BTe V Pixel Detector Pixel Module Assembly and
BTe. V Pixel Detector Pixel Module Assembly and Half-Plane Assembly Guilherme Cardoso James Fast C. M. Lei DOE CD-2/3 a Review of the BTe. V Project – December 14 -16, 2004 1
Pixel Module Assembly Tooling § Take advantages of ATLAS pixel detector experience Ø Port card (PC) to provide needed electrical circuitry and HDI holding by vacuum suction Ø Extra long tabs of high-density interconnects (HDI) to provide testing and burn in § Assembly steps summary: Ø Align and glue a pixel module (consisting of the sensor bump-bonded with read-out chips) to an HDI; Alignment tolerance : 100 microns Ø Wire bond all electrical connections except that for high voltage (HV) Ø For HV, solder a flex circuit to the HDI and bond the other end to the back of sensor with epoxy Wire Bonds HDI FPIX Chip Wire Bonds Data PIFC Power PIFC Decoupling Capacitors and Termination Resistors High Voltage DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei Sensor 2
Pixel Module Assembly Steps 1 & 2 Step 1 Step 2 Assemble PC on a vacuum chuck Align and glue HDI on PC Wire bond HDI to PC Test HDI for opened traces Align pixel module (PM) to PM vacuum holder PM with alignment targets at corners exposed PC vacuum chuck Port card (PC) DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 3
Pixel Module Assembly Step 3 spacers Position HDI with its vacuum chuck on to pixel module alignment jig Place spacers for PM vacuum plate (The thickness of the spacers will provide some clearance between pixel module and HDI) pixel module alignment jig DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 4
Pixel Module Assembly Step 4 Stationary Engage PM vacuum holder Align HDI to PM with the aid of CMM then vacuum hold the HDI vacuum chuck when done HDI with its chuck are moved freely under stationary PM DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 5
Pixel Module Assembly Step 5 Remove PM vacuum holder Change spacers (The thickness of the spacers will provide 50 micron glue between PM and HDI) Dispense epoxy on HDI Re-engage PM vacuum holder, and start gluing PM to HDI DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 6
Pixel Module Assembly Step 6 Glue flex circuit Flex circuit for HV connections Complete HV connections Wire bond PM to HDI Note: The flex circuit is already soldered to the HDI at this point DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 7
Pixel Module Assembly Step 7 HDI cover plate Transfer and fasten PC to HDI storage base plate Install HDI cover plate Conduct module burn in and testing DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 8
Pixel Module Assembly Step 8 Remove HDI top cover plate and base plate cutting slots on PC Fasten PC on its vacuum chuck Remove HDI to HDI wire bonds Cut HDI at designated slots of PC Pixel module formed and ready for halfplane assembly DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 9
Half-Plane Assembly § Module placement accuracy of 5 microns is required Ø Modules will be held by the HDI (wider section) so that fiducial targets at the sensor corners can be seen optically from the top Ø 4 -axis stages will be used for precise positioning of modules Ø Optical targets visible on both sides of the substrate will be used to tie the alignment of modules on one side of the substrate to the modules on the other side § Reliable gluing process is needed which will not damage the substrate or the sensors Ø Even, thin joints require significant gluing loads Ø Substrate must be supported from the back side with vacuum plates • For second side, support is through first side sensors DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 10
Half Plane Assembly Steps 0. Glue flex cables on substrate 1. Align and load modules on vacuum plate 2. Engage substrate into substrate holder then place on stage 3. Apply glue on substrate 4. Align substrate to modules and allow glue to cure 5. Flip the half populated substrate and vacuum plate holding the silicon modules 6. Repeat steps 1 and 4 with a new set of modules and vacuum plate. Half-populated substrate starts at step 2. 7. Wire bond HDIs to flex cables 8. Test all modules DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 11
The Module Placement Setup Vacuum plate for substrate Vacuum plate for modules Module is loaded individually with HDI side down onto module vacuum holder. 4 -axis stages on rail DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 12
Align and Load Modules on Vacuum Plate Module is aligned using 4 -axis adjustment of pick and place. A common coordinate system is used to align a full set of modules. Leaf springs provide vertical compliance. DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 13
Engage Substrate into Substrate Holder then on Stage Substrate on substrate vacuum holder All modules loaded – ready for substrate Cart for module installation moved away and vacuum chuck rotated out of the way. DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 14
Align Substrate to Modules and Allow Glue to Cure Leaf springs provide vertical compliance. 4 -axis adjustment of substrate to modules DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 15
Flip the Half Populated Substrate and Vacuum Plate Place the substrate with first set of modules underneath on stage. – Repeat Step 2. Second side modules aligned on another modules vacuum plate. – Repeat Step 1 for another side of modules placement DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 16
Finishing the Half-Plane Assembly Align substrate to modules and allow glue to cure. – Repeat Step 4 for another side of modules placement DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 17
Status of Half-Plane Assembly § Detailed fabrication drawings completed. § Parts are being made. DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 18
Summary § The pixel module assembly steps have been thought through. This design will be completed, prototyped and tested with prototype sensor and HDI when they are available. § The design of the half-plane assembly steps have been completed. Parts are being made and will be tested. DOE CD-2/3 a Review of BTe. V Project – December 14 -16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 19
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