Advanced European Infrastructures for Detectors at Accelerators Introduction

Advanced European Infrastructures for Detectors at Accelerators Introduction to WP 7 Avanced Hybrid Pixels Anna Macchiolo, Ivan Vila AIDA-2020 Kick-off meeting This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 654168.

Goals and Scope of the meeting • Outcome of our pre-kick-off meeting: • Detailed review of the activities and interests of beneficiaries. • No loopholes concerning the work-package implementation (task, deliverables, milestones) • Now, this meeting goals: • Define common collaborative activities inside our wp and draft a tentative implementation of this common program. • Desiderata (draft plan) concerning the use AIDA-2020 Transnational Access facilities. • Identify wp non-beneficiaries willing to joint the effort. 15 September 2021 I. Vila, ivan. vila@csic. es, Avanced Hybrid Detectors Kick-off meeting, CERN. 2

Reminder 15 September 2021 I. Vila, ivan. vila@csic. es, Avanced Hybrid Detectors Kick-off meeting, CERN. 3

Key external milestone: RD 53 large demostrator ROC • WP activity split in two different periods marked by the availability of the first RD 53 full demonstrator chip • The RD 53 DEMO ROC should be available (internally to RD 53) by 1 st QT 2016 • To be released by the RD 53 collaboration in the second half of 2016. • “High risk submission” 15 September 2021 I. Vila, ivan. vila@csic. es, Avanced Hybrid Detectors Kick-off meeting, CERN. 4

DEMO RD 53 ROC Reminder • • • • • Full” size chip: ~2 x 2 cm Small pixels: 50 x 50, 25 x 100 um 2 Appropriate also for large pixels: 50 x 100 um 2, 100 x 100 um 2, 50 x 200 um 2 Very high rate capability: 3 GHz Effective threshold (25 ns in time): ~1000 e Very low cross-talk from digital Threshold adjust, noise, etc. Radiation tolerance: 1 Grad (500 Mrad) SEU tolerance Long trigger latency: 10 us (20) High trigger rate: ~1 MHz Low power: < 1 W/cm 2 (as low as possible) Appropriate powering scheme for chip and system Test with bump bonded pixel sensors: Planar & 3 D Specific features for pixel sensor R&D program : Extended charge resolution: 8 -10 bit (low hit rates) Bump bonding pattern and bump bonding pad to enable BB to R&D pixel sensors. 15 September 2021 I. Vila, ivan. vila@csic. es, Avanced Hybrid Detectors Kick-off meeting, CERN. 5

WP 7 follow-up meetings • Proposal: • Having 5 vidyo meetings per year + 1 face-to-face meeting (AIDA-2020 annual meeting). • Starting in September. • Dedicated task-oriented workshops (jointly with Trento meetings ? ) • Task leader institution Task responsible ? • Academy Industry Matching Event contribution ? • Concerning today’s talk very quick reminder of interest/activites + proposal of common task 15 September 2021 I. Vila, ivan. vila@csic. es, Avanced Hybrid Detectors Kick-off meeting, CERN. 6

THANK YOU FOR YOUR ATTENTION ! 15 September 2021 I. Vila, ivan. vila@csic. es, Avanced Hybrid Detectors Kick-off meeting, CERN. 7

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Deliverables Table Deliverable Responsible Group Month due D 7. 1 Simulation of 3 D pixel sensor cells INFN M 18 (OCT 2016) D 7. 2 Simulation active edge CERN M 18 (OCT 2016) D 7. 3 LGAD simulation INFN M 18 (OCT 2016) D 7. 4 TCAD model radiation damage INFN M 46 (MAR 2019) D 7. 5 Wafer Layout MPW run WP 7 CSIC M 30 (NOV 2017) D 7. 6 Initial pixel characterization UNIMAN M 24 (APRIL 2016) D 7. 7 Final pixel characterization MPG-MPP M 46 (MAR 2019) D 7. 8 LGAD characterization INFN M 46 (MAR 2019) 9/15/2021 9

Description of deliverables 9/15/2021 10