100 WAFER 111 is an natural etching stop

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(100) WAFER {111} is an natural etching stop plane and cut plane Yu-Shiang Huang

(100) WAFER {111} is an natural etching stop plane and cut plane Yu-Shiang Huang et al. , VLSI 2019, pp T 180~T 181. 3

清洗晶片 丙酮去除有機物 震洗去除particles o 丙酮(ACE) 異丙醇(IPA) 去離子水(DI water) BOE 去離子水(DI 去除native water)oxide (~1 nm)

清洗晶片 丙酮去除有機物 震洗去除particles o 丙酮(ACE) 異丙醇(IPA) 去離子水(DI water) BOE 去離子水(DI 去除native water)oxide (~1 nm) o 用氮氣吹乾時應保持sample固定 o Si wafer hydrophobic (疏水) o Native oxide (~1 nm) hydrophilic (親水) M. Morita et al. , JAP, 1990 4

Ø 實驗數據 Group 1 -3 Hot 40 50. 1 60 70. 1 Cool 28.

Ø 實驗數據 Group 1 -3 Hot 40 50. 1 60 70. 1 Cool 28. 4 29. 5 30. 9 32. 3 Group 1 -2 ΔV(m V) 11. 6 12. 2 20. 6 18 29. 1 26 37. 8 33. 2 ΔT(℃) Hot 39. 9 50 59. 9 70 Cool 28. 8 30. 3 31. 5 32. 1 ΔV(m. V ) 11. 1 8. 6 19. 7 16. 1 28. 4 22. 8 37. 9 31. 6 ΔT(℃) Group 1 -1 Hot 39. 9 50. 2 60. 2 70. 1 Cool 26. 9 28. 1 29. 6 30. 9 ΔV(m V) 13 -5. 1 22. 1 -8. 2 30. 6 -11. 1 39. 2 -14. 9 ΔT(℃) 7

BACKUP 9

BACKUP 9

結報問題 1. Look up for HF toxicity and safety issues from MSDS. What should

結報問題 1. Look up for HF toxicity and safety issues from MSDS. What should be done in case of contact? How should HF be recycled? 2. What are PEL-TWA, PEL-STEL, and PEL-C? 3. What are the applications of thermoelectric effect? 4. Check out the 18 -inch wafer in EE 2 -220. 5. Please draw the diamond structure, and list at least 5 materials with the diamond structure. 6. For (100), (110), and (111) Si, what are the orientations of fracture plane (斷裂面) and the directions along fraction plane? 15

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Chap 10 Etching and implantation Wet etching EtchingChap 10 Etching and implantation Wet etching Etching
Chap 10 Etching and implantation Wet etching EtchingChap 10 Etching and implantation Wet etching Etching
IC Wafer Cutting Wafer Reduce Oxidization Etching DiffusionIC Wafer Cutting Wafer Reduce Oxidization Etching Diffusion
Lecture 11 0 Etching Etching l Patterned MaterialLecture 11 0 Etching Etching l Patterned Material
Reactive Ion Etching Outline Reactive Ion Etching RIEReactive Ion Etching Outline Reactive Ion Etching RIE
Etching and Cleaning remove contaminated layers Etching removeEtching and Cleaning remove contaminated layers Etching remove
Wet Etching II 3 Steps of Wet EtchingWet Etching II 3 Steps of Wet Etching
ETCHING Etching is used extensively in material processingETCHING Etching is used extensively in material processing
Wet Etching I Introduction Definition of etching TheWet Etching I Introduction Definition of etching The
2 Dry etching Outline Terminology Wet Etching Dry2 Dry etching Outline Terminology Wet Etching Dry
Glass Etching History Glass etching started around theGlass Etching History Glass etching started around the
EDGE EFFECTS IN REACTIVE ION ETCHING THE WAFEREDGE EFFECTS IN REACTIVE ION ETCHING THE WAFER
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APV 25 wafer testing Outline Wafer test procedureAPV 25 wafer testing Outline Wafer test procedure