Beamformer Feeding Board Design and IC Package EM

Beamformer Feeding Board Design and IC Package EM Simulation Presenter: Tailei Wang Supervisor: Aurore Savoy. Navarro Steve Torchinsky Sangitiana Rakotozafy Harison

Outline • Introduction of the Square Kilometer Array (SKA) and Octagonal Ring Array (ORA); • Printed Circuit Board (PCB) design in Altium; • Board Electromagnetic (EM) Simulation in Hyper. Lynx; • Integrated Circuit (IC) Package EM Simulation in ADS and Hyper. Lynx; • Future Work and Acknowledgement. 2/20

SKA and ORA Collecting area: 1 million m 2 Spread over thousand kilometers 3/20

Introduction of the Board 4/20

Step 1: Board Design in Altium 5/20

Step 2: Layer Stack of the Board Total Thickness: 1. 59 mm 6/20

Step 3: EM Simulation with Hyperlynx 7/20

The Influence of Metal Via With metal via Without metal via 8/20

The Influence of Dielectric Constant Variation 9/20

Step 4: Line Simulation with Hyperlynx 10/20

Step 5: Prototype of the Board Size: 162 mm*41. 3 mm 11/20

Package EM simulation in ADS Why do we need to do the simulation? • IC characterization is no longer limited to the IC itself, as we know, ICs need to be packaged, so the packaging and bondwire will affect the performance. • Accurate prediction of the affects of package and bondwire at high frequency is increasingly important as ICs continue to shrink and to operate at higher frequencies. 12/20

An Example of Filter designed for 7 GHz 9 GHz 13/20

View of the Filter with Package in ADS 14/20

Simulation Results 15/20

Bondwire Length Influence 16/20

17/20

Future Work • Manufacture the board; • Connect with the beamformer board and Antenna and measurement; • Further EM simulation about QFN package in Hyper. Lynx, like adding IC and other package types; • Writing Hyper. Lynx Package • Learn LNA and filter design. EM simulation manual; 18/20

Acknowledgement • This work is supported by EU FP 7 -PEOPLE-2012 -ITN project nr 317446, INFIERI, “Intelligent Fast Interconnected and Efficient Devices for Frontier Exploitation in Research and Industry”. 19/20

Thank YOU 20/20