1 Slurry Flow Analysis and Integrated CMP Model

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1 Slurry Flow Analysis and Integrated CMP Model SFR Workshop November 8, 2000 Zhoujie

1 Slurry Flow Analysis and Integrated CMP Model SFR Workshop November 8, 2000 Zhoujie Mao, David Dornfeld Berkeley, CA 2001 GOAL: Build integrated CMP model for basic mechanical and chemical elements by 9/30/2001. 11/8/2000

2 Motivation • Study the effects of slurry flow on the material removal in

2 Motivation • Study the effects of slurry flow on the material removal in CMP • Develop integrated process model for CMP to provide insight into the MRR and WIWNU • Develop process model for environmental impact analysis for CMP 11/8/2000

3 Overall Picture of Slurry Flow in CMP Side view Carrier Wafer Slurry feeder

3 Overall Picture of Slurry Flow in CMP Side view Carrier Wafer Slurry feeder Polishing plate Carrier film Polishing pad • Two flow stages: slurry flow on the polishing pad, slurry flow between wafer and polishing pad 11/8/2000

4 Slurry Flow on the pad Slurry Abrasive particle Polishing pad • Estimate the

4 Slurry Flow on the pad Slurry Abrasive particle Polishing pad • Estimate the abrasive particle settling mechanism on the polishing pad • Study the effects of slurry supply rate and slurry delivery position on the material removal rate 11/8/2000

5 Architecture of the Integrated Model for Conventional CMP Pad Roughness Pad Hardness Slurry

5 Architecture of the Integrated Model for Conventional CMP Pad Roughness Pad Hardness Slurry Concentration, Abrasive Shape, Density, Size and Distribution Down Pressure Slurry Chemicals Relative Velocity Chemical Reaction Model of Material Active Abrasive Removal VOL by a Single Abrasive Number N Wafer Hardness Fluid Model Physical Mechanism; MRR: N VOL Preston’s Coefficient Ke 11/8/2000 Contact Pressure Model Pressure and Velocity Distribution Model (FEA and Dynamics) RR 0 Dishing & Erosion Surface Damage Wafer, Pattern, Pad and Polishing Head Geometry and Material WIWNU MRR WIDNU

6 Abrasive Particle Settling Rate Vs. Slurry Supply Rate 11/8/2000

6 Abrasive Particle Settling Rate Vs. Slurry Supply Rate 11/8/2000

7 Abrasive Particle Settling Rate Vs. Delivery Position Eccentricity 11/8/2000

7 Abrasive Particle Settling Rate Vs. Delivery Position Eccentricity 11/8/2000

8 Integrated Slurry Flow Model • • Slurry flow between wafer and polishing pad

8 Integrated Slurry Flow Model • • Slurry flow between wafer and polishing pad Slurry flow inside polishing pad Deformation of wafer Deformation of polishing pad h(x) hp(x) Pad 11/8/2000

9 2003 Goals Develop comprehensive chemical and mechanical model. Perform experimental and metrological validation,

9 2003 Goals Develop comprehensive chemical and mechanical model. Perform experimental and metrological validation, by 9/30/2003. • Simulation of Integrated CMP model • Experimental verification of integrated CMP model (role of active abrasives in mechanical material removal) 11/8/2000