5252021 TNO Holst Centre Herman Schoo Open Innovation

5/25/2021 TNO - Holst Centre - Herman Schoo Open Innovation Centre for Autonomous Microsystems and Systems-in-Foil

5/25/2021 1. 2. 3. 4. Overview of Holst Centre Wireless Autonomous Transducer Solutions (WATS) Systems-in-Foil (SIF) Holst Centre Business Model

3 Holst Centre • Joint centre of TNO (4500 fte, Netherlands) and IMEC (1300 fte, Belgium) • • Created in 2005, co-funded by government and industry Critical mass of 130 + 60 fte; 220 + 100 fte planned in 2010 Aimed at international excellence Partnering worldwide and employing 18 nationalities Introducing Holst Centre

4 Holst Centre: Concept • • Creating generic technologies, time to market 3. . 10 years Partnering with industry and universities Open innovation through precompetitive shared programs Results are shared between partners Wireless Autonomous Transducer Solutions Technology Integration © Holst Centre Introducing Holst Centre Systems in Foil

5 Open Innovation at High-Tech Campus Eindhoven 8000 m 2 cleanroom OLED Device Processing Thin Film clean room Electronic measurement Life Sciences facilities Materials Analysis Photonics cleanroom EMC lab Reliability lab Holst Offices Holst R 2 R lab Equipment Engineering Electronic Prototyping • HTC initiated by Philips, now housing >50 companies • Growing from 5000 to 8000 researchers • Sharing of lab facilities (www. miplaza. com) • New Open Innovation Research Centres (such as Holst Centre) Introducing Holst Centre

6 Introducing Holst Centre

5/25/2021 1. 2. 3. 4. Overview of Holst Centre Wireless Autonomous Transducer Solutions (WATS) Systems-in-Foil (SIF) Holst Centre Business Model

8 Wireless Autonomous Transducer Solutions Programs Strategic programs: windows on application areas, guiding choices in the technology programs Technology programs: Development of key technologies Ultra Low Power Wireless Ultra Low Power DSP Micro Power Sensors & Actuators Integration & Implement. Introducing Holst Centre Medical & Lifestyle (Human++) Infrastructure Monitoring (Asset++)

9 Applications in Medical & Lifestyle domain Introducing Holst Centre

10 Wireless Autonomous Transducer System Non Electrical World S 10 W A 10 W Front End 20 W P 20 W DSP 20 W Radio 20 W Micropower System -100 W Thermal, Vibrational, RF, Light, Bio-chemical Introducing Holst Centre

11 EEG, ECG, EMG read out at Ultra Low Power EEG ECG EMG Introducing Holst Centre

12 Medical Settings serving as Demonstration Lab Introducing Holst Centre

13 Device Miniaturization 2002 2010 Reduce power & size Increase functionality 300 cm 3 140 m. W 100 μW Introducing Holst Centre

14 Pulse Oxymeter powered by Thermal Energy + + Introducing Holst Centre

15 WATS – SIF integration • Many smart autonomous sensor devices in various shapes, networked together… Introducing Holst Centre

5/25/2021 1. 2. 3. 4. Overview of Holst Centre Wireless Autonomous Transducer Solutions (WATS) Systems-in-Foil (SIF) Holst Centre Business Model

17 Systems-in-Foil: Sensing and Acting Foils/Films Introducing Holst Centre

18 Systems-in-Foil: Programs Strategic programs: windows on application areas, guiding choices in the technology programs Technology programs: Development of key technologies Large Area Printing Electrodes and Barriers Foils Integration Printed Structures on Foil Organic Circuitry Lithography on Foil Introducing Holst Centre Printed Organic Lighting & Signage Smart Bandage Smart Blister

19 Why Flexible? • Enhanced functionality for the end user: bendable, rollable, wearable devices But also • Easy integration of foils in products • Efficient large area production of foil devices (e. g. roll-to-roll) • Low cost of substrate Source: Dupont Introducing Holst Centre Source: Metsuo

20 Lighting Opportunities and Challenges • • • Reducing power consumption Thin, flexible, form freedom: enabling new product concepts Tunable color • • Light output and efficiency Lifetime (>displays) and reliability (e. g. encapsulation; shorts) Large area deposition process Extreme cost price challenge Introducing Holst Centre

21 Flexible OLED’s for Lighting and Signage • Challenges: ultrathin wet-processed layers with very uniform thickness (a few %) and without pinholes and with barriers that meet OLED requirements • Recent results: bottom-emitting and topemitting PLED devices 15 x 15 cm demonstrated on flexible polymer and metal substrates Non-transparent barrier Cathode Ba/Al (5 nm/100 -400 nm) 80 nm LEP 100 nm PEDOT 100 nm ITO Transparent barrier 100 -200 μm Polymer foil Bus bars Introducing Holst Centre

22 Lighting Roadmap LEP Material properties: • Lifetime ↑: 5 kh to 20 kh @103 cd/m 2 Total cost of ownership • Luminous efficiency ↑: 50 lm/W [€ct/klm. h] for green Device architecture coupled to to 120 lm/W for white processes enabling high yield 5000 • Input power ↓ : 5 W@102 cd/m 2 to R-2 -R production 1 W @103 cd/m 2 of layers Encapsulation/barrier on foil 5 € 1000/m 2 Shunt (auto)repair methods First niche markets available 0. 50 2006 Introducing Holst Centre 2007 2008 2009 In-situ monitoring metrology € 80/m 2 2010 2011 time

23 Sensor Device Arrays Recent results: • 10 x 10 array structures – also used for singlepixel testing • First printed photo diodes • Device arrays for both LED’s and photo diodes processed on PEN-foil • Sensing of CO 2, Alcohol, …. Introducing Holst Centre

24 Increasing Complexity: Need for Modularity Flow Analyte Prep. Light Source Light Selective Medium User Interface Li gh t Analyte Transport Light Detection Signal User Interface Signal Power source Memory / Storage Signal Data Processing Data Actuator Introducing Holst Centre Signal Data Transfer Data User Interface

25 Creating a Smart Foils Integration Industry Materials suppliers Manufacturers of modular functional foils Equipment Manufacturers Introducing Holst Centre Standardization Functional foils Integrated foil device manufacturers End product manufacturers Equipment Manufacturers

26 Smart Blister • • Addresses key health issue: medication noncompliance / non-adherence Involving industries along value chain to realize this innovation Patient Smart blisters Medical devices GSM/GPRS wireless network Support centre Data. Gator RFID/NFC GSM/GPRS wireless network Introducing Holst Centre

27 Smart Bandage Recent outcome: flexible blood pulse monitor on foil Introducing Holst Centre

28 Microvia Technology for Foil Devices • • Precision lamination of foils making and filling microvia holes at roll-to-roll speed Introducing Holst Centre

29 Embedding Silicon in Foil Thinning, handling, positioning and interconnecting silicon chips in flexible devices Embedded 25 micron thick chip between 2 polyimide layers, resulting in 60 micron thick package (IMEC/UGent) Introducing Holst Centre

30 Printing of Conductive Lines Introducing Holst Centre

31 Printing Research • Introducing Holst Centre Recent result: software (neural network) and database to support ink formulation using solvents database

32 Roll-to-Roll Equipment • • IGT F 1 test unit flexo and gravure printing R 2 R coating / print line: § Slot die unit, flexo unit, gravure unit § Lamination, drying, curing § Length 10 m, width foil 300 mm, speed 10. . 50 m/min § Printing LEP, Pedot and conductives § Clean room facility including R 2 R cleaning line • R 2 R vacuum deposition line being specified now Introducing Holst Centre

33 Barriers and Encapsulation • • • Barrier materials: Six. Ny, Six. Oy. Nz Applied by PE-CVD; PEN substrate Decoupling of pinholes by organic planarizing layers Achieved: intrinsic WVTR 10 -6 g/m 2·d Passed 540 hrs Calcium test: no black spots (Fraunhofer) cathode Introducing Holst Centre

34 Organic Circuitry • • • Transistor technology § Reliable process for circuits & demonstrators § Introduction of printing processes Devices § Memory § UHF rectifying diodes § Sensors Circuits and demonstrators § OLED backplane § Digital & analog circuits Introducing Holst Centre

35 Organic Circuitry Recent results: • 64 bit organic RFID at 13. 56 MHz, >400 organic transistors integrated • First organic rectifier at >400 MHz, enabling more simple antennas and longer-distance read-out Introducing Holst Centre

36 Lithography on flexible substrates Patterning technology for manufacturing electronic circuitry on flex substrates: • Metrology and foil characterization • Foil handling • Lithographic processing • (Sub-)micron patterning Introducing Holst Centre From batch-wise towards roll-to-roll lithography

37 Lithography on flexible substrates (Sub-)micron patterning on flexible substrates 2 m 1 m Foil characterization Introducing Holst Centre 0. 4 m Example: transistors on PEN foil

5/25/2021 1. 2. 3. 4. Overview of Holst Centre Wireless Autonomous Transducer Solutions (WATS) Systems-in-Foil (SIF) Holst Centre Business Model

39 Closed Innovation Research Development Company boundaries Research projects Markets Source: Chesbrough, 2003 Introducing Holst Centre

40 Open Innovation Research Development New Markets Company boundaries Research projects Markets Source: Chesbrough, 2003 Introducing Holst Centre

41 Open Innovation through Shared Programs R&D budget fixed % of revenues Total Company Revenue R&D costs grow faster than revenues: due to increased R&D complexity Budget • Mechanics • Physics • Electronics • Software • Materials • Bio / Life sciences • …… Introducing Holst Centre Shared R&D Leverage: 1. Sharing ideas 2. Sharing of facilities Exclusive R&D 3. Shorter time to market 4. Leverage of R&D budget Shared R&D

42 A Key Component: Industrial Residents • • Employed by the industrial partners of Holst Centre Taking part in the research programs at Holst Centre Enabling fast transfer of results to industrial partners When co-inventing, industrial partner becomes co-owner of IP Introducing Holst Centre

43 IP Model Enabling “Open Innovation” 1. Background of Partners: remains theirs ner Part E er tn A ar P Part ner Pa rt 3. Participation fee: Non-exclusive license on program results 4. Co-inventing by Industrial Residents: co-ownership of IP, sublicensing rights Program Background C Partner D 2. Entrance fee: Non-exclusive license on program background ne r. B 5. Non-Generic improvements of “Provided Background”: ownership, exclusive in domain 6. Exclusive Programs: ownership of IP Introducing Holst Centre

44 Business Model Company Y: entrance fee + participation fee Company X: participation fee Holst background research Exclusive R&D Precompetitive programme • shared IP Access to relevant Holst background IP Continuous program adaptation and growth Introducing Holst Centre

45 Industrial Partnerships Introducing Holst Centre

46 Reaching out to Partners in Open Innovation Herman Schoo Technology Manager Holst Centre mail: herman. schoo@tno. nl telephone: +31 40 277 4025 mobile: +31 6 538 919 68 Introducing Holst Centre