ATLAS MICRO CHANNELS COOLING Microchannels cooling for ATLAS

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ATLAS – MICRO CHANNELS COOLING

ATLAS – MICRO CHANNELS COOLING

Micro-channels cooling for ATLAS (based on the development for LHCb) - Silicon device with

Micro-channels cooling for ATLAS (based on the development for LHCb) - Silicon device with etched micro-channels - Bonding with 2 mm pyrex to close the channels LHCb snake design - Gluing nanoport connectors - Assembly with the PCB using two metallic plates glued on top of the cooling device - Gluing the chip on top of the cooling plate - Fixing everything while aligning for the wire-bonding

Micro-channels tentative layout - Channels 50 x 50 µm + 200 µm walls Channels

Micro-channels tentative layout - Channels 50 x 50 µm + 200 µm walls Channels with restriction (inlet channels 20 µm wide and 4 mm long) Two holes for inlet and for outlet (1. 6 diameter) Pillars in the outlet to maximize the bonded surface Chip

Inlet tentative layout Inlet hole (1. 6 mm diameter) Radial exit from the hole

Inlet tentative layout Inlet hole (1. 6 mm diameter) Radial exit from the hole Straight entrance into the big channels Inlet restriction (20 µm 50 µm) 34 channels 300 µm without channels Fluidic calculations have to be made To check the channels dimensions !!!

Outlet tentative layout 0. 4 µm pillars 50 µm high Outlet hole (1. 6

Outlet tentative layout 0. 4 µm pillars 50 µm high Outlet hole (1. 6 mm diameter) 88 channels 300 µm without channels Fluidic calculations have to be made To check the channels dimensions !!!

- Machine a windows inside the card 20 45 - Cooling device:

- Machine a windows inside the card 20 45 - Cooling device:

Assembling the cooling device… Left metallic plate chip Cooling device Right metallic plate

Assembling the cooling device… Left metallic plate chip Cooling device Right metallic plate

Assembling the cooling device… - The cooling device can be fixed during the wire-bonding

Assembling the cooling device… - The cooling device can be fixed during the wire-bonding process, after the alignment - Three holes have to be made inside the PCB - The two bonding pads will be:

Future steps: - Start producing the masks for the micro-channels fabbrication in EPFL cleanroom

Future steps: - Start producing the masks for the micro-channels fabbrication in EPFL cleanroom (next week) - Producing metallic plate and tools for the mechanical assembly of the device (@CERN) (September) - Thermal tests Si-Pyrex channels + Si metal heaters (September) - Integration on the board and wire-bonding + thermal tests with chip (beginning of October) - Si-Si coolers development (2013) Subject of avalability of CO 2 test stand!!!

Possibility of working with FBK (Fondazione Bruno Kessler) Parallel development of embedded Si micro-channels

Possibility of working with FBK (Fondazione Bruno Kessler) Parallel development of embedded Si micro-channels Preliminary discussion with FBK by the end of 2012 if ATLAS is interested FBK available to start development in Spring 2013 in 6 inches wafers

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