071007 1 Forward Vertex Detector Overview Technical Design

07/10/07 2 Forward Vertex Detector Technical Design – Specifications • Cover the Muon Spectrometer

07/10/07 3 Forward Vertex Detector Technical Design – Mechanical “Big Wheel” Location for all

07/10/07 4 Forward Vertex Detector Technical Design – Mechanical Each Endcap 4 hermetic disks,

07/10/07 5 Forward Vertex Detector Technical Design – Mechanical Integration with the Barrel VTX

07/10/07 6 Forward Vertex Detector Technical Design – Wedge Connectors for extension cables Screw

07/10/07 7 Forward Vertex Detector FVTX Sensor HDI Sensor • Sensor HDI – –

07/10/07 8 Sensor layout R&D prototyping design Zoom in … Thickness 300 µm Doping

07/10/07 9 Sensor R&D A real prototype Vaclav Vrba, Prague D. M. Lee, LANL

07/10/07 10 Forward Vertex Detector HDI Stack Up HDI-High Density Interconnect kapton glue GND

07/10/07 11 Wedge R&D Analysis Temperature & Stress Max deflection 10. 4μm Min Tº

07/10/07 12 Forward Vertex Detector Half-Disk Assembly: Details Single piece plastic insert for screws

07/10/07 13 Disk-Level R&D Modeling Thermal distortion Max deflection of detector ~8μm Distortion due

07/10/07 14 Half Cage Assembly Y Cooling hose (silicone) Al Honeycomb core, C face

07/10/07 Liquid Cooling Circuit R&D Outlet plane 4: 10. 3°C Outlet plane 2: 10.

07/10/07 16 Half Cage Assembly R&D Gravity Sag (Max = 3. 2µm) Drum mode

07/10/07 17 VTX+FVTX Finite Element Model R&D First Mode: 38 Hz D. M. Lee,

07/10/07 VTX – FVTX Integration The need began 2 years ago But we found

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07/10/07 1 Forward Vertex Detector Overview • Technical Design Overview • Design status D. M. Lee, LANL

07/10/07 2 Forward Vertex Detector Technical Design – Specifications • Cover the Muon Spectrometer Acceptance – both Arms (10 -35 deg) • Full Azimuthal coverage – hermetic • DCA resolution < 200 µm at 5 Ge. V • ≥ 3 space points / track • Maximum Radiation Length < 2. 4% • Survive 10 year integrated dose = 200 k Rad • Low Occupancy in Au – Au Central < 10. 0% • Co-exist with barrel VTX • Compatible with PHENIX DAQ D. M. Lee, LANL

07/10/07 3 Forward Vertex Detector Technical Design – Mechanical “Big Wheel” Location for all readout electronics Combined VTX + FVTX without outer enclosure FVTX D. M. Lee, LANL

07/10/07 4 Forward Vertex Detector Technical Design – Mechanical Each Endcap 4 hermetic disks, z=18. 5 – 38 cm 48 wedge segments per disk ( 7. 5 deg) Inner disk radius = 3. 5 cm (4. 5 cm active) Outer disk radius = 17 cm 75 micron strips, 550, 000 strips/endcap Total power load of disks = 50 W each Power load of Readout cards= 450 W in big wheel Room temperature operation D. M. Lee, LANL

07/10/07 5 Forward Vertex Detector Technical Design – Mechanical Integration with the Barrel VTX Fully integrated model D. M. Lee, LANL

07/10/07 6 Forward Vertex Detector Technical Design – Wedge Connectors for extension cables Screw (nylon) Backplane HDI Detector HDI FPHX Chips Pin hole (for alignment) Detector FPIX Chips (26, 13 ea. side) Backplane (0. 76 mm graphite fiber composite) All bonded with rigid epoxies Screw (nylon) Pin hole (for alignment) Rigid, thermally conductive epoxy Rigid epoxy D. M. Lee, LANL

07/10/07 7 Forward Vertex Detector FVTX Sensor HDI Sensor • Sensor HDI – – – 2 columns of strips 1664 strips per column strip length 2. 8 to 11. 2 mm 75 µm spacing 48 wedges per disk (7. 5˚/sensor, ~15˚/wedge) – 0. 5 mm overlap with adjacent wedges Mini-strips are oriented to approximate an arc • FPHX Chip – – 1 column readout 128 channels ~ 70 µm channel spacing Dimensions – 9 mm x 1. 2 mm FPHX Chips (13 per column) D. M. Lee, LANL

07/10/07 8 Sensor layout R&D prototyping design Zoom in … Thickness 300 µm Doping of starting material n type Resistivity 2 -5 K -cm Wafer diameter preferred Passivation one FPHX chip 6“ Si. O or Si. N bonding pads testing pads (both staged) Vaclav Vrba, Prague Guard ring Dicing edge D. M. Lee, LANL

07/10/07 9 Sensor R&D A real prototype Vaclav Vrba, Prague D. M. Lee, LANL

07/10/07 10 Forward Vertex Detector HDI Stack Up HDI-High Density Interconnect kapton glue GND • glue kapton glue Signal glue High Density Interconnect (HDI) – kapton flat cable to transfer data from the chip to the readout electronics – – 176 μm thick 4 copper planes (ground, power, 2 ea signal), 5 Kapton films, 8 glue layers kapton glue Power glue kapton HDI trace count 2 R/O lines x LVDS pair x 26 chips 4 Download and Reset lines 2 Clocks x LVDS pair 1 Calibration line 104 4 4 1 113 D. M. Lee, LANL

07/10/07 11 Wedge R&D Analysis Temperature & Stress Max deflection 10. 4μm Min Tº = 15ºC Max Tº = 20. 3ºC Warmest ROC 3 -D Temperature Contour • Zero deflection (boundary conditions) 3 -D Distortion Contour Warmest FPHX Chip is 5. 3ºC Warmer than Back Edge of Backplane D. M. Lee, LANL

07/10/07 12 Forward Vertex Detector Half-Disk Assembly: Details Single piece plastic insert for screws and pins Standoff plate Thermally conductive Silicone Plastic inserts for screws and pins Foam core Honeycomb core D. M. Lee, LANL

07/10/07 13 Disk-Level R&D Modeling Thermal distortion Max deflection of detector ~8μm Distortion due to cooling Fundamental vibration mode: 164 Hz D. M. Lee, LANL

07/10/07 14 Half Cage Assembly Y Cooling hose (silicone) Al Honeycomb core, C face sheets Station 4 Station 3 Station 2 Station 1 Z D. M. Lee, LANL

07/10/07 Liquid Cooling Circuit R&D Outlet plane 4: 10. 3°C Outlet plane 2: 10. 9°C station 2: ~21. 2°C station 4: ~20. 6°C Warmest Chip, station 1: ~21. 4°C FVTX Outlet: 11. 1°C, ~3 psig station 3: ~20. 9°C Outlet plane 3: 10. 6°C FVTX Inlet: 10°C, ~5 psig D. M. Lee, LANL 15

07/10/07 16 Half Cage Assembly R&D Gravity Sag (Max = 3. 2µm) Drum mode shape (f=137. 7 Hz) D. M. Lee, LANL

07/10/07 17 VTX+FVTX Finite Element Model R&D First Mode: 38 Hz D. M. Lee, LANL

07/10/07 18 Assembly D. M. Lee, LANL

07/10/07 19 Disk Detail D. M. Lee, LANL

07/10/07 VTX – FVTX Integration The need began 2 years ago But we found this 2 months ago 20 Interference! D. M. Lee, LANL