Atomic Orbitals sorbitals porbitals dorbitals Chemical Bonding Overlap
Atomic Orbitals s-orbitals p-orbitals d-orbitals
Chemical Bonding Overlap of half-filled orbitals - bond formation HA HB HA - HB = H 2 Formation of Molecular Hydrogen from Atoms Overlap of filled orbitals - no bonding
Periodic Chart
Crystal Bonding sp 3 antibonding orbitals sp 3 bonding orbitals Silicon Crystal Bonding
Semiconductor Band Structures Silicon Germanium Gallium Arsenide
Intrinsic Semiconductor Aggregate Band Structure Fermi-Dirac Distribution
n-type Semiconductor Aggregate Band Structure Donor Ionization Fermi-Dirac Distribution
p-type Semiconductor Aggregate Band Structure Acceptor Ionization Fermi-Dirac Distribution
Temperature Dependence Fermi level shift in extrinsic silicon Mobile electron concentration (ND = 1. 15(1016) cm 3)
Carrier Mobility No Field Present Pictorial representation of carrier trajectory Carrier drift velocity vs applied field in intrinsic silicon
Effect of Dopant Impurities Effect of total dopant concentration on carrier mobility Resistivity of bulk silicon as a function of net dopant concentration
The Seven Crystal Systems
Bravais Lattices
Diamond Cubic Lattice a = lattice parameter; length of cubic unit cell edge Silicon atoms have tetrahedral coordination in a FCC (face centered cubic) Bravais lattice
Miller Indices z y z x 100 y 110 z x y x 111
Diamond Cubic Model 100 111
Cleavage Planes Crystals naturally have cleavage planes along which they are easily broken. These correspond to crystal planes of low bond density. In the diamond cubic structure, cleavage occurs along 110 planes.
[100] Orientation
[110] Orientation
[111] Orientation
[100] Cleavage
[111] Cleavage
Czochralski Process
Seed Rod (Single Crystal Si) dia. = ~1 cm
Czochralski Process Equipment Image courtesy Microchemicals
Czochralski Factory and Boules
CZ Growth under Rapid Stirring Distribution Coefficients CZ Dopant Profiles under Conditions of Rapid Stirring
Enrichment at the Melt Interface
Zone Refining Si Ingot Heater Ingot slowly passes through the needle’s eye heater so that the molten zone is “swept” through the ingot from one end to the other
Single Pass FZ Process
Multiple Pass FZ Process Almost arbitrarily pure silicon can be obtained by multiple pass zone refining.
Vacancy (Schottky Defect) “Dangling Bonds”
Self-Interstital
Dislocations Edge Dislocation Screw Dislocation
Burgers Vector Edge Dislocation Screw Dislocations in Silicon [100] [111]
Stacking Faults Intrinsic Stacking Fault Extrinsic Stacking Fault
Vacancy-Interstitial Equilibrium Formation of a Frenkel defect - vacancy-interstitial pair “Chemical” Equilibrium
Thermodynamic Potentials E = Internal Energy H = Enthalpy (heat content) A = Helmholtz Free Energy G = Gibbs Free Energy For condensed phases: E and H are equivalent = internal energy (total system energy) A and G are equivalent = free energy (energy available for work) T = Absolute Temperature S = Entropy (disorder) Boltzmann’s relation
Vacancy Formation
Additional Vacancy Formation Vacancy “concentration”
Equilibrium Constant Interstitial “concentration”
Internal Gettering removes harmful impurities from the front side of the wafer rendering them electrically innocuous. High temperature anneal - denuded zone formation Low temperature anneal - nucleation Intermediate temperature anneal - precipitate growth
Oxygen Solubility in Silicon
Oxygen Outdiffusion
Precipitate Free Energy a) - Free energy of formation of a spherical precipitate as a function of radius b) - Saturated solid solution of B (e. g. , interstitial oxygen) in A (e. g. , silicon crystal) c) - Nucleus formation
Critical Radius a) – If critical radius exists, then a larger precipitate grows large b) – If critical radius exists, then a smaller percipitate redissolves
Substrate Characterization by XRD Bragg pattern - [hk 0], [h 0 l], or [0 kl]
Wafer Finishing Ingot slicing into raw wafers Schematic of chemical mechanical polishing
Vapor-Liquid-Solid (VLS) Growth Si nanowires grown by VLS (at IBM)
Gold-Silicon Eutectic liquid A B solid A – eutectic melt mixed with solid gold B – eutectic melt mixed with solid silicon
Silicon Dioxide Network Non-bridging oxygen Si. O 4 tetrahedron Silanol
Thermal Oxidation One dimensional model of oxide growth Deal-Grove growth kinetics
Steady-state Fluxes Mass transport flux Diffusion flux Reaction “flux” 1) Diffusion flux is “in-diffusion”. Any products, e. g. , H 2, must “out-diffuse”. However, out-diffusion is fast and generally not limiting. 2) Mass transport is generally never limiting.
Henry's Law Distribution equilibrium (Henry's Law) Reaction = Mass Transport
Steady-state Concentrations Reaction = Diffusion Gas phase concentration related to reaction concentration
Deal-Grove Model Relationship between thickness and time: What if an oxide of thickenss, x 0, is already on the wafer? Must calculate equivalent growth time under desired conditions
Deal-Grove Rate Constants B/A => Linear Rate Constant B => Parabolic Rate Constant
Oxidation Kinetics Rate constants for wet and dry oxidation on [100] and [111] surfaces
Linear Rate Constant Orientation dependence for [100] and [111] surfaces affects only the “pre-exponential” factor and not the activation energy
Parabolic Rate Constant No orientation dependence since the parabolic rate constant describes a diffusion limited process
Pressure Dependence Oxidation rates scale linearly with oxidant pressure or partial pressure
Rapid Initial Oxidation in Pure O 2 This data taken at 700 C in dry oxygen to investigate initial rapid oxide growth
Metal-Metal Contact Metal 1 Metal 2
Metal-Silicon Contact Metal Silicon
Effect of a Metal Contact on Silicon
Metal-Oxide-Silicon Capacitor Metal Silicon Dioxide
MOS Capacitor on Doped Silicon Vg 0 v Schematic of biased MOS capacitor
Biased MOS Capacitors
CV Response quasistatic n-type substrate high frequency depletion approximation quasistatic p-type substrate high frequency depletion approximation
Surface Charge Density inversion n type substrate depletion accumulation blue: positive surface charge red: negative surface charge inversion p type substrate depletion accumulation
Capacitance, Charge, and Potential Poisson’s equation (1 -D) Charge density for a uniformly doped substrate Intrinsic Debye Length: a measure of how much an external electric field penetrates pure silicon
The Depletion Approximation Carrier concentrations are negligible in the depletion region Maximum depletion width Extrinsic Debye Length: a measure of how much an external electric field penetrates doped silicon
Capacitance (dimensionless linear scale) CV vs Doping and Oxide Thickness Substrate Doping Capacitance (dimensionless logarithmic scale) p-type substrate Oxide Thickness Bias Voltage (dimensionless linear scale)
CV Measurements Quasi-static CV High Frequency CV Deep Depletion Effect Flat Band Shift Fast Interface States
Interface States Interface states – caused by broken symmetry at interface Interface states – p-type depletion + + + Interface states – n-type depletion
Interface State Density Interface state density is always higher on [111] than [100]
IV Response avalanche breakdown Fowler-Nordheim tunneling Logarithm of current density (J) vs applied electric field (E)
Conduction Mechanisms Fowler-Nordheim tunneling Frenkel-Poole emission Schottky emission Ohmic (electronic) conduction Ionic conduction Mobility limited breakdown current
Oxide Reliability Each point represents a failed MOS structure - stress is continued until all devices fail QBD - “charge to breakdown” - constant current stress TDBD - “time dependent breakdown” - constant voltage stress
Linear Transport Processes J = LX J = Flux, X = Force, L = Transport Coefficient Ohm’s Law of electrical conduction: j = E/ J = electric current density, j (units: A/cm 2) X = electric field, E = V (units: volt/cm) V = electrical potential L = conductivity, = 1/ (units: mho/cm) = resistivity ( cm) Fourier’s Law of heat transport: q = T J = heat flux, q (units: W/cm 2) X = thermal force, T (units: K/cm) T = temperature L = thermal conductivity, (units: W/ K cm) Fick’s Law of diffusion: F = D C J = material flux, F (units: /sec cm 2) X = diffusion force, C (units: /cm 4) C = concentration L = diffusivity, D (units: cm 2/sec) Newton’s Law of viscous fluid flow: Fu = u J = velocity flux, Fu (units: /sec 2 cm) X = viscous force, u (units: /sec) u = fluid velocity L = viscosity, (units: /sec cm)
Diffusion in a rectangular bar of constant cross section Fick’s Second Law Instantaneous Source - Gaussian profile Constant Source - error function profile
Instantaneous Source Profile Linear scale Log scale
Constant Source Profile Linear scale Log scale
Surface Probing Single probe injecting current into a bulk substrate Single probe injecting current into a conductive thin film Four point probe
pn Junction n type Silicon p type Silicon
Junction Depth red: background doping x. J black: diffused doping
Unbiased pn Junctions Band Diagram Charge Density Electric Field Potential
Biased pn Junctions IV Characteristics CV Characteristics
Photovoltaic Effect
Solar Cell typical cross section equivalent circuit
Solar Cell IV Curve I ISC Imax P Vmax VOC
Effect of Parasitics, Temperature, etc. effect of RS effect of I 0 effect of RSH effect of n effect of T
Solar Cell Technology Commercial solar cell
LED IV Characteristics
LED Technology Commercial LED’s RGB spectrum white spectrum (with phosphor)
Diffusion Mechanisms Vacancy Diffusion - Substitutional impurities, e. g. , shallow level dopants (B, P, As, Sb, etc. ), Diffusivity is relatively small for vacancy diffusion. Interstitial Diffusion - Interstitial impurities, e. g. , small atoms and metals (O, Fe, Cu, etc. ), Diffusivity is much larger, hence interstitial diffusion is fast compared to vacancy diffusion. Interstitialcy Mechanism - Enhances the diffusivity of substitutional impurities due to exchange with silicon self-interstitials. This leads to enhanced diffusion in the vicinity of the substrate surface during thermal oxidation (socalled “oxidation enhanced diffusion”).
Defect-Carrier Equilibria Vacancies interact with mobile carriers and become charged. In this case, the concentrations are governed by classical mass action equilibria.
Arrhenius Constants for Dopant Atoms
Arrhenius Constants for Other Species
Solid Solubilities
Ion Implantation Dopant species are ionized and accelerated by a very high electric field. The ions then strike the substrate at energies from 10 to 500 ke. V and penetrate a short distance below the surface. Elementary “hard sphere” collision
Co-linear or “Centered” Collision
Stopping Mechanisms Nuclear Stopping - Direct interaction between atomic nuclei; resembles an elementary two body collision and causes most implant damage. Electronic Stopping - Interaction between atomic electron clouds; sort of a “viscous drag” as in a liquid medium. Causes little damage.
Implant Range - Total distance traversed by an ion implanted into the substrate. Projected Range - Average penetration depth of an implanted ion.
Implant Straggle Projected Straggle - Variation in penetration depth. (Corresponds to standard deviation if the implanted profile is Gaussian. )
Channeling is due to the crystal structure of the substrate.
Implantation Process For a light dose, damage is isolated. As dose is increased, damage sites become more dense and eventually merge to form an amorphous layer. For high dose implants, the amorphous region can reach all the way to the substrate surface.
Point-Contact Transistor
Bipolar Junction Transistor
Junction FET
MOSFET enhancement mode depletion mode
Enhancement Mode FET 7 V 6 V 5 V 4 V
- Slides: 113