt Sn. O 2 CHCl 3 vapour C 2 H 5 OH vapour

Further research in progress • Enabling board level simulators to accept packages with their compact thermal models • Design for testability of MEMS structures • Thermal transient examination of power circuits • Development of a fast and user friendly electro-static solver • Development of a methodology to detect die attach failures in packages with transient thermal testing • Research in low power circuit design • Research in surface potential measurement • Development of gas sensors • Characterisation of solar cells by different methods, etc