Bluetooth Solutions Prize Drawing Fill out your Prize

Bluetooth® Solutions

Prize Drawing!! Fill out your Prize Drawing card for a chance to win a Free Bluetooth® Audio Evaluation Kit Pair with your Smartphone and start streaming music! Includes rechargeable Mini Speakers, Microphone and USB cable $169. 95 MSRP © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 2

Prize Drawing!! • Enter to win a unique experience to ride in Nuvation’s Electric Racecar! • Sign-up times available at Microchip’s Registration Booth © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 3

Bluetooth® Overview

Bluetooth® Overview Wireless Data Exchange Technology operating within the unlicensed ISM 2. 4 to 2. 48 GHz Band Created by Ericsson in 1994 to replace RS-232 cabling Managed by Bluetooth Special Interest Group (SIG) Over 16, 000 member companies Must be a member to use Bluetooth logo (no cost) © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 6

Bluetooth® Adoption Why should you consider Bluetooth for your design? Unlicensed ISM band (no licensing fees) Millions of smartphones You only need to design one side of the link Many User Interfaces available on phone Bluetooth devices expected to exceed 2 Billion in 2013 © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 7

Bluetooth® Markets Intended for simple cable replacement Convert legacy wired devices into wireless Smartphone is the key market driver Lots of widgets use the Smartphone as the interface Becoming a lifestyle hub Health/fitness Automotive Industrial control Home entertainment Home automation © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 8

Technical Basics

Bluetooth® Implementation Operates in the 2. 4 to 2. 48 GHz ISM Frequency Band Frequency Hopping Spread Spectrum (FHSS) 79 Channels Pseudo-Random Hopping Typically 1 Master Talking to 1 Slave Data transfer is usually bi-directional between Master & Slave Connection Process Discovery Pairing Authentication (optional) © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 10

Bluetooth® Versions Version Data Rate Maximum Application Throughput Version 1. 2 1 Mbit/s 0. 7 Mbit/s Version 2. 0 + EDR 3 Mbit/s 2. 1 Mbit/s Version 2. 1 + EDR 3 Mbit/s 2. 1 Mbit/s, SSP (secure simple pairing) Version 3. 0 + HS 24 Mbit/s Co-located Wi-Fi®, AMP (Alternate MAC/PHY) Version 4. 0 Low Energy (LE) + Classic (EDR) + HS © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 11

Bluetooth® 4. 0 Adds LE (Low Energy) to Classic (BT BR/EDR) Single Mode LE only Low Duty Cycle, Low Latency Ultra Low Power (ULP): <15 m. A vs. 26 m. A for Classic Not backward compatible to a Classic-only device Can only talk to another LE or Dual Mode device Dual Mode Supports both LE and Classic Not optimized for ULP operation Has the capability to talk to another Single or Dual mode device © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 12

BT Classic vs. BTLE Technical Specification BT Classic BTLE Frequency 2. 4 GHz Range 10 -100 m Data-rate 1 -3 Mbps 1 Mbps Application throughput 0. 7 – 2. 1 Mbps 305 kbps Max Nodes 7 No limit Security 56 -128 bit Robustness FHSS Latency +100 ms <6 ms Audio Yes No Profile Support Yes VERY limited © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 13

BT Low Energy (BTLE) Modes Bluetooth® Smart Ready devices such as phones, PCs, tablets and TVs sit at the center of consumers' connected world – DUAL MODE Bluetooth Smart devices like heart-rate monitors, glucose meters, key fobs for cars and a wide variety of health and fitness sensors are ready to connect to Bluetooth Smart Ready devices and expand the consumer's digital experience – SINGLE MODE © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 14

Bluetooth® Classes Output power and typical range Class Maximum Power Range (m) Range (ft) (m. W) (d. Bm) Class 1 100 20 ~100 ~328 Class 2 2. 5 4 ~10 ~33 Class 3 1 0 ~1 ~3. 3 © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 15

Bluetooth® Profiles What is a Bluetooth Profile? Describes services & capabilities supported by the device Both Host and Client must support the same profile(s) Profiles are defined by the Bluetooth SIG Only a few are used in most applications Advanced Audio Distribution Profile (A 2 DP) Attribute Profile (ATT) Audio/Video Remote Control Profile (AVRCP) Basic Imaging Profile (BIP) Basic Printing Profile (BPP) Common ISDN Access Profile (CIP) Cordless Telephony Profile (CTP) Device ID Profile (DIP) Dial-up Networking Profile (DUN) Fax Profile (FAX) File Transfer Profile (FTP) Generic Audio/Video Distribution Profile (GAVDP) Generic Access Profile (GAP) Generic Attribute Profile (GATT) Generic Object Exchange Profile (GOEP) Hard Copy Cable Replacement Profile (HCRP) Health Device Profile (HDP) Hands-Free Profile (HFP) Human Interface Device Profile (HID) Headset Profile (HSP) Intercom Profile (ICP) LAN Access Profile (LAP) Message Access Profile (MAP) Object Push Profile (OPP) Personal Area Networking Profile (PAN) Phone Book Access Profile (PBAP, PBA) Serial Port Profile (SPP) Service Discovery Application Profile (SDAP) SIM Access Profile (SAP, SIM, r. SAP) Synchronization Profile (SYNCH) Video Distribution Profile (VDP) Wireless Application Protocol Bearer (WAPB) © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 16

Microchip Supported Profiles Audio Profiles A 2 DP - Advanced Audio Distribution Profile allows for wireless distribution of stereo audio HFP/HSP - Hands Free & Headset Profiles allow for voice type communication AVRCP - Audio Video Remote Control Profile, allows for basic play/pause, next/previous type media control Data Profiles SPP - Serial Port Profile for bi-directional data communication i. AP - i. Pod® Accessory Profile for i. OS devices BTLE / BT Smart (still in development) © 2013 Microchip Technology Incorporated. All Rights Reserved. AVCTP (Audio Video Control Transport Protocol) Bluetooth® Stack Layers Slide 17

Serial Port Profile (SPP) Emulates COM Port over Bluetooth® Cable Replacement Applications Bluetooth driver on host computer creates a virtual COM port after successful pairing When COM port is open on the Host side, the Bluetooth connection to the slave is opened © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 18

Human Interface Device (HID) Single direction communication Use Serial Port Profile for bidirectional applications Host loads HID driver after successful pairing Standard interface across platforms Microchip supports unique features ASCII translation (raw data packetized automatically) Consumer reports (Hot Keys) Apple virtual keyboard control (i. OS soft keyboard) © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 19

Connection Process 3 -Step Process: Discovery Scan to see what other devices are out there Pairing Information (types, services, addresses) exchanged between 2 devices Authentication Required if either device requests it e. g. PIN code is verified Once session has started, a 128 -bit Secure And Fast Encryption Routine (SAFER) is used © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 22

Pairing Modes Required if either device requests pairing e. g. PCs, Android™, Apple® products Microchip supports all 4 types of Pairing Modes No PIN – just connects automatically PIN code – e. g. 4 -digit code required Keyboard I/O User must verify a 6 -digit code on device Secure Simple Pairing (SSP) Does not require PIN code exchange Specified in Bluetooth® 2. 1 + EDR Supports the “Just works” mode in Android devices © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 23

Microchip Solutions

Two Design Approaches Stack/Profiles on Board Stack/Profiles off Board Host Controller Interface Simple to integrate 90% of use cases Any microprocessor or No microprocessor Focus on the Application, not the Bluetooth® profiles Flexible design, allows for additional profiles Lower cost module Longer time to market Increased engineering development cost © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 25

Bluetooth® Family of Modules RN 41 / RN 41 N RN 42 / RN 42 N RN 52 Type Class 1 Bluetooth 2. 1 Class 2 Bluetooth 3. 0 Interfaces UART / USB Analog speaker and mic, I 2 S, S/PDIF, PCM, UART Profiles SPP / HID / i. AP / HCI A 2 DP / ARVCP / HSP / HFP / SPP / i. AP Power 3. 3 VDC Antenna ceramic on board PCB Size 13. 4 mm x 25. 8 mm x 2 mm 13. 5 mm x 26 mm x 2. 7 mm Certification FCC / CE / IC Chip CSR BC 04 CSR BC 05 © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 26

RN 52 Bluetooth® Audio Module On-board Bluetooth 3. 0 stack Designed for glitch free audio in noisy Digital RF environments Compatible with ALL earlier version Bluetooth stacks Profile support (A 2 DP, AVRCP, HSP, HFP, SPP, i. AP*) Analog and Digital Audio interfaces Command interface and GPIO Compact Footprint 13. 5 x 26 x 2. 7 mm Integrated antenna Fully Certified FCC, IC, CE, Ro. HS • *Note: i. AP support subject to customer MFi membership © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 27

Simple Data Pipe Solution (RN-41 & RN-42) • A • B Data Mode (Default State) Data pipe termination points can be UART or COM Port Data written to UART sent out over Bluetooth® Data received over Bluetooth read from UART Command Mode ($$$) Special configuration mode entered using $$$ Used to configure parameters (e. g. baud rate, device name, PIN code, etc. ) Always configurable from UART 60 sec configuration timer disables command mode on Bluetooth side © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 28

Audio and Data Pipe Solution (RN-52) Audio Data • A • B UART Bluetooth Protocol CMD • GPIO 9 • A • B • RN 52 • Bluetooth Module Audio and Data is transferred across the Bluetooth® link Commands and configuration over the Data UART GPIO 9 LOW puts the module into Command Mode Does not support over-the-air configuration Unlike RN 41 and RN 42, “$$$” is NOT required Must wait for CMD and END strings on UART before sending data again Does not affect Audio streams Examples of Configuration Set commands Switch audio interface Control connections Example of Action commands for Audio (A 2 DP) and Voice (HFP/HSP) Play, Pause, FFWD Accept and drop calls © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 29

Audio Codec Support Onboard Codec support SBC: Bluetooth SIG default Required for every device using A 2 DP profile apt. X: High fidelity & low latency Licensed by CSR Customer must sign and pay for license agreement Per module royalty, Special MCHP part number AAC: Apple proprietary Licensed by VIA Per module royalty, Special MCHP part number Off Board Up to customer © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 30

Apple® & Bluetooth® Apple controls proprietary data links to the i. Phone® / i. Pad® / i. Pod® Physical cables 30 pin Apple connector Bluetooth; exceptions are HID and Headset profiles ‘Made for i. Pod’ program All accessory connections MUST have an Apple Authentication chip MFI requires project plan to be approved Ensure quality customer experience Self test for interoperability & compatibility © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 31

Modules that Simply Work with i. Pad® and i. Phone® Built in support with i. Pad, i. Phone, i. Pod® Fully tested and qualified with Apple MFI Saves customer development time & money Tried & tested in real-life volume applications Same module works with PCs & Android™ Customers must be part of MFI program To buy Roving development kit To buy authentication chips © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 32

i. AP: Apple® Authentication System Architectures © 2013 Microchip Technology Incorporated. All Rights Reserved.

i. AP: Microchip Development Kit Main Development Board RN-4 x-APL module Apple authentication co-processor Status LEDs Power regulation RS-232 & TTL signals Four RN-4 x-APL Modules Used with custom prototype PCBs Complete Design Documents Schematics Integration guidelines Source Code for Microchip Diagnostic Application © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 34

Bluetooth® Evaluation Kit Hardware RN-4 x-SM Evaluation Board Contains RN-4 x module USB/FTDI serial interface Status LEDs Quick setting(s) jumpers Auto-connect modes Factory reset Baud rate (9600 or 115, 200) RN-41 -EK Dip switches on bottom to configure Mode Configuration Mode Boot / Remote Config Discoverable / Idle Connected Green LED Status Fast (10/sec) Medium (2/sec) Slow (1/sec) ON (Solid) © 2013 Microchip Technology Incorporated. All Rights Reserved. RN-42 -EK Slide 35

RN 52 Evaluation Kit Features Status LEDs Basic track control buttons Stereo Mic. in / Speaker out ports HW Interfaces Analog Audio I/O Digital Audio I 2 S, SPDIF PCM port – use with external codec’s External PA GPIO Interface USB power and Console i. AP authentication chip footprint Firmware Capabilities In the field Firmware upgrade Device Firmware Update (DFU) ASCII Command Interface © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 36

External Stack Flexibility to choose Bluetooth® radio Microchip development environment for stack/profiles Discoverable only device SPP, Apple®, and Android™ support The product needs to be certified by the customer 3 rd Party Bluetooth® Radio/ Baseband HCI (UART) 16 -/32 -bit PIC® MCU 115. 2 Kbps Bluetooth Stack & Profile + Application(s) © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 37

Resources

Microchip Website http: //www. microchip. com/bluetooth © 2013 Microchip Technology Incorporated. All Rights Reserved.

Summary Module and stack based solutions Fully certified modules: FCC, CE, IC, Supported Profiles: SPP, i. AP, HID, A 2 DP, HFP/HSP, AVRCP HCI modes (fully certified) for Stack-Off-Board Profiles run on-board the module Reduces customer development time Faster time to market RN 41 and RN 42 are footprint and API compatible Evaluation kits: RN-41 -EK and RN-42 -EK © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 41

This presentation was brought to you by Visit www. digikey. com/microchipdiscount for Design West 2013 Special Discounts Digi-Key Coupon also included in training bag © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 42

Questions?

Thank You

Trademarks The Microchip name and logo, the Microchip logo, ds. PIC, Kee. Loq logo, MPLAB, PICmicro, PICSTART, PIC 32 logo, rf. PIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U. S. A. and other countries. l Filter. Lab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U. S. A. l Analog-for-the-Digital Age, Application Maestro, chip. KIT logo, Code. Guard, ds. PICDEM. net, ds. PICworks, ds. SPEAK, ECAN, ECONOMONITOR, Fan. Sense, HI-TIDE, In‑Circuit Serial Programming, ICSP, Mindi, Mi. Wi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, m. Touch, Omniscient Code Generation, PICC-18, PICDEM. net, PICkit, PICtail, REAL ICE, rf. LAB, Select Mode, Total Endurance, TSHARC, Uni. Win. Driver, Wiper. Lock and ZENA are trademarks of Microchip Technology Incorporated in the U. S. A. and other countries. l SQTP is a service mark of Microchip Technology Incorporated in the U. S. A. l All other trademarks mentioned herein are property of their respective companies. l © 2013, Microchip Technology Incorporated, All Rights Reserved. l © 2013 Microchip Technology Incorporated. All Rights Reserved. Slide 45