B M T I MTIs High reliability Radiation

B M T I MTI’s High -reliability Radiation Hardened FPGA and ASIC Soluti Beijing Microelectronics Technology Institute Пекинский институт микроэлектронной техники 2019. 9

Speaker Profile Dr. CHEN Lei , born in Nov. 1978, is currently vice director of Beijing Microelectronic Technology Institute (BMTI). As a professor , Dr. Chen is a Master supervisor in BMTI, where his research activities mainly focus on core space and military level IC designing , verification and testing. Dr. Chen received his degrees from Northwestern Polytechnic University: B. S. (2000) in Electronic Information Technology , M. S. (2003) in Electronic Circuit and System and Ph. D (2006) in Computer Science and Technology. He was a visiting scholar in UCLA EE Faculty (2012~2013). Dr. Chen won support from “Young Top-notch Talent Plan” of Chinese government’s “ Ten Thousand Talents Project”. He has taken 23 national projects with respect to space level devices. He has published 71 papers in domestic and international scientific journals and conferences, including 5 papers in FPGA 2009/2013/2014/2015(ACM/SIGDA International Symposium on Field. Programmable Gate Arrays) and one paper in RADECS 2018. He owns 55 patents and guided 9 masters.

01 Content BMTI Profile 02 Radiation Hardened FPGA Solution 03 Radiation Hardened ASIC Solution

01 BMTI Profile

Institute Introduction Beijing Microelectronics Technology Institute (BMTI) was founded in 1994, which is an important unit of the 9 th Academy, CASC. BMTI’s headquarter is in Beijing, a branch in Xi’an and offices in Shanghai and Shenzhen. BMTI is a main R&D and manufacturing entity for space and military qualified microelectronic components in China. The radiation hardening technology of BMTI has reached advanced international level.

Business Scope BMTI is a major radiation hardened IC design entity in China. BMTI has provided various IC and packaging & testing services for customers worldwide. Annual Revenue Up to 200 million dollars/year , in which space level products account for 65 ％. Employees BMTI has 881 employees with about 494 designers, of which the one with degree on master or above taken up 80％.

BMTI Radiation Hardening Center Radiation Hardening Design Team Product Design Center FPGA design Team Packaging and Testing Center Packaging and Testing Team So. C/CPU design Team Radiation Hardness Test Team ASIC design Team Radio Frequency design Team ADC/DAC design Team Memory design Team Bus/Interface design Team …… Reliability Examination Team

Milestones of BMTI 2003 2005 First domestically selfdeveloped large scale IC with 1µm process applied on satellite with 14 years’ flight experience and no fault. First domestically self-developed radiation hardened AD/DA applied on satellite with more than 10 years’ flight experience. 2007 First domestically self-developed 300 k system gates ASIC with 0. 5µm process applied on satellite. 2009 First domestically selfdeveloped radiation hardened 1553 B Bus Controller and radiation hardened 300 k system gates FPGA applied on satellite.

Milestones of BMTI 2010 First domestically self-developed radiation hardened 3 million system gates ASIC with 0. 18µm process applied on satellite. 2011 Self-developed high performance radiation hardened CPU (BM 3803) applied on satellite. 2013 Self-developed high performance radiation hardened 4 M Memory applied on satellite. 2014 BMTI has realized the Chinese high-end space level devices exported to internationalmarket for the first time (Germany and Russia).

Milestones of BMTI 2016 First domestically self-developed radiation hardened 20 million system gates ASIC with 65 nm process applied on satellite. 2017 BMTI has realized the Chinese high-end space level devices exported to France(Thales. Alenia) and Swiss for the first time. 2018 2019 BMTI has realized the Chinese radiation hardened 65 nm IC design service export abroad for the first time. BMTI has exported product to Spain market for the first time. Virtex 5 series FPGA have been applied on satellite.

Competitive advantages 1 Advanced Radiation Hardening Technology üAdvanced Radiation Hardening By Design Technology üAdvanced Hardness Assurance Testing Technology 2 Advanced micro-system integration Technology üVarious core IPs üCustomized packaging design

Packaging & Testing Ability 01 02 l. BMTI owns the most advanced military and space level ceramic packaging line in China l. Supporting CCGA/CBGA/CQFP/MCM/3 -D packaging etc. l. Packaging Ability: 600 k ICs annually l. Testing and reliability examination equipments and technology of BMTI support a complete production flow l. Supporting mass production test l. Testing Ability: FPGA/CPU/So. C/RF/ADC/DAC/Memory etc.

Product Family ØBasically, over 300 types of ICs from BMTI contributed to the product family of China space qualified microelectronic components and served over 30 national space projects. ØLogic processing unit is the core of signal processing system. BMTI offers highreliability radiation hardened logic processing solutions, such as FPGA solution and ASIC solution. Signal Processing System FPGA ASIC

02 Radiation Hardened FPGA Solution

Radiation hardened FPGA Solution Radiation hardened FPGA is the prior choice of core devices, and is widely used in satellite attitude control , image processing and data chain.

Radiation hardened FPGA Only two types of radiation hardened FPGA are appropriate worldwide: anti-fuse based FPGA of Actel (now Microsemi) and SRAM based FPGA of Xilinx. Radiation hardened FPGA Anti-fuse based FPGA SRAM based FPGA Latest Product： l. RTAX_D Series l. System Gates: 4 Million l. Process: 0. 13μm l. Maximum Frequency : 300 MHz Latest Product： l. Virtex-5 QV Series l. System Gates: 13 Million l. Process: 65 nm l. Maximum Frequency : 450 MHz

Anti-fuse based FPGA Roadmap of Anti-fuse based FPGA Advantages Ø Immediately usable when power-on Ø Lower power-consumption Ø Higher SEU threshold Disadvantages Ø Only one-time programmable, can not reconfiguration in orbit Ø Resource is poor and 2 -3 generations behind the key space level devices Ø Anti-fuse process is co-developed and owned by Actel and UMC Due to the limitation of the process, the anti-fuse FPGA has not launched new products for 10 years.

SRAM based FPGA Roadmap of SRAM based FPGA Advantages Ø Infinite time programmable Ø Use the most advanced process, have high density and fast frequency Disadvantages Ø Memory lost when power down, need external memory device Ø SEU sensitive, need mitigation strategies SRAM based FPGA takes the leading position on system gates, operating All the radiation hardened FPGAs of Actel and Xilinx are embargo to frequency, and IP varieties. It presents the developing direction of the China under ITAR. space level FPGA.

Technology Roadmap of BMTI’s FPGA Product Unreported BMTI focuses on self-developed Space ? ? Virtex-5 QV (65 nm) Level SRAM based FPGA, completely compatible with the products of Xilinx, *BQR 7 V 690 T *BQR 7 V 1140 T (28 nm) Qpro-R Virtex -4 (90 nm) Qpro-R Virtex. II (0. 15μm) Qpro-R Virtex (0. 22μm) BQR 5 VSX 95 T BQR 5 VLX 155 T (65 nm) l. The BQVR and BQR 2 V Series are mature l. The BQR 5 V Series are the most advanced Xilinx Products BMTI Products BQVR 300 RH (0. 25μm) 2005 development. products , and widely used. BQR 2 V 1000 BQR 2 V 3000 BQR 2 V 6000 (0. 13μm) 2000 support ISE software of Xilinx for 2010 * Means products under development space level FPGAs at present, and have been released in 2018. l. The BQR 7 V Series are under development. 2015 2020 Year

SEU mitigation strategy of Xilinx Due to SRAM based FPGA is SEU sensitive, Xilinx provide several mitigation strategies, including: Ø TMR Ø Scrubbing Ø TMR + Scrubbing TMR is the most common method, it can provide more protection with more resource and more complexity. Scrubbing is an alternative method, it will improve the radiation performance of FPGA in system level. Source: www. xilinx. com

Regular Radiation hardened Solution TMR can be implemented through XTMR Tool , provided by Xilinx. TMR Design TMR can be implemented through XTMR Tool provided by Xilinx. Space Level External PROM Scrubber Space Level FPGA In the regular solution, Space Level FPGA and PROM are all from Xilinx. Scrubbing is implemented through a Anti-fuse FPGA Space Level l. RTAX-S Series PROM l. RTAX-D Series l. XQR 17 V 16 (Code Needed) Space Level FPGA l. Qpro-R Virtex-II l. Qpro-R Virtex-4 l. Virtex-5 QV Regular Radiation hardened Solution separate anti-fuse FPGA device from Actel. Customized scrubbing code is needed.

Radiation hardened Solution of BMTI All the Space Level Devices of ACTEL and Xilinx are embargo to China under ITAR. BMTI provides the alternatives for China Aerospace. All the FPGAs of BMTI support XTMR Tool TMR Design (XTMR Tool) All the FPGAs of BMTI support XTMR Tool, provided by Xilinx. BMTI has series mature space level FPGAs BMTI External Space Level Scrubber PROM Space Level FPGA Space Level Scrubbing Chip PROM l BSV 1 CQRH l. B 18 V 04 RH l BSV 2 CQRH l. B 17 V 16 RH l BSV 5 CBRH Space Level FPGA l BQVR Series l BQR 2 V Series l BQR 5 V Series Radiation hardened Solution of CASC include BQVR Series and BQR 2 V Series, and BQR 5 V Series. BMTI developed specialized scrubbing ASICs to replace anti-fuse based FPGA, in order to save development time and cost.

Product Roadmap of BMTI’s FPGA Product B 50601 RH， 6 A FPGA Scrubbing Chip PROM Power Management B 17 V 16 RH B 18 V 04 RH BSV 5 CBRH BSV 2 CQRH *BQR 7 V Series , 100 M Gates BSV 1 CQRH BQR 5 VSX 95 T , 9. 5 M Gates BQR 5 VLX 155 T , 15 M Gates BQVR 300 RH , 300 K Gates 2009 BQR 2 V 1000 , 1 M Gates BQR 2 V 3000 , 3 M Gates BQR 2 V 6000 , 6 M Gates 2013 2017 * Means products under development 2020 Year

FPGA Devices of BMTI ØBQVR, BQR 2 V and BQR 5 V series are mature products, and widely used in China, which have already exported to Russian and France market. Device System Gates Maximum Frequency User I/O Package Compatible Device IP Cores Radiation Hardness BQVR 300 RH 300 K 180 MHz 162 CQFP 228 XQVR 300 DLL TID ≥ 100 Krad(Si) SEL ≥ 75 Me. V·cm 2/mg SEU≥ 15 Me. V·cm 2/mg BQR 2 V 1000 1 M 300 MHz 328 CBGA 575 XQR 2 V 1000 BQR 2 V 3000 3 M 300 MHz 516 CCGA 717 XQR 2 V 3000 BQR 2 V 6000 6 M 300 MHz 824 CCGA 1144 XQR 2 V 6000 BQR 5 VSX 95 T 9. 5 M 450 MHz 640 CCGA 1136 XQR 5 VSX 95 T BQR 5 VLX 155 T 15. 5 M 450 MHz 680 CCGA 1136 XQR 5 VLX 155 T - means product has been exported. DCM, BRAM, Multiplier Blocks CMT, BRAM, DSP, MAC, PCIe, Rocket IO TID ≥ 100 Krad(Si) SEL ≥ 75 Me. V·cm 2/mg

FPGA Devices of BMTI 1) BMTI FPGAs have the same ceramic package with the products of Xilinx, and are pin to pin compatible. 2) BMTI FPGAs support all software tools of Xilinx(such as ISE, XTMR Tool) and third-party synthesize and simulation tools. Don’t need dedicated software. Software ISE Foundation Synplify Pro ISE Web. Pack FPGA Express/ FPGA Compiler ISE 9. xi Xilinx Tools ISE 10. xi XST Other Tools Leonardo. Spectrum Active HDL ISE Simulator Model. Sim Xpower VCS Chip. Scope Pro NC-Sim XTMR Tool

Scrubbing chips of BMTI include 3 products, supporting different FPGA series. Product BSV 5 CBRH (Under Development) lsupports Virtex 5 and BQR 5 V series l. Package: CBGA 256 BSV 2 CQRH l. Supports Virtex 2 and BQR 2 V series l. Package: CQFP 48 BSV 1 CQRH l. Supports Virtex and BQVR 300 RH l. Package: CQFP 44 2005 2009 2013 2017 Year Features: l. Specialized External Scrubbing ASICs, don’t need scrubbing code. l. Designed with BMTI radiation hardened platform , SEU ≥ 37 Me. V·cm 2/mg. l. The type of the target FPGA can be identified automatically. l. The operation is user-friendly, only one clock and a few control signals are necessary.

Radiation hardened Solutions of BMTI The 1 st generation solution of BMTI for China Aerospace. BMTI B 18 V 04 RH & Xilinx XQR 18 V 04 XQR 17 V 16 BSV 1 CQRH BQVR 300 RH The 2 nd generation solution of BMTI for China Aerospace. BSV 2 CQRH Xilinx XQR 18 V 04 XQR 17 V 16 BQR 2 V series FPGA

Next Generation Solution of BMTI’s FPGA The next generation products of BMTI will provide a world-leading radiation hardened solution. BQR 5 VSX 95 T/LX 155 T BSV 5 CBRH B 17 V 16 RH B 50601 RH l The most advanced space l. Support Virtex 5 and BQR 5 V l 16 Mbit Configuration PROM l. Pin to Pin compatible with level FPGAs at present Series FPGA l. Pin to Pin compatible with TPS 50601 -SP l. Pin to Pin compatible with l. Include a UART port to XQR 17 V 16 of Xilinx l. Peak Efficiency: 90% (3. 3 V) Virtex 5 Series of Xilinx monitor SEU status l. Programming support by l. Split Power Rail: 1. 6 V to 6. 3 l. IP Core: MAC, PCIe, l. Maximum frequency : 20 MHz Xilinx IMPACT with Cable V on PVIN Rocket. IO… l. Scrubbing methods: Blind or USB II or BMTI programmer l. Point of Load Regulation l. No dedicated software is Readback l. Support FPGA products of l. Adjustable Slow Start and Xilinx and BMTI Power Sequencing needed for development.

03 Radiation Hardened ASIC Solution

Radiation-Hardened ASIC Solution FPGA vs. ASIC FPGA and ASIC are two main-stream solutions for logic processing in space. Compared to FPGA solution, radiation-hardened ASIC has advantages in: Radiation hardness Low/Medium High Source: NASA JPL, radiation hardened FPGA/ASIC solutions, 2008 Ø Higher radiation hardness Ø Higher density Ø Lower power consumption

BMTI’s Radiation-Hardened ASIC Solution Radiation-hardened ASIC has proven itself necessary and successful as a mission-critical part, and ASIC solution has been widely applied in China, U. S. and Europe Aerospace Ø BMTI delivered China’s first radiationhardened ASIC in early 2000’s Diagram of a typical RH ASIC Layout Ø BMTI’s ASIC technology is always making progress rapidly, and now arriving at top level of the world

BMTI’s Radiation-Hardened ASIC Solution BMTI has produced nearly 100 RH ASICs, most of which have been delivered to our domestic customers and applied in China’s space projects. Main customers: CAST, CALT, CASIC, CAS, … Ø BMTI has developed 0. 5μm, 0. 18μm and 65 nm ASIC design platforms, supporting RH ASIC with a scale up to 50 Million gates Ø The next-generation (28 nm) platform is under development and to be released in 2019 Roadmap of BMTI’s RH ASIC

Capability of BMTI’s ASIC Design Platforms 0. 5μm 0. 18μm 65 nm Process 0. 5μm 1 P 3 M CMOS 0. 18μm 1 P 6 M CMOS 65 nm 1 P 10 M CMOS Voltage (V) 5 1. 8/3. 3 1. 2/3. 3 FTYP (MHz) 30 100 300 Max Gate No. 500 k 5 M 50 M ü 0. 5μm: 500 kgate SRAM, PLL, LDO, LVDS, LVPECL, Ser. Des SRAM, PLL, LVDS, LVPECL, DDR 2/3 Ø Thoroughly verified by ground tests and flight experiences Hard IPs Soft IPs Sparc processor, bus controller, memory (SRAM/DDR/FIFO) controller, FFT, FIR filter, EDAC, multiplier/divider/square TID >100 krad(Si) >300 krad(Si) SEL LETTH >99 Me. V/mg/cm² SEU Rate <10 -12 err/bit·day <10 -10 err/bit·day HBM ESD >2000 V Flight Exp. Yes Yes Ø 3 mature platforms ü 65 nm: 50 Mgate ü 0. 18μm: 5 Mgate Ø Plentiful IP resources, complete sets of design kits and fluent design flow make ASIC design easy, fast and reliable

Typical Products with BMTI’s 65 nm RH Platform Product type ASIC (BM 3827 RH) SRAM Series CPU (BM 3823 AMCC RH) Spacewire (BM 4806/4807 A MQRH) Main Features System Gates: More than 12 M Gates 72 SRAM modules, 1. 26 M bits in total Package: CPGA 391 Capacity: 64 M/39 M/32 M/19. 5 M bits Package: CQFP 84 Max Frequency: 300 MHz with SRAM, PLL and DDR 2/3 Package: CCGA 717 Data rate: 400 Mbps with PLL and LVDS interface Package: CQFP 240 Radiation Hardness TID>300 krad (Si) SEL>99 Me. V·cm 2/mg SER<1× 10 -5 error/day·device (GEO) TID>300 krad (Si) SEL≥ 99 Me. V·cm 2/mg SER<1× 10 -12 error/bit·day (GEO) TID>500 K Rad (Si) SEL>99 Me. V·cm 2/mg SER<1× 10 -5 error/day·device (GEO) TID>300 K Rad (Si) SEL>99 Me. V·cm 2/mg SER<1× 10 -5 error/day·device (GEO) Some (about 10 ) other 65 nm ASICs are now under development

BMTI’s Design Service for Radiation-Hardened ASICs BMTI is willing to transfer our latest technology for customers to implement their radiation-hardened products, and can provide customers with licensed radiationhardened libraries, IPs and experienced design services. Service modes can be various with multiform inputs and outputs, and customers can choose any mode according to their situation

BMTI’s Design Service for Radiation-Hardened ASICs ØBMTI’s ASIC service is not limited to design, but also includes services in wafer fabrication interface, package design, packaging, testing and screening per customers’ request ØSeveral customers from Russia have shown their interests in our ASIC techniques and a few of them have been working with us on IPs and design service

Summary and Expectation BMTI has complete and mature radiation hardened FPGA and ASIC solutions üThoroughly verified and widely applied in China space project üWorld leading level in technology In the context of the “One Belt, One Road”, we are pleased to provide China solution in ICs to our friends, especially Russia. BMTI has cooperated with Russian company RCM by providing radiation hardened 65 nm IP technology and has successfully finished this project in 2019. Other than logic processing solution, BMTI has various radiation hardened solutions, such as RF and high-speed solution, high-speed ADC and DAC solution, etc. Email: gjhz@mxtronics. com; Tel: (8610)68758115; Fax: (8610)68757706

BMTI Your Trusting International Business Partner ! Beijing Microelectronics Technology Institute Пекинский институт микроэлектронной техники 2019. 9