Brief Status Summary on the FOPI CBELSA GEMTPC
Brief Status Summary on the FOPI / CB-ELSA GEM-TPC (PANDA prototype)
GEM-TPC … we made it on to the GSI calendar Playful fancywork ‚Jugendstil‘ Frame for High-Tec applications ‘GEM-Framer’ B. Voss Design by Sandra Schwab GEM-TPC PANDA Collaboration Meeting@GSI December 8 th 2009 2
Flanges … ready, awaiting assembly Assembly ongoing B. Voss GEM-TPC Thanks to Sandra Schwab & Joachim Weinert PANDA Collaboration Meeting@GSI December 8 th 2009 3
Pad-Plane … first quality checks on geometry n n Device under test n ‘Hexagon’ Pad-Plane n QA looking for shape distortions Design (42 bores) Circle radius: 175, 00 mm Ellipse rx : 174, 99 mm ry : 174, 02 mm n Excentricity: 0, 99985 n Deviations: Δrmax: 0, 11 mm n Δrmin : 0, 01 mm n n Fit n n Design goals accomplished B. Voss GEM-TPC PANDA Collaboration Meeting@GSI Tests by Eduard Traut December 8 th 2009 4
Read-Out Electronic … XYTER keeping its promises n 1 n-XYTER chip PCB Revision ‘B’ n 300µm thick silicon sensor strip ∼ 10 p. F n Am 241 radioactive source n Peaks: Pedestal, 26, 33, 60 ke. V n Resolution 6%, noise 427 e- n Work on 2 -chip PCB ongoing Design goals accomplished B. Voss GEM-TPC PANDA Collaboration Meeting@GSI Investigation by Rahul Arora December 8 th 2009 5
FEE-Cooling … simulating the interfaces Air, convection only n ≈ 100°C Paste, highly conductive ≈ 17°C n Conditions & Assumptions: n Tslot, mean 286 K (13°C) n PFEB n λgap(air, paste) 7 W 0, 02. . 7, 2 W/m. K Conclusions: n Heat transport by convection very inefficient (λpaste/ λair > 50) n Temperature@Aluminium-Backpanel 296 / 292 K for λ=0, 9 / 7, 2 W/m. K n All selected pastes applicable n Outer Cooling. Pot more critical overlap in slot smaller (4 / 4, 5 mm) Pastes mandatory Simulations by Daniel Soyk B. Voss GEM-TPC PANDA Collaboration Meeting@GSI December 8 th 2009 6
Field Cage Rohazell® with Kapton®/Al shield … work ongoing Kapton® reinforcement n CE-ELSA decision taken: ‘extended option’ 702 mm outer dimension Staggered strip line End. Cap Media. Flange mounting surface on Kapton® n Test specimen ‘Strip-line’ design in production (restarted) Outer & Inner Field. Cage n backside shifted by ½ Full-scale sample ordered (not visible) n Tools & infrastructure in production B. Voss GEM-TPC n CAD/CAM of foil-patching tools ongoing KW 52/2009 & KW 04/2010 n Preparatory work on the tools for flat samples and outer field-cage internally (GSI-MEWE) and externally ongoing KW 03/04 January 2010 n Steering unit needs upgrading KW 02/03 January 2010 PANDA Collaboration Meeting@GSI December 8 th 2009 7
GEM-TPC out-sourcing potential ? n ? ? ? Possible external support: Clamping structure n Cooling-Pot cover n n Additional remarks: The cooling structure (Cooling. Pot) of the GEM-TPC@ELSA will not contain PMMA but Aluminum instead n E-Beam welded media bridges n will be produced externally in between years ? B. Voss GEM-TPC PANDA Collaboration Meeting@GSI December 8 th 2009 8
GEM-TPC Rahul Arora Markus Henske Volker Kleipa Jochen Kunkel Christian Schmidt Sandra Schwab Daniel Soyk Ufuk Tuey Bernd Voss Jan Voss Joachim Weinert GSI crew members & tasks Test setup, Front-End Electronics (XYTER) Material tests, sensors, infrastructure, purchase Front-End Electronics (XYTER etc. ) Mechanics, drawings, simulations, assembly, tooling Front-End Electronics (XYTER) Part production, tooling , FOPI environment Simulations & FOPI Integration General mechanics, drawings ‚All & nothing‘, ideas & concepts, project & logistics General mechanics, material tests Part production, tooling … other members of the GEM-TPC Collaboration
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