3 3 13 Wicking Requirements IPC600 H 3

  • Slides: 8
Download presentation
3. 3. 13 Wicking: Requirements • IPC-600 H, 3. 3. 13 – Acceptable Class

3. 3. 13 Wicking: Requirements • IPC-600 H, 3. 3. 13 – Acceptable Class 3 • Wicking does not exceed 80 μm [3, 150 μin] – Acceptable Class 2 • Wicking does not exceed 100 μm [3, 937 μin] – Acceptable Class 1 • Wicking does not exceed 125 μm [4, 921 μin] • IPC-6012 C, paragraph 3. 6. 2 • IPC-6013 B, paragraph 3. 6. 2. 9 M 3 -1

3. 3. 13 Wicking • No wicking present (Target) • 80 μm [0. 003150

3. 3. 13 Wicking • No wicking present (Target) • 80 μm [0. 003150 in] maximum allowed (Class 3) Figure 3313 a Target Condition Figure 3313 b Acceptable Class 3 Note: Wicking is measured from the laminate edge excluding the plating M 3 -2

3. 3. 13 Wicking • 100 μm [0. 003937 in] maximum allowed (Class 2)

3. 3. 13 Wicking • 100 μm [0. 003937 in] maximum allowed (Class 2) • 125 μm [0. 004291 in] maximum allowed (Class 1) Figure 3313 b Acceptable Classes 1 & 2 Note: Wicking is measured from the laminate edge excluding the plating M 3 -3

3. 3. 13 Wicking • Defects either do not meet or exceed above criteria

3. 3. 13 Wicking • Defects either do not meet or exceed above criteria • Wicking measures 162. 56 µm [0. 0064 in] Figure 3313 c Nonconforming all Classes M 3 -4

3. 3. 1 Wicking/Clearance Holes: Requirements • IPC-600 H, 3. 3. 1 – Acceptable

3. 3. 1 Wicking/Clearance Holes: Requirements • IPC-600 H, 3. 3. 1 – Acceptable All Classes • Wicking does not reduce conductor spacing less than specified minimum – Acceptable Class 3 • Wicking does not exceed 80 μm [3, 150 μin] – Acceptable Class 2 • Wicking does not exceed 100 μm [3, 937 μin] – Acceptable Class 1 • Wicking does not exceed 125 μm [4, 921 μin] • IPC-6012 C, paragraph 3. 6. 2 • IPC-6013 B, paragraph 3. 6. 2. 9 M 3 -5

3. 3. 1 Wicking/Clearance Holes • No wicking of conductive material into base material

3. 3. 1 Wicking/Clearance Holes • No wicking of conductive material into base material or along the reinforcement material A: Surface Pad B: Dielectric Material C: Adjacent Noncommon Conductors D: Surface Plating Figure 33131 a Target Condition M 3 -6

3. 3. 1 Wicking/Clearance Holes Acceptable for Class 3 • (A) < 80 μm

3. 3. 1 Wicking/Clearance Holes Acceptable for Class 3 • (A) < 80 μm [3150 μin] • (B) does not reduce conductor spacing below minimum requirements Acceptable for Class 2 • (A) < 100 μm [3937μin] • (B) does not reduce conductor spacing below minimum requirements Acceptable for Class 1 • (A) < 125 μm [4921μin] • (B) does not reduce conductor spacing below minimum requirements M 3 -7 Figure 33131 b Acceptable all Classes

3. 3. 1 Wicking/Clearance Holes Nonconforming all Classes • (A) exceeds 125 μm [0.

3. 3. 1 Wicking/Clearance Holes Nonconforming all Classes • (A) exceeds 125 μm [0. 004921 in] • (B) reduces conductor spacing below minimum specified requirements Figure 33131 c Nonconforming all Classes M 3 -8