AGSP Presentation AGSP Advanced Grade Solid Bump Process

AGSP 法 Presentation *AGSP : Advanced Grade Solid Bump Process 2004년 10월 05일 (주) 두산 전자BG 매스램사업부 0

PCB 기술 Trend 1. Road Map Of Printed circuit Board Metal Wired Substrates (Printed Circuit Boards) Wiring Density Gen #2 Double Sided Gen#1 Single Sided ‘ 50 ‘ 60 Gen #3 Multilaye r Gen #4 HDI Gen #5 High. Speed Era Gen #6 Optical Era Metal plus photonics Biggest Change Industry Has Ever Seen! ‘ 70 Year ‘ 90 ‘ 00 ‘ 10 1

AGSP 제품군/사양 Items HHP 2+2+2 HHP 1+6+1 DVC 2+4+2 Flash memory 1+2+1 CDMA모뎀 2+4+2 Thickness, mm Build-up layer Line/Space, ㎛ Base layer 1. 0 100 / 100 0. 8 100 / 100 1. 0 100 / 100 0. 4 100 / 100 Bump top dia. / Land dia. ㎛ 130 / 250 175/ 350 150 / 300 200 / 400 Min. Bump pitch, ㎛ 375 400 500 450 600 Through hole dia. / Land dia. ㎛ 300 / 500 250 / 500 300 / 550 300 / 500 Halogen-free Pb-free Available Available Available Construction PCB 사진 5

AGSP 제조 공정 - Design Specification ⓐ ⓓ ⓔ 단위: ㎛ 항 ⓑ ⓕ ⓒ ⓐ 목 Class Ⅰ Hole Dia. Bump-Hole pitch 100/100 500 ⓔ/ⓕ Bump Dia. /Land Dia. 300/500 [ Staggered Via] 400 375 150/300 100/250 ◎ CAM ◎ Laser Drill vs. AGSP 비교 L 1 Class Ⅲ 250 ⓑ/ⓒ Line/Space ⓓ Class Ⅱ L 2 [ Stacked Via] 9

3. Production Technology The Past Paper/Phenol Laminates Composite Laminates Glass/Epoxy Laminates Pre-Multi Laminates The Present BGA and Flip-Chip Materials Green Laminates Build-up Materials The Future CSP Materials Flexible Materials for Additive Process Landless Packaging Technology Mass Production Technology Material Technology Combination Technology (Material + Reliability) 12

Contact Point 담당자 두산전자 매스램 사업부 ※ 영업팀 김정수 과장 (031 -489 -4460, 010 -3096 -0983) ※ AGSP팀 정재훈 대리 (031 -489 -4474, 011 -9884 -4241) jjman@doosan. com 감사합니다. ! 14