11022 Transcutaneous Signal Transmission for LVAD October 8

11022 Transcutaneous Signal Transmission for LVAD October 8 , 2010 Yevgeniy Popovskiy, Vince Antonicelli, Craig La. Mendola , Chrystal Andreozzi

System Level Design Review Agenda Project Background Project Scope and Objective Project Schedule Customer Requirements Engineering specifications Work Breakdown System Concept Generation, Scoring and Selection Case Insulation/ wire Electrical System Risks Assessment Project Budget Next Steps Questions and discussion

Project Background The primary objective of this project is to design a transmission system to safely and affectively transfer power and control signal from the external power supply and control to the Left Ventricular Assist Device(LVAD).

Project Objectives MSD I Objectives Concept Generation and Selection Detailed Design Ready for Construction Deliverables Finalizes design Order parts Finalize Test specification MSD II Objectives Assumable system Troubleshoot design Testing equipment Deliverables Working System Test data to support design

Senior Design I Schedule

Work Breakdown System Case, Packaging, Material Signal Transmission Vince Antonicelli Yevgeniy Popovskiy Design Electrical Hardware Program Chip Debug Craig La. Mendola Case Chrystal Andreozzi Wire Port Seal Insulation Wire Material Heat sink Flexibility Dimensions and Design Products Material

Customer Needs THE SYSTEM NEEDS TO WORK!!!! The device must be reliable (Must produce a continuous power and control signs) The number of wires needs to be reduced The cable diameter needs to be reduced The cable needs to be more flexible Meet FDA standards or be able to be modified to meet FDA standards

Engineering Specification Reliable Operation Cable Size Improve Cable Flexibility Internal/ External Volume Eternal Weight Cost 6 hours ~3 mm 200% 450 cm 3 0. 9 kg below $3500

System Overview

Outer Protection Protective outer layers Material/product Benefits Possible Risks Locktite 5248 Biocompatible On failed 10022 Master Bond Jacket Biocompatible Encapsulates components More Robust Wire port sealing Material/product Benefits Possible Risks Sealcon Cord Grips With/without strain relief Removable Adjustable Proven to work Bulky size Permanent Installation Long lead time On failed 10022 Heat shrink boot Adhesive heat shrink Proven to work Less robust 1 st Line of Defense

Sealing Methods Types of O-rings Material/product Benefits Possible Risks Parker O-ring no break or seam Case designed for available O-ring PAI X-ring double seal unreliable when bent O-ring cord Custom sizing Break or Seam On failed 10022 O-ring grooves Install method Benefits Square groove Dove tail groove Possible Risks O-ring unsecured Secure install 2 nd Line of Defense

Protective Case Structural material Material/product Benefits Possible Risks Titanium Biocompatible Electrical shielding Stainless Steel Biocompatible Electrical shielding May corrode Aluminum Electrical shielding Least robust metal May corrode ABS plastic printing Made at RIT On failed 10022 Not water tight

Cost ($) Reliability Availability Biocompatible Key Risk associated with selection process Locktite 5248 In Lab 3 5 5 Failed last team Master Bond Jacket $650 -$800 4 3 5 Sealcon cord grip $4/$14 each 5 3 1 Bulky size Heat shrink boot $10 each 4 1 1 Permanent installation Adhesive heat shrink $15/ In Lab 4 3/5 1 Durability Parker O-ring $13 5 3 1 Design case for O-ring sizes PAI X-ring $0 Sample 3 2 1 Unreliable when bent O-ring cord $2 3 3 1 Has seam Square groove Included 4 3 - Less secure installation Dove tail groove (AL/SS/Ti) +65/100/150 5 1 - Expense/ production time Titanium $470 5 1 5 Expense/ production time Stainless Steel $420 5 2 5 Expense/ production time Aluminum $300 4 3 1 Least robust metal Selected Design Product Structural Material O-Ring Groove O-rings Wire Port sealing Outer Layer of Protection Case Concept Selection ?

Insulation. Heatsink Pad Remain sold at room temperature and then soften at heatsink operating temperature Heatsink paste/grease Pasted applied directly to component

Insulation Cont. Electrical Potting Epoxy Stable material (hard) Resistance to temp. up to 200 o. C Very good resistance to chemicals Cracks easily

Wire Types Calmont Wire and Cable Stranded Single-Conductor (P 10022) Thoratec Corporation (Heart. Mate II)

Reliability Availability Bio-compatible Heat Sink Pad <$20 n/a 2 5 No Heat Sink Paste/ grease <$5 n/a 4 5 No Electrical Potting $20$50 n/a 5 5 No May break Calmont Wire and Cable ? 4 5 1 Yes Time(product is custom made) Stranded Single. Conductor <$5 1 3 5 yes Wire does not have max flexibility Selected Design Flexibility Risk associated with selection Cost ($) Wire Insulation (Heat sinks) Insulation and Wire Concept Selection

System Overview

Major Electrical Choices Transmit digital signal Wired Wireless Through power Transmit analog signal Multiplex Convert to Digital Multiplex through power Chip Technology Microcontroller FPGA Clock Internal Wired Protocol Use Existing Invent One

Current Layout Skin SA Pump SP Main Controller + MCC A/D MCP Motor MCO Control + Battery LAOP LADS LAP Linear Amplifier LAOG Blood Pump

Senior Design P 10021 -P 10022 Layout Skin SA Main Controller + MCC NSD SA Chip + + MCC Elect. MCP SP Control A/D + Motor MCO PADS Battery PAP+MCP+SP PAP PWM Gen. PAOP Blood Pump

Option 1 Skin SA Main SP Controller + MCC A/D MCP + Battery Micro. + Elect. Motor SA Micro. SP + Elect. MCO Control LAOP LADS LAP NSD Linear Amplifier LAOG Pump SP Blood Pump

Option 1 Details

Option 2 Skin NSD SA Micro. + + Elect. Main Controller + PADS A/D LAP + Battery MCC MCP SA Motor Control SP PADS LAP MCO Linear PAOP Amp. Blood Pump

Option 2 Details

Option 3 Skin NSD SA Main Controller + A/D + Battery PADS SA Micro. + + Elect. PAP SP PADS PAP MCC Motor MCP Control MCO PWM Gen. PAOP Blood Pump

Option 3 Details

Option 4 Skin SA NSD SA Micro. Main + + Controller + Elect. A/D MCC SP MCC MCP LADS LAOP Control + Battery Motor Linear LAP Amplifier LAOG Blood MCO Pump

Option 4 Details

Option 5 Skin SA Main Controller + MCC NSD SA Micro. + + MCC Elect. MCP SP Control A/D + Motor MCO LADS Battery PAP+MCP+SP PAP Linear LAOP Amp. LAOG Blood Pump

Option 5 Details

Option 6 Skin SA Main Controller + MCC NSD SA Micro. + + MCC Elect. MCP SP Control A/D + Motor MCO PADS Battery PAP+MCP+SP PAP PWM Gen. PAOP Blood Pump

Option 6 Details

Design Evaluation

Selected Design

Risk Assessment

Next Steps Yevgeniy Popovskiy Select Chip Component Pricing Vince Antonicelli Circuit Design Component Pricing Craig La. Mendola Determine Case Dimensions Create Case Drawings Material Selection with customer Chrystal Andreozzi Identify Wire in the Cable Electrical Reliability Testing Team Contact manufactures and get pricing Verify that different components will assumable