AlcatelLucent Allied Telesyn Avaya ADC Krone Nortel Rohde

Партнерские соглашения Alcatel-Lucent; Allied Telesyn; Avaya; ADC Krone; Nortel; Rohde & Schwarz; Anritsu и тд. . .

Оборудование mini-SDH компании Alcatel-Lucent • 1643 AM/AMS (Metropolis AM/AMS)

Metropolis® SDH: обзор линейки оборудования Metropolis® AMS Metropolis® AM STM-1 Line, SFPs STM-1 & 4 Line E 1, E 3 10/100 E, X. 21 SHDSL

Оборудование mini-SDH: Wave. Star AM 1 -Plus

Wave. Star AM 1 -Plus Архитектура устройства Metropolis® AM Линейные интерфейсы: • STM-1 S-1. 1 1310 nm • STM-1 L-1. 2 1550 nm • STM-4 S-4. 1 1310 nm • STM-4 L-4. 2 1550 nm Дополнительные модули (один на устройство): • 16 x E 1 (G. 703) • 2 x E 3 (G. 703) • 2 x STM-1 S-1. 1 • 4 x X. 21 • 12 x SHDSL • 4 x 10/100 Base. T Layer 2 Switch (Trans. LAN) • 8 x 10/100 Base. T Ethernet Privat Line I/F (optional equipped) Line I/F 10 Base. T Ethernet (ITM-SC) RS-232 (ITM-CIT) 4 x MDI, 4 x MDO VC-4, VC-3, VC-12 Power Supply Option Card 2 x – 18 V … -72 V DC или 1 x 100 V … 240 V AC 16 x E 1 Metropolis AM и Metropolis AMS имеют общие дополнительные модули (кроме модуля 2 x STM-1, применяемого только в STM-4 конфигурации Metropolis AM)

Конструкция Metropolis AM 1+ Power supply AC or DC Mother Board

Оборудование mini-SDH: Metropolis® AMS

Metropolis® AMS Архитектура устройства Metropolis® AMS Линейные интерфейсы: • STM-1 S-1. 1 1310 nm • STM-1 L-1. 2 1550 nm SFP Line I/F SFP 10 Base. T Ethernet (ITM-SC) RS-232 (ITM-CIT) 4 x MDI, 4 x MDO EOW VC-4, VC-3, VC-12 Дополнительные модули (один на устройство): • 16 x E 1 (G. 703) • 2 x E 3 (G. 703) • 4 x X. 21 • 12 x SHDSL • 4 x 10/100 Base. T Layer 2 Switch (Trans. LAN) • 8 x 10/100 Base. T Ethernet Privat Line Power Supply Дополнительный модуль 2 x – 18 V … -72 V DC 16 x E 1 1 x – 48 VDC AC/DC Converter 1 x 230 VAC

Оборудование SDH компании Alcatel-Lucent 1645 AMC 1655 AMU (Metropolis AMU)

1655 AMU (Metropolis AMU) Полка 2 m/4 o Полка 1 m/1 o

Оборудование SDH компании Alcatel-Lucent 1645 AMC

1645 AMC § 1645 AMC мультиплексор STM-1/-4 SDH/PDH платы • 16 port E 1 (75/120 Ohm) card, • 3 port E 3/DS 3 card • 6 STM-1 card (support SFP ) Платы Ethernet (E/FE/GBE) Private Line и L 2 Switched • 8 port E/FE private line card • 5 port E/FE/GE switched card E 1/Ethernet via SHDSL Applications • 12 port SHDSL card

High level product description • Основные характеристики • 2*STM-1/4 (SFP) + 2 STM-1 (SFP) • STM-1 SFPs: S-1. 1, L-1. 2, STM-1 e, STM-1 Si. Fi (bidirectional SFP) • STM-4 SFPs: S 4. 1, L 4. 2, STM-4 Si. Fi • 16*E 1 interface (75&120 Ohm) • One EOW interface • 4 x MDI and 4 x MDO contacts • Large non-blocking XC (76*VC-4 HO, 16*VC 4 LO), PM NIM • 8 x VC-4 option slot capacity • backplane capacity enables future high capacity/high speed option cards • Шасси – 1. 5 RU включая 4 x SFP – Один слот расширения – Вентиляция естественная

1645 AMC дополнительные платы • • • 16 port E 1 16 port DS 1 12 port SHDSL 8 port E/FE EPL 3 x 10/100 Base-T, 1 x 10/1000 Base-T, 1 x 1000 Base-FX SFP • 6 port STM-1 • 3 port E 3/DS 3 Planned for August 08 • High speed multiple E/FE/GE card 2 Mbit in/out timing synchronization

X 10 IP 8 x 10/100 Base-T L 2 Switch WAN Mapper 4 WAN ports 2 x 10/100 Base-T/X / 1000 Base-T/X VC-12 -1. . 63 v VC-3 -1. . 9 v VC-4 -1. . 8 v

Оборудование SDH компании Alcatel-Lucent ADM Compact 1663 ADM-U (Metropolis ADM)

ADM Compact&ADM Universal Compact Universal

Metropolis ® ADM Compact Конфигурации STM-16 Metro Core/ Access STM-16 Ø STM-16 Core unit Ø 64 x 64 VC 4 + 32 x 32 VC 4 LO Ø 5 tributary slots STM-4 Metro Access Ø Core units Ø With no lineports (LXC card) Ø With 2 x STM-4 Lineports Ø 64 x 64 VC 4 + 32 x 32 VC 4 LO Ø 5 tributary slots No LPs 2*STM-4

Metropolis ® ADM Compact Архитектура устройства ITM Metropolis® ADM Compact Системный контроллер (SC) 2 Мбит/с Power & Timing Line Port VC-4/3/12 STM-4/16 Cross-connect 34/45 Мбит/с 10/100 Base-T Базовый блок (Core Unit) STM-1 e Power & Timing Line Port VC-4/3/12 STM-4/16 Cross-connect Базовый блок (Core Unit) 1000 Base-X STM-1 o STM-4 o Шасси имеет 8 слотов: i 1 для системного контроллера i 2 для базовых блоков i 5 для трибутарных плат

Metropolis ® ADM Universal: краткий обзор Конфигурации STM-64 Core/Metro Core Ø STM-64 Core units STM-64 Ø 272 x 272 VC 4 + 64 x 64 VC 4 LO Ø (R 3) 272 x 272 VC 4 + 128 x 128 VC 4 LO Ø 9 tributary slots STM-16 Metro Core/ Access STM-16 Ø STM-16 Core units Ø 68 x 68 VC 4 + 32 x 32 VC 4 LO Ø 9 tributary slots 4 -port STM-16 w. SFP modules Ø 0 -4 port STM-16 Core units, SFP modules 4 -port SFP Ø 272 x 272 VC 4 + 128 x 128 VC 4 LO STM-16 Ø 9 tributary slots

ADM Universal трибутарные карты • STM-1/4 High speed Multi-rate tributary card – 16 x. STM-1 with PB – 4 x. STM-4 • • 63 x. E 1 tributary card 2 x. GE L 2 tributary card 8 x. FE L 2 tributary card 12 x full rate FE tributary card

R 6. 0 ØSystem Capacity enhancement – Backplane running at 10 G/slot • New system controller – Support for 128 DCC channels per system – Transparent DCC Cut Through prepared • 2 x 10 G core units (with XFP) – – 160 Gb HO connectivity (130 Gb effective), 20 Gb LO connectivity up to 10 Gb per service slot (enabling future higher density cards) Compatible with existing high-density tributary units (TDM/Ethernet) Multiple flavors: • Dual STM-64 core with 2 XFP ports • Single STM-64 core with 1 XFP port (cost effective compared to existing line cards)

Large Scalability System Architecture R 6 Capacity Quadrupled • System Controller PB 1 § 32 DCC channels TS TS 1 2 § Support MSPP functionality • R 6 System Controller § 128 DCC channels § ASON Prepared § Support enhanced MSPP functionality • Core unit § 42. 5 G HOCC + 20 G LOCC § 10 G Transponder Based • Core unit § 130 G HOCC + 20 G LOCC § Multi-10 G § XFP Based • Tributary units § 2. 5 G non-blocking throughput PB 3 SC CORE 1 (w) TS TS 3 4 PB 2 PB 4 Plenum Misc IO FAN Tray PB 5 PB 7 TS 5 TS TS 6 9 (p) CORE 2 (p) PB 6 TS TS 7 8 PB 8 • Tributary units § 10 G non-blocking throughput capacity Plenum (10 G tribs will be introduced in R 6. 1) PWR feed FAN Tray Dust filter PWR feed

System Architecture. Ultra High CC Capacity Cross Connect 10 G Core Pack (pre-R 6): Cross-connect Unit VC-3/12 matrix 128 Aggregate (64 x VC-4) VC-4 matrix 64 Aggregate (64 x VC-4) 64 144 Tributaries (9 x 16 x VC-4) 272 x 272 HO, 128 x 128 LO VC-4 Equivalent 2 x 10 G Core Pack (R 6): Cross-connect Unit VC-3/12 matrix 128 Aggregate (2 x 64 x VC-4) 128 VC-4 matrix 128 Aggregate (2 x 64 x VC-4) 576 Tributaries (9 x 64 x VC-4) 832 x 832 HO, 128 x 128 LO VC-4 Equivalent

Non-Blocking Everywhere 10 G Non-Blocking Access • Industry leading slot capacity 10 10 2. 5 G G G SC 10 G 2. 5 10 G G – 130 G (90 G to tributary + 20 G inter-core unit + 20 G line) connectivity in each core unit – 10 G fully non-blocking, no restriction tributary access Plenum • Reuse current subrack – “TXI Quad. Speed” technology quadrupling backplane capacity – Truly 1 system covering 2 application sweet spots: 2. 5 G & 10 G – Current SFP based 2. 5 G system upgradeable to XFP based 10 G system FAN Tray 10 2. 5 G G 10 G 2. 5 10 10 2. 5 TS TS G 7 G 8

• • Inflexible to customer demand change Complex network planning and deployment logistics – 3 line units High initial investment in spare & storage • 70 km 1 km 2 km 10 G L-64 Transponder solution 10 G I-64 • 10 G S-64 Pioneering XFP Adoption XFP Based 10 G 40 km 80 km Port based Optical Reach Flexibility XFP solution • • Optical reach flexibility down to per port base Easily adjustable to customer demand change effectively preventing stranded capital expenditures Simple network configuration – 1 line unit Low initial investment in spare & storage 10 G 30 km • • • with leading edge carriergrade XFP solution 2 km 40 km 80 km

DCC Capacity Enhancement • • • è è Leading DCC Capacity DCC capacity quadrupled to 128 channels from 32 Up to 128 add drop rings manageable via DCC cut through supported prepared (Planned R 6. 1) Industry leading DCC access capacity Coherent with the system capacity upgrade in R 6 4 x 32 DCC channels 32 manageable add-drop rings 128 DCC channels 128 manageable add-drop rings

R 6. 1 • STM-1/4/16 High speed Multi-rate tributary card – – 16 x. STM-1 16 x. STM-4 4 x. STM-16 Any mix within 10 G backplane capacity • High density/cost effective PL GE card – 4 x to 8 x. GE (investigation ongoing) • Trans. LAN features – Candidates under prioritization