Add nitride Silicon Substrate Add Poly 0 Silicon

Add nitride Silicon Substrate

Add Poly 0 Silicon Substrate

Patterning through 1 st level mask (Poly 0) using Photolithography Patterned Photoresist Silicon Substrate

Removal of Unwanted Poly 0 using Reactive Ion Etching Patterned Photoresist Silicon Substrate

1 st Oxide Deposition using LPCVD Silicon Substrate

Patterning through 2 nd level mask (Dimple) using Photolithography. . . and Deep RIE Photoresist Silicon Substrate

Patterning through 3 rd level mask (Anchor) using Photolithography and Deep RIE Photoresist Silicon Substrate

Blanket un-doped polysilicon deposition(Poly 1) using LPCVD. . . followed by PSG deposition and annealing Silicon Substrate

Patterning through 4 th level mask (Poly 1) using Photolithography. . . and Deep RIE Photoresist Silicon Substrate

Deposition of 2 nd Oxide Layer Silicon Substrate

Patterning through 5 th level mask using photolithography and deep RIE Silicon Substrate

Patterning through 6 th level mask using photolithography and deep RIE Silicon Substrate

Deposition of undoped polysilicon, followed by PSG hardmask layer, then anneal Silicon Substrate

Patterning through 7 th level mask using photolithography and deep RIE Silicon Substrate

Patterning through 8 th level mask using photolithography and liftoff, followed by removal of unwanted resist and metal in solvent bath Silicon Substrate

Release of structures using HF Silicon Substrate