Additive Manufacturing Techniques for Dissimilar Materials VHPUAM September
Additive Manufacturing Techniques for Dissimilar Materials - VHPUAM September 14, 2011 Josh George Applications Engineer, Ultrasonics Email: jgeorge@ewi. org Phone: 614. 688. 5057
Overview ― Highlight UAM process ― Very high-power UAM system status ― Current developments – UAM bonding, smart structures ― New VHP research platform
Ultrasonic Additive Manufacturing* … a new technology – “UAM” creates net-shape solid metal parts using: solid state ultrasonic metal welding and CNC contour milling Transducer Booster Horn ‘Dummy’ Booster Al Tape Rotating Transducer, Booster, Horn System Al Base Plate Anvil * UAM – aka Ultrasonic Consolidation
… a bit more detail US vibrations from transducer US horn – has textured surface to grip tape US Welded tape US vibrations of ‘horn’
… detail … u In practice, tapes are first laid side-by-side, and then built up layerby-layer to build a solid metal plate Laying of tapes side-by-side, then layer-by-layer to build a solid plate Each tape layer staggered from one below so seams do not line up. In practice, there are no gaps between adjacent tapes
Current Machine Status 9 -k. W Weld Module ― ― ― Materials – High power ability to weld Cu, Ni, stainless steel Part Size – Working envelope of 6 - × 3 -feet tall Speed – Welding speeds up to 400 in. /minute with integrated CNC machining at up to 600 in. /minute (example: 6”x 6” at 150 in. /minute would take 33 hours)
Features 9 -k. W “Push – Pull” Multi-axis, “Speed Bump” feature Machining center with automatic tool changer Tape feed system accommodates up to 12 -in. sheet
Process, Operation CAD Model Fabrication Machine Code
Example Products Rapid Prototyping Embedded Electronics Metal Matrix Composites Embedded Sensors Thermal Management Dissimilar Metal Laminates Complex Geometry Integrated Systems
Dissimilar Matrix Potential Material pair proven for ultrasonic welding Material pair tested for ultrasonic spot weld Al Be Al Alloys l l Be Alloys l Cu Alloys § Process well suited to dissimilar metals and multi -material laminate – No liquid phase metallurgical incompatibilities Cu Ge Au Fe Mg Mo l l l l Ge Au l l Fe Alloys l Mg Alloys l Mo alloys l Ni Alloys Al § Multiple metal foils can be combined § Fiberoptic, B, and Si. C fibers can be embedded without deleterious reactions with Al matrix 10 Si. C fiber Cu Ni Pd Pt Si Ag Ta Sn Ti W l l l l l l l l l l l l Pd l l Pt Alloys l l Si Ag Alloys l l Ta Alloys l Sn l Ti Alloys l l W Alloys l Zr Alloys Zr l l l l
UAM Bonding ― Extensive metallurgy studies; e. g. , work with 3003 – evidence of recrystallization as bonding mechanism (a) and (b); heat buildup causes more extensive effect at top. ― Materials investigated: 110 Cu (>99. 0% Cu), hard condition 3003 Al, H 18 (strain-hardened) 6061 Al, H 18 (strain-hardened) 304 L SS (annealed) Original interface
Metallurgy ― Peak temperatures < 0. 5 T melt ― Extensive increase in interface stored energy ― Local formation of nano-grain colonies. ― 12 Plastic-flow morphology SEM 100 µm OIM Bulk Tape Bond Area
Smart Materials, Structures ― ― Early embedding observations Has led development of Adaptive Metal Matrix SMA Composites 300 μm 0. 003 -in. -Diameter Ni. Ti Wire (400×) 254 -μm-Thick Ni. Ti Ribbon 1000 μm 2 - × 76 -μm-Diameter Ni. Ti Wires 100 μm 4 - × 100 -μm-Diameter Ni. Ti Wires 100 μm 381 -μm-Diameter Ni. Ti Wire
Application – Dimensionally Stable Ni. Ti/Al Composites § Aluminum alloys have a high CTE (25. 1 ppm/o. C) § Thermally induced contraction of embedded Ni. Ti can offset thermal strain of the Al matrix § Ni. Ti/Al composites could maintain dimensional tolerances over an expanded temperature range Strain vs. Temperature for Sample 3
Next Steps ― New Commercial Entity to Commercialize u Fabrisonic LLC u Based in Columbus, OH u Selling Machines and UAM Parts ― University/Lab u Stimulate User Group further research in UAM
Research Platform Specifications u 2500 -lb load u 4. 5 - or 9 -k. W power u 20 × 12 × 6 in. u 200 ipm u Available Fall 2011
Questions? Josh George Applications Engineer, Ultrasonics E-mail: jgeorge@ewi. org Phone: 614. 688. 5057
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