Aerogel Upgrade Status Shin Ichi Esumi for the

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Aerogel Upgrade Status Shin. Ichi Esumi for the high pt upgrade team Introduction Design

Aerogel Upgrade Status Shin. Ichi Esumi for the high pt upgrade team Introduction Design parameters Readout electronics Beam test with prototypes Simulation Plan   Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 1

Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun

Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 2

Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun

Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 3

π/ K n=1. 0112 Shin. Ichi Esumi for the high pt upgrade team TOF

π/ K n=1. 0112 Shin. Ichi Esumi for the high pt upgrade team TOF σ~ 100 ps RICH n = 1. 00044 ACC n ~ 1. 01 collaboration meeting in Nashville, Jun 10 -13 2003 0~5 0~2.5       1~5 K / p 5~17      17~      5~9 4

k ac tr le ic rt pa (b vertex Shin. Ichi Esumi for the

k ac tr le ic rt pa (b vertex Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 ea azimuthal angle z m )d ire ct io n 5

Prototype in run 3 -pp air Aerogel n=1. 0112 +- 0. 0002 11 cm

Prototype in run 3 -pp air Aerogel n=1. 0112 +- 0. 0002 11 cm 22 cm Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, 11 cm Jun 10 -13 2003 6

Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun

Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 7

Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun

Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 8

Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun

Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 9

Motoi Inaba Design of Bleeder (Ver. 2) Shin. Ichi Esumi for the high pt

Motoi Inaba Design of Bleeder (Ver. 2) Shin. Ichi Esumi for the high pt upgrade team Part name Para. R 1 10 k ohm R 2 R 11 330 k ohm R 12 200 k ohm C 1 C 3 10 n. F Kind Coat-Insulate Fixed Metal Film Resistor Type Maximum working voltage Dielectric withstanding voltage Power rating MF 1/2 350 V 700 V 1/2 W MF 1/4 250 V 500 V 1/4 W DD 1464 E High Voltage 103 P 500 Ceramic Condenser collaboration in Nashville, DEBE 33 F C 4 4. 7 meeting n. F 472 ZA 3 B Jun 10 -13 2003 500 V 3150 V 10

Schedule Five types of Bleeder Ver. 3 will be delivered in June. Type Divider

Schedule Five types of Bleeder Ver. 3 will be delivered in June. Type Divider Resistor Idling current Power consumption Comments Hamamatsu Standard A 330 k ohm 0. 453 m. A 680 m. W B 470 k ohm 0. 318 m. A 478 m. W C 560 k ohm 0. 267 m. A 401 m. W Intend to use D 680 k ohm 0. 220 m. A 330 m. W E 750 k ohm 0. 200 m. A 300 m. W (at 1500 V) We test them and select one for mass-production. New bleeders will be soldered with PMTs at Tsukuba Univ. by Motoi INABA. Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 11

Calibration system using LED 1 2 PHENIX TTL (LED) DRIVER 3 4 5 PPG

Calibration system using LED 1 2 PHENIX TTL (LED) DRIVER 3 4 5 PPG TTL 1 6 7 2 8 9 10 3 200 ohm 8 Shin. Ichi Esumi for the high pt upgrade team LED Special category-5 cable. collaboration meeting in Nashville, Jun 10 -13 2003 12

Signals on the bench test Input signal (100 [Hz]) Output signal of Driver Gate

Signals on the bench test Input signal (100 [Hz]) Output signal of Driver Gate of ADC PMT DRIVER TTL ( ~ 11 p. e. ) 50 ohm PMT LED Gate of ADC Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 13

Current design of Aerogel Counter #Preamp: 20 1. 5 m 3. 5 m 1.

Current design of Aerogel Counter #Preamp: 20 1. 5 m 3. 5 m 1. 2 m Trig FEE HV From GTM LV <4 m? 2. 0 m Aerogel One sector: To DCM 80 segments 1 DCM channel/ one sector 160 channels Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 Kyoichiro Ozawa Narumi Kurihara Takashi Matsumoto Aerogel Counter 160 segments of Aerogel Counter are located in Sector 1 at west arm. 160 ch of PMT signals are led to North side, and another 160 ch are led to South side. Pre. Amp 20 Pre. Amp boards are placed both side of Aerogel Counter. FEE & HV rack Racks for FEE and HV modules are located the second floor at west arm. 14

North side of Read out electronics Multi coaxial cable. 3 ~ 4 m Signal

North side of Read out electronics Multi coaxial cable. 3 ~ 4 m Signal cable RG 174 1. 5~3. 5 m 5 AMU/ADC Modules have 320 ch of inputs. Read out module Aerogel Box. 80 segments. 160 channels. G Link to DCM 5 transition cards. Integrate 8 multi coaxial cables in one board. Preamp 8 preamp circuits are on one board. 20 boards are in one side. Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 15

25 ns Cross talk in Preamp 3 ch input Example: 50 m. V input

25 ns Cross talk in Preamp 3 ch input Example: 50 m. V input pulse to 3 ch output 50 m. V 4 ch output 140 m. V 5 m. V Input to 3 ch 3 m. V 1 ch output • Signal line which is next to 3 ch is most affected. • Each signal of cross talk is bipolar signal. • Maximum pulse height of cross talk is 5 m. V. • When the input was 200 m. V of pulse height, the • maximum pulse height is 10 m. V. • For ADC measurement, the cross talk signal carry no charge. 6 ch output Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 1 m. V 16

Beam test at KEK-ps Particle selection by TOF (2 Ge. V/c, positive) Shin. Ichi

Beam test at KEK-ps Particle selection by TOF (2 Ge. V/c, positive) Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 17

12 cm PMT Aerogel Y PMT 2 (0, 0) PMT 1 X BEAM 15

12 cm PMT Aerogel Y PMT 2 (0, 0) PMT 1 X BEAM 15 cm Beam PMT 2 15 cm Y (0, 0) X 21 cm PMT 1 12 cm PMT Beam Air PMT 11. 5 cm Y 12 cm Aerogel PMT 2 PMT 1 X 12 cm Beam BEAM Shin. Ichi Esumi for the high pt upgrade team (0, 0) 22 cm collaboration meeting in Nashville, Jun 10 -13 2003 18

Optical simulation Satoshi Takagi Masahiro Konno λabs BEAM beam data simulation λsct Shin. Ichi

Optical simulation Satoshi Takagi Masahiro Konno λabs BEAM beam data simulation λsct Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 19

# of p. e. Mylar Box + Goretex 2. 07 Paper Box + Goretex

# of p. e. Mylar Box + Goretex 2. 07 Paper Box + Goretex 2. 00 7 Sheets of Mylar 4. 45 Aerogel 13. 88 cosmic ray test in our lab. Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 Satoshi Takagi 20

Magnetic shield test at Lab Maya Shimomura Shin. Ichi Esumi for the high pt

Magnetic shield test at Lab Maya Shimomura Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 21

Run 3 -pp prototype test TDC ADC Online monitoring Shingo Sakai TDC Shin. Ichi

Run 3 -pp prototype test TDC ADC Online monitoring Shingo Sakai TDC Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 22

Offline analysis ~8 p. e. single pmt hit coincidence hits low gain ADC Shin.

Offline analysis ~8 p. e. single pmt hit coincidence hits low gain ADC Shin. Ichi Esumi for the high pt upgrade team Hiroshi Masui collaboration meeting in Nashville, Jun 10 -13 2003 to be evaluated with external tracking high gain ADC 23

z PISA simulation Satoshi Takagi #of fired cell/ central event ~ 8% occupancy back

z PISA simulation Satoshi Takagi #of fired cell/ central event ~ 8% occupancy back ground sources seen in aerogel detector x Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 24

kaon efficiency PID and trigger simulation Masahiro Konno Maya Shimomura kaon thresh. in ACC

kaon efficiency PID and trigger simulation Masahiro Konno Maya Shimomura kaon thresh. in ACC kaon purity pion thresh.  in RICH Hijing simulation + proton thresh. in ACC TOF/RICH/ACC response Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 TOF(p) && ACC && RICH momentum 25

LVL 2 trigger plan for run 4 -Au. Au (1)select all PC 3 hits

LVL 2 trigger plan for run 4 -Au. Au (1)select all PC 3 hits in aerogel shadow; (2)select all PC 1/PC 3 tracks with reasonable   vertex cut (say BBC+-10 cm); (3) cut on momentum (we'll have ~5% resolution); (4) check for a RICH ring; (5) match hit to EMC cluster; (6) match to the hists in aerogel, use both timing    and amplitude; (7) use all this information to make a decision; Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 26

1. Aluminum Box (Dubna) Two Pre-production boxes in BNL $ Construction of 160 boxes

1. Aluminum Box (Dubna) Two Pre-production boxes in BNL $ Construction of 160 boxes + alpha * 2. PMT 2 -1 PMT 320 PMTs (R 6233 -01 HA, Hamamatsu) delivered to Univ. of Tsukuba $ Light shield paint for the back of PMT * Bleeder soldering * Calibration (Gain, Noise, Timing response) * 2 -2 Bleeder (INABA-original) Some tests needed * Delivery in June * 6. Others Epoxy glue (as sample) Double-sided tape, Stapler (Goretex) Sponge rubber (packing) Bleeder (Tsukuba) Type: INABA-original Ver. 3 Size: 80 * 75 * 1. 6 mm^3 (P. C. Board) 80 * 75 * 14 mm^3 (Including parts) Power consumption: 456 m. W (at 1000 V) 685 m. W (at 1500 V) Maximum working voltage: 2500 V (Maximum voltage of PMT is 1500 V ! ) Dielectric withstanding voltage: > 3200 V (from long term test. ) = 5000 V (from parts specification) (Maximum voltage of PMT is 1500 V ! ) Delivery schedule: In June. 2 -3 Connectors (AMP, Tyco Elec. Corp. ) HV x 2, Signal x 2, LED x 1 Delivery ? 2 -4 Short cables (~15 cm, Bleeder - Connector) HV x 2, Signal x 2 Preparation * 2 -5 G-10 board Construction by CI Industry Co. Ltd * High Voltage Cable (Tsukuba ? BNL ? ) Type: Not yet (GX 03173 -01 ? The same as TOF ? ) Production company: OTTO SUHNER AG. Delivery schedule: 3 weeks after ordered. 2 -6 Black cloth for light shielding (Lid - G 10 board) Preparation * 2 -7 PMT+Shield holder (A, B) Material ; Unilate (PET). Construction by CI Industry Co. Ltd (Now estimated) * 3. Magnetic shield case Tested by Maya $ ->Cylindrical shape (Length ; 80 mm / Outer diameter ; 80 mm / Thickness ; 0. 5 mm), Material ; Permalloy. Construction (Now estimated) * 4. Internal Box 4 -1 Mylar sheet Cosmic ray test done (0. 35 pe per sheet) $ -> Transparent polyester film (100 um thick. ) Delivery and cutting (Now estimated) * 4 -2 Goretex sheet DRP Reflectors (reflectivity > 99%, 500 um thick), Japan Goretex Inc. Delivery and cutting (Now estimated, 2 weeks after order. ) * Shin. Ichi Esumi for the high pt upgrade team 5. Aerogel SP-12 M, Matsushita Electric Works, Ltd. Refractive index ; n = 1. 0112 +- 0. 0002 Tile Size ; 112. 5 +-1 mm x 112. 5 +- 1 mm x 11. 0 +- 0. 5 mm Very fragile Already delivered to Univ. of Tsukuba $ Signal Cable PMT-to-Pre. AMP (CNS, Tokyo-Univ. )(BNL)(Tsukuba) Type: RG-58 A/U or RG-122/U or RG-174/U. (50 -ohm coaxial cable). Now testing at CNS. Production company: Cabling pattern: Not yet. Number of cables: 320. (160 for Run-4). Delivery schedule: Pre. AMP-to-FEE (CNS, Tokyo-Univ. )(BNL) Type: UL 8233. (50 -ohm multi-coaxial cable). Number of channels per cable: 8. Production company: Cabling pattern: Not yet. Number of cables: 40. (20 for Run-4). Delivery schedule: A test cable on May 20 th. collaboration meeting in Nashville, Jun 10 -13 2003 27

Pre. AMP (Pre-amplifier) (CNS, Tokyo-Univ. ) OPAMP chip: AD 8009 (Analog Devices, Inc. )

Pre. AMP (Pre-amplifier) (CNS, Tokyo-Univ. ) OPAMP chip: AD 8009 (Analog Devices, Inc. ) (1 GHz, 5, 500 V/μs low distortion amplifier. ) Type: Voltage sensitive non-reverse amplifier. Design: Circuit diagram. Photograph. Gain: 2. 25 Number of channels per board: 8. Number of boards: 40 (20 for Run-4). Power regulator chip: TA 7805 (positive), TA 79005 (negative). Operating voltage: +8. 5 V & -8. 5 V (more than 300 m. A) (Minimum voltages for stable operation. ) Size: 90 * 70 mm^2 Output impedance: 50 ohm Cooling: Required. ESD protection: Yes. Crate: Design by CNS (10 boards / crate). Delivery schedule: Protp-type has delivered. Now testing at CNS. Mass production will be completed in July. FEE (Front-End Electronics) (CNS, Tokyo-Univ. ) Design: The same as RICH FEE. Production company: Kindai Denshi Co. Ltd. (Japan). Dynamic range of charge: 0 - 160 p. e. Components: 10 AMU/ADC boards 2 readout board. 1(or 2) conrtol board. 10 transition card. Crate: One is ready in CNS. Another one is ordered. Transition card: Prototype on May 26 th. Power supply: Delivery schedule: In July, and then, testing. LED driver (BNL)(Tsukuba) Type: A TTL driver for PHENIX. Production: PHENIX, BNL. Number of output channels: 10. Drivability: 80 LEDs. (10 LEDs / channel). Crate: Standard NIM module. LED: E 1 L 33 -3 B. (Toyoda Gosei Co. , Ltd. ) Peak wavelength is 468 nm (Blue). Low voltage: +6 V, -6 V, +24 V, -24 V. Cooling: Required. Delivery schedule: Testing at Tsukuba in April and in May. High voltage module (BNL) Type: Production company: Number of output channels: 320 or 160. (160 or 80 for Run-4. ) Number of output channels per module: Crate: Delivery schedule: Unknown. Low voltage module (BNL) Type: Production company: Output voltage: Not fixed yet. (+6 V, -6 V, +9 V, -9 V, +12 V, -12 V, +24 V, -24 V. ? ) Number of output channels per module: Crate: Delivery schedule: Unknown. Trigger module (CNS, Tokyo-Univ. ) Type: Aerogel LVL-1 trigger. Design: Not fixed yet. Delivery schedule: Not installed in Run-4. (Use LVL-2 trigger for Run-4 Au-Au. ) Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 28

Plan Finalize CDR Design and mechanical reviews Electric and safety reviews Final beam tests

Plan Finalize CDR Design and mechanical reviews Electric and safety reviews Final beam tests Construction (box cell, frame, LED, breeder, preamp, FEE) Assembly Installation Simulation and reconstruction software Shin. Ichi Esumi for the high pt upgrade team collaboration meeting in Nashville, Jun 10 -13 2003 29