ATLAS Module building at Glasgow Andy Blue on

ATLAS Module building at Glasgow Andy Blue: on behalf of the Glasgow ATLAS upgrade group

ATLAS Upgrade • Replacing all the Silicon in the SCT • Presentation will focus on the Si Strip detectors • (also work at Glasgow on the upgrade to the pixel detectors) • Major changes previous modules • More Asics (now 20) • Will be reduced to 10 @130 nm. CMOS • • More Strips 20*128*2=5120/module However, no fan in/link between Si Hybrids now glued directly ON to the Si

Atlas Upgrade Taken from “Parameters of the phase 2 ITK Draft 27. 5. 2012” • Layer 1: 28 staves (at r = 412) [Short @ 2. 4 cm] • Layer 2: 40 staves (at r= 555) [Short @ 2. 4 cm] • Layer 3: 48 staves (at r=698) [Long @ 4. 8 cm] • Layer 4: 60 staves (at r=866) [Long @ 4. 8 cm] • Layer 5: 72 staves (at r=996) [Long @ 4. 8 cm] • =248 Staves in total • The number of modules in stave = 26 • 6448 modules in 3 years (150 weeks) • 42. 986 modules per week • 8. 597 modules per day for all module building groups • Assumes 100% yield!

Assembly of a Module • 1) Glue ASICS on to a FR 4 strip (‘Hybrid’) • Wire bonds for ASIC-ASIC • 2) Glue 2 Hybrids onto a Si sensor (‘Module’) • Wire bond from ASIC to Si Strips

Hybrid Construction • Goal is to accurately glue 20 Si CMOS chips on to a FR-4 based panel to make a Hybrid

Present Technique • Place ASICs in holder (Machined acetal with metal top)

Picking up ASICS • Attach a vacuum jig to the holder

Hybrid Gluing • Apply a stencil and spread glue evenly on back to leave 5 spots per asic

ASICs in position on Hybrid • Place vacuum jig on to FR 4 board and apply a brass weight to cure the glue

Module gluing • Goal is to glue to Hybrids (shown before) to a Silicon sensor

Module Alignment Frame is placed on a jig, then Silicon sensor placed in frame (held by small lip round edge of frame)

Module Gluing • A cardboard stencil is placed on top of the Si sensor and glue is spread • Glue used is an epolite epoxy

Module Assembly • 2 hybrid pick up tools are then attached to the module jig

Work so far • Hybrid Building • Wire Bonding • Readout

Hybrid Assembly

Wire Bonding • Purchased and installed Bondjet 820 • Fully wire bonded our first hybrid panel • Wire bonded 1 st half of module • Successfully bonded trial of new pitch for modified module design

Testing • HSIO FPGA development board • Runs SCTDAQ software • Can test • Hybrids • Modules • Stavelets (multiple modules)

Testing • Testing both hybrids and modules now at Glasgow

Hybrid Testing - (Pre trim)

Hybrid Testing - (Post trim)

Next • Test hybrids bonded at Glasgow • Begin construction of Modules • Test • Begin QA and full assembly structure • Get ready for pre production