Advanced European Infrastructures for Detectors at Accelerators AIDA2020

Advanced European Infrastructures for Detectors at Accelerators AIDA-2020 WP 2: Innovation & Outreach Aurelie Pezous, CERN AIDA-2020 5 th annual Meeting, 4 th April 2019 This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 654168.

Objectives • Scientific Coordination • Communication, dissemination and outreach • Industrial relations and technology transfer • Management of the Proof-of-Concept (Po. C) fund • Pre-industrialisation of large area silicon detectors 10 September 2021 WP 2 -A. Pezous. 2

Task 2. 3 Industrial relations and technology transfer • Academia meets Industry Symposium feedback: • 59% of the participants ranked the overall event with maximum grade • 53% of the participants ranked the event as not too much technical (which was the goal) 10 September 2021 WP 2 -A. Pezous 3

Task 2. 3 Industrial relations and technology transfer • Feedback concerning the 2 AMI events to be sent after the Annual meeting: • https: //docs. google. com/forms/d/e/1 FAIp. QLSd. Nbldh. N 7 rn 3 n 2 y. XRKBUar. Li 9 NHazho. O 2 Lbnwa. Roz. KEDFz. Pg/viewform • Key questions: • How many new projects/collaborations came out of this event? Please comment. • [For industrials only] Did this event bring you new leads/customers for your business? If yes, how many? 10 September 2021 WP 2 -A. Pezous. 4

Task 2. 3 Industrial relations and technology transfer • How to improve the KT/TT from AIDA 2020 to Industry? • Prepare a value proposition of what is unique in each WP: • 1 slide to explain what is done or what is the specific know-how developpedin AIDA 2020, what is in it for Industry and the type of industry that might be interested 10 September 2021 WP 2 -A. Pezous. 5

Advanced European Infrastructures for Detectors at Accelerators • • Proven technology ‐ already adopted in two experiments at CERN Cooling up to 100 s W/cm 2 depending on design Down to 150 um silicon Suitable for single‐ or two‐phase refrigerants No mismatch in coefficient of thermal expansion (CTE) between integrated circuits Significant expertise in the integration of micro‐scale components, surface preparation, and bonding techniques Ongoing R&D on new microfabrication techniques apps The volumetric power density of a LHC Pixel detector is approximately 100 W/dm 3 ‐ comparable to the most demanding high power electronics applications. To provide stable and precisely controlled thermal management, CERN experts have developed know‐how in the design and manufacture of ultra‐thin microchannel cooling plates. added value tech specs what Key competence: Thermal management using silicon microchannels Cooling of integrated circuits, particularly where stable thermal management is needed, for example… • Laboratory coolers • Manufacturing of specialised components • Data centres • Know‐how on designs for high power density cooling: Increase performance and protect electronic equipment from thermal damage • Ultra‐compact, integrated cold plate/heat exchanger: Reduce space requirements • Know‐how on interconnection of multiple devices: Large cooling surfaces possible (>300 mm) This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 654168.

Task 2. 3 Industrial relations and technology transfer • WP 4: Value proposition prepared to be sent to Christophe • WP 9: • visit Airbus D&S • µchannel cooling value proposition • WP 13: • Value proposition in progress • license agreement about APIC in 2017, 1 st orders in 2019 10 September 2021 WP 2 -A. Pezous 7

Task 2. 4 Management of the Proof-of-Concept (Po. C) fund • Objectives of Po. C: • General field of detector development • Collaborative project industry oriented • Bringing technologies closer to the market Impact beyond high energy physics 10 September 2021 WP 2 -A. Pezous. 8

Task 2. 4 Management of the Proof-of-Concept (Po. C) fund • 3 projects funded: Budget € Title Lead Institute 45, 600 € Silicon‐based Microdosimetry System for Advanced Radiation Therapies 74, 825 € Advanced Through Silicon Vias for Pixel Detectors 66, 641 € Ra. Do. M 10 September 2021 WP 2 -A. Pezous. Partners Instituto de Microelectronica de Barcelona University Fraunhofer IZM of Bonn CERN Politecnico di Milano, Mi. am 9

D 2. 4: SMART • Microdosimetry for hadron therapy • 96% channel yield • Planning proton/carbon beam tests of pixellated sensors • Licencing conditions agreed with Alibava 10 September 2021 WP 2 -A. Pezous 10

D 2. 4: TSV • Development of a process by IZM for Uni Bonn • Successful development and good performances • IZM acquired 3 new projects/customers thanks to these developments 10 September 2021 WP 2 -A. Pezous 11

D 2. 4: Ra. Do. M • Incorporation in progress in Switzerland • And Italy (Trentino ) in a later stage CONNECT DEVICES Connect sensors and existing HCVA system control units to our cloud. Install Io. T minimally invasive air purifiers, if needed MONITOR THE AIR QUALITY AND DRIVE SYSTEMS Continuously monitor radon and optimize already installed HCVA systems to solve the radon and air quality problems. Sensors, purifiers and HCVA system are driven through our cloud 10 September 2021 WP 2 -A. Pezous 12

Task 2. 5 Preindustrialisation of large area silicon detectors • Phase-II Upgrades will need more than 46. 000 x 6 -inch and 30. 000 x 8 -inch wafers • ATLAS/CMS Market Survey was started in 2016 to identify interested companies • European vendor Infineon was interested in HEP detectors • Prototype sensors for CMS tracker, HGCal and ATLAS Itk produced through year-long collaboration • Infineon stopped further that project in summer 2018 because of economic reasons • Project was very visible within local funding agencies and academic environment • Very educative collaboration • We learned a lot about commercial production of silicon devices • Infineon gained insights in HEP community, device irradiations and received highly trained manpower • Market Survey closed with only one qualified company • Experiments defined technical specifications for procurement • Invitation to Tender sent out yesterday • HPK has time to answer until 24 April 10 September 2021 WP 2 -A. Pezous. Bologna 13

Milestones and Deliverables • Milestones since last annual meeting: • MS 79: 2 nd AIDA-2020 “Academia meets Industry” event (M 36) • Deliverables since last annual meeting: • D 2. 3: Identification of companies (production capabilities including evaluation of possible samples and prototypes) (M 44) 10 September 2021 WP 2 -A. Pezous. 14

Coming year • Follow-up Po. C projects • Finish value proposition with WP leaders • AIDA 4 EVER: • What? Finding companies interested either in the topic of research either on developping technologies for HEP and other applications • When? The sooner the better 10 September 2021 WP 2 -A. Pezous. 15