ATLAS Upgrade Pixel Module Sensor Testing and Readout

ATLAS Upgrade Pixel Module Sensor Testing and Readout Update Kirk Arndt, Richard Plackett, Alex Knight, Scarlettt Forest, Gale Lockwood, Daniel Weatherill, Daniel Wood, Kaloyan Metodiev, Maria Mironova, Daniela Bortoletto, Ian Shipsey on behalf of the Oxford Physics Microstructure Detector Laboratory 05/02/2019 Oxford Physics Microstructure Detector Lab 1

Market Survey Sensor Testing • Thanks to work by Maria we are ‘qualified’ for the Market Survey • Defect Inspection, Metrology, IV, CV and stability tests all ready to go. • Working on file format conversion scripts and temperature and humidity logging • Latest developments are ‘Interesting’ handling requirements for the pre-UBM parts. – No Vacuum pens allowed. – Tweezers on edge of 100 um sensors – Trying to find a compramise 05/02/2019 Oxford Physics Microstructure Detector Lab 2

Readout Systems • Working at Oxford – USBPix for FEi 4 quads – BDAQ for RD 53 (looking at improving calibration scripts) • Under development – Felix for FEi 4 (currently PC issues) – YARR for RD 53 (using working BDAQ to debug) 05/02/2019 Oxford Physics Microstructure Detector Lab 3

Module Production Testing Development • Proposed number of thermal cycles seems to be reducing to ~10 not 100 • Solves the main problem of the test box – 100 cycles takes many days • Also taking on development of module carrier board, one for each module during production – Needs to be compatible with module assembly and test box – Needs to be cheap – May need an integral adapter – if so pcb based, otherwise aluminium plate with a vacuum formed plastic cover • Need to start thinking about a switching matrix (depending on readout sysetm) 05/02/2019 Oxford Physics Microstructure Detector Lab 4