Atotechs Solutions for MLB Production using Advanced Basematerials
Atotech’s Solutions for MLB Production using Advanced Basematerials Speaker: Jaime Peraza Ordaz PMM Atotech Europe mobile: +34 606 372 364 email: jaime. peraza@atotech. com Tobias Sponholz Global Assistant Product Manager BTT PTH Mobile: +49 (0)173 - 628 64 80 Email: tobias. sponholz@atotech. com
Agenda 1 2 3 4 Application Guide Horizontal Electroless Copper Printoganth P Plus Vertical Electroless Copper Printoganth PV (E) Direct Plating Neopact Seleo CP Plus Proprietary and Confidential Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO
Application Guide Proprietary and Confidential
PTH Process Overview Application and Pricing Guide PTH PROCESS APPLICATION GUIDELINE Segment IC Substrate Application/ Technology SAP Recommended Process Vertical Horizontal Direct Plating Printoganth MV Plus Printoganth SAP Plus n/a Printoganth MV Plus Printoganth P Plus n/a Printoganth PV E Printoganth P Plus Neopact Seleo CP Plus Printoganth U Plus or Printoganth U Seleo CP Plus (GX 92, GX 13, GX-T 31, . . ) MSAP, AMSAP (BT, BT PCF, . . . ) HDI & MLB Advanced Materials (PTFE, BT, High Tg FR 4, Standard Materials Noviganth LS Plus (standard FR 4, …) Proprietary and Confidential
Horizontal Electroless Copper Printoganth P Plus Proprietary and Confidential
Printoganth P Plus Features & Benefits Market Introduction in Sept. 2009 Target Application § Any production with advanced materials where adhesion or blistering is an issue e. g. flex, rigid-flex, PTFE, BT, PI, etc. § HDI and AMSAP technology Technical Benefits § Extremely good non-blister behavior and coverage performance § Very good reliability § Easily adjustable deposit rate 0. 35 – 0. 5µm / 4 min § Enhanced bath stability Printoganth P Plus enables highest flexibility in production mix Proprietary and Confidential
Horizontal MLB and HDI Processes Comparison Reliability Deposition rate Non-blistering performance Bath Stability CN-free CN- Components excl. Na. OH Printoganth U Plus Printoganth H-DK Printoganth P Plus + +++ +++ 0. 35 µm in 4 min 0. 35 -0. 5 µm in 4 min excellent even on fair on all standard challenging base materials excellent even on challenging base materials + +++ +++ No No No Yes 4 5 4 4 4 Printoganth P Plus is Atotech’s most capable process for HDI manufacturing Proprietary and Confidential
Horizontal Desmear Uniplate P Process Sequence Sweller Permanganate Etch Reducer Securiganth E Sweller Securiganth P 500 Reduction Cleaner Securiganth E or Reduction Conditioner Securiganth P 500 SECURIGANTH® desmear series is the industry standard for horizontal HDI manufacturing. Optimal desmear attack on a wide variety of base materials. Proprietary and Confidential
Horizontal Activation & E’less Cu Uniplate LB Process Sequence Cleaning Cleaner Securiganth E Etch Cleaning Securiganth SPS Pre Dip Neoganth Pre-Dip B Activator Neoganth U Activator Neoganth 800 Reducer Neoganth WA Reducer S E’less Copper Printoganth P Plus Proprietary and Confidential
Economic Activator Neoganth 800 Features & Benefits New Ionic activator system for horizontal application running at only 75 ppm Pd § Activator U = 225 ppm Enables significant savings in running costs by less consumed Pd Fully compatible to established Atotech conditioning system § easy drop in solution Perfect coverage on a wide range of relevant base materials Same excellent reliability results as Activator U Robust & easy process Wide working window Activator 800 during Alpha site test Proprietary and Confidential
Non-Blistering Performance Theoretical Explanation Non-blistering performance is related to internal stress within deposited e’less Cu layer Printoganth P series Relevant factors for Cu deposit behavior § Stabilizer type & concentration § Stabilizer Co-deposits (e. g. Ni) § Deposition temperature § Baking after electroless Cu deposition X-ray diffraction (XRD) measurement reveals constant tensile stress with Printoganth P Plus – a type of internal stress that is beneficial for non-blistering! Proprietary and Confidential relative strain X Z
Printoganth P Plus Applications Flex-Rigid Board FR 4 Production Board No Blistering due to excellent stress characteristics Bright deposition color Proprietary and Confidential
Reliability Summary Quick Via Pull test, 3 -6 mil – all passed. Solder Shock Test (6 x 288°C, 10 s floating) with THs and BMVs – No ICDs, passed. Solder Shock Test (9 x 326°C, 10 s), THs & BMVs with THs and BMVs – few ICDs, ok. IST (+150°C / RT @ 3’/ cool down within 2‘, max. 10% resistance increase) – 2000 cycles passed. Various E-tests (daisy chains) – all passed. Printoganth P Plus fulfills all reliability requirements for high-end HDI production. Proprietary and Confidential
Printoganth P Plus Customer References Customer Country Lines Capacity [Tm²/ yr] Panel Type AT&S Austria 2 240 FR 4 KCC Korea 5 1000 FR 4, RCC INTERFLEX Korea 3 700 PI Korea / China 3 720 PI, Rigid-Flex R 2 R LGIT Korea 3 640 BT, FR 4 AMSAP Youngpoon Korea 2 480 PI, Rigid-Flex Daisho Japan 1 180 Rigid-Flex Shennan China 1 180 BT, FR 4 Founder China 1 240 FR 4, . . Foxconn China 2 620 High Tg FR 4 ASE Taiwan 1 120 BT Simmtech Korea 1 320 Unimicron Taiwan 1 SI FLEX TOTAL 26 Proprietary and Confidential Remark AMSAP
Vertical Electroless Copper Printoganth PV (E) Proprietary and Confidential
Process Sequence Activation & E‘less Cu Products Temp. (°C) Time (min) Securiganth Cleaner 902 60 4 SPS 30 1 Neoganth LS Pre Dip RT 1 Activator Neoganth LS Activator Plus Neoganth V 8 Pd) (60 ppm) (75 ppm 40 50 4 Reducer Neoganth LS Reducer 30 3 E’less Copper Printoganth PV (E) 34 8 -20 Desmear Cleaning Etch Cleaning Pre Dip Proprietary and Confidential
Activation Series Neoganth LS Plus Features & Benefits Ionic Activator for vertical application Optimal coverage at low running cost (75 ppm Pd) Fine & homogeneous distribution of Pd particles No tooling hole issues Pre Dip Activator Reducer Not corrosive Improved robustness, no precipitations during manual replenishment Easy handling, no premixing 100% compatible to established conditioning concept Proprietary and Confidential
Economic Activator EXPT Neoganth V 8 Features & Benefits New ionic activator system for vertical MLB/HDI applications running at only 60 ppm Pd § Enables significant savings in running costs by less consumed Pd Modified complexing agents § Ensures good coverage despite low palladium content § ‘Locking’ copper ions in a stable complex enhances bath lifetime Less alkaline § Improved bath stability by reduced carbonate formation Perfect coverage on a wide range of relevant base materials Fully compatible to established Atotech conditioning system § Easy drop in solution Robust & easy process § No additional Na. OH dosing required by optimized replenishment concept § Wide working window Activator Neoganth V 8 – full power ionic activation at low cost Proprietary and Confidential
Printoganth PV vs PV E Comparison … Cleaning Etch Cleaning Printoganth PV E Printoganth V Copper E Printoganth V Basic Printoganth PV Stabilizer Cu Reduction Solution Na. OH Pre Dip Identical stabilizer system Activator Same bath performance Reducer Different Cu source (Cu. SO 4, Cu. Cl) to be more flexible in supply chain E’less Copper PV E potentially more cost-effective due to higher concentrated Cu additive Proprietary and Confidential
Printoganth PV (E) Features and Benefits Versatile vertical e’less Cu process for advanced MLB/HDI applications Superior adhesion on most materials including PI, PTFE, BT. . . due to optimal internal stress characteristics of the copper deposit: § No blistering § No pull away Highly reliable process § Fulfills all standard reliability requirements such as SST, IST, TCT § No ICDs at standard conditions and only low occurrence at harsh solder shock conditions as 9 x 326ºC Low to high build deposit possible § Deposition speed 0. 3 - 0. 6µm in 10 min Environmentally friendly § Tartrate based § Cyanide free Proprietary and Confidential
Printoganth PV E Coverage in Through Holes Pos. 1 Pos. 6 Pos. 2 Pos. 7 Pos. 3 Pos. 8 Pos. 4 Pos. 9 Pos. 5 Pos. 10 Proprietary and Confidential
Printoganth PV E Coverage in Blind Micro Via SEM picture Excellent BMV coverage despite strong glass fiber protrusion! Proprietary and Confidential
Printoganth PV E Coverage Base material Tg °C phenolic Halogen- Lead-free Polyfree compatible imide Backlight PV E Backlight PV x D 8 D 9 x x D 7 -8 x x D 9 -10 D 8 -9 Isola Duraver 104 135 Matsushita R 1566 150 Hitachi MCLBE-67 G 150 Du. Pont Pyralux AP 195 Isola Duraver 114 150 D 8 Isola Duraver 117 170 D 9 D 8 Nan-Ya NP 175 -TL 170 PIC DF-170 x x D 10 x D 7 -8 standard pth process without 902 Flex Cleaner or Reduction Conditioner Proprietary and Confidential D 7
Printoganth PV E Surface Adhesion Excellent adhesion on exposed polyimide Outstanding adhesion with Printoganth PV E ! Proprietary and Confidential
Printoganth PV E Production Example – Exotic Materials Korean Customer for military application Final Product Fe oxide powder EPDM Rubber Proprietary and Confidential
Printoganth PV E Solder Shock Results Solder dip conditions ICD Inspected Inner layer 6 x 10 sec @288°C 0 203 0% 9 x 10 sec @288°C 0 202 0% 12 x 10 sec @288°C 0 182 0% 15 x 10 sec @288°C 0 102 0% 18 x 10 sec @288°C 1 99 1% % ICD Alpha site test with customer production panel (Nanya NP-175 TL, phenolic-cured FR 4, Tg 175ºC) Printoganth PV E fulfills highest reliability requirements Proprietary and Confidential
Printoganth PV E Solder Shock Results 6 x IR reflow + 1 x solder shock no pull away no ICD customer internal test results, production panels (EMC EM-320, lead-free high Tg 170ºC) Solder shock tests Test conditions ICD Inspected Inner layer % ICD 6 x 10 sec @288°C 0 36 0% 10 x 10 sec @288°C 0 36 0% 14 x 10 sec @288°C 0 34 0% 18 x 10 sec @288°C 0 34 0% Test at customer site with production panels (Isola E-Cu 114, dicy-cured FR 4, Tg 150ºC) Proprietary and Confidential
Printoganth PV E and PV References Customer Country Lines Capacity Base Materials Application Boardtek Taiwan 4 650. 000 High Tg FR 4, Teflon high frequency New Flex Korea 1 120. 000 PI, FR-4 Jiang Nan Institute China 1 100. 000 FR 4, RCC, HTg PC Chipset, Graphic chipset, Mobile military Chang. Sung Korea 1 60. 000 Special military ACB Europe 1 25. 000 FR 4, HTG, PI, PTFE Military, automotive Exception Europe 1 23. 000 FR 4, High. Tg, BT, various Others - 4 30. 000 various Capacity [m²/year] Base Materials Application Customer Country Lines Sonic India 1 72. 000 FR 4 Arktron India 1 15. 000 FR 4 Meadville (DMC) China 1 400. 000 FR-4 High Tg, Meadville (MAS) China 1 350, 000 FR-4 High Tg, HF MEIKO China 1 760. 000 FR-4, HF HDI Mutual-Tek Taiwan 1 240. 000 FR 4, PI Flex-Rigid status 2012 -10 Proprietary and Confidential High-layer MLB
Printoganth PV (E) Summary Printoganth PV (E) § vertical e’less Cu process for MLB/HDI applications § outstanding non-blistering performance on any kind of base materials § highly reliable Deposit structure of Printoganth PV E Optimal performance in conjunction with § Securiganth BLG desmear § Neoganth LS Plus activation Outlook § Neoganth V 8 Activator for lower running cost Plated BMV with Printoganth PV E Proprietary and Confidential
- Slides: 29